GE424CIXJ44JB

Description:	SOC GX 28nm BGA
Manufacturer:	Advanced Micro Devices, Inc.
Introduction date:	Jun 3, 2014
Last Updated Date: +90
See moreApplication Processors and SOCs by Advanced Micro Devices, Inc.

Online version: https://www.datasheets.com/en/part-details/ge424cixj44jb-advanced-micro-devices--inc--56602019

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycle

Premium

EU RoHS

Yes

RoHS Version

2011/65/EU, 2015/863

ECCN

5A992.c

Automotive

Supplier Cage Code

6Z9Z3

HTSUSA

8542310001

Schedule B

8542310000

Taxonomy Path
Semiconductor > Embedded Controllers and Systems > Embedded Systems > Application Processors and SOCs

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Datasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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Datasheet Preview

Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

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Basic Package Type

Package Family Name

Supplier Package

Package Description

Lead Shape

Pin Count

PCB

Tab

Package Length (mm)

Package Width (mm)

Package Height (mm)

Package Diameter (mm)

Package Material

Mounting

Package Outline

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

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MSL

Maximum Reflow Temperature (°C)

Reflow Solder Time (Sec)

Reflow Temp. Source

Maximum Wave Temperature (°C)

Wave Solder Time (Sec)

Wave Temp. Source

Lead Finish(Plating)

Under Plating Material

Terminal Base Material

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

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Product Line

Minimum Storage Temperature

Maximum Storage Temperature

Data Memory Size

Maximum Expanded Memory Size

PWM

Watchdog

Maximum Power Dissipation

Solutions

ISM Band

Supplier Temperature Grade

Temperature Flag

Supported PMIC Devices

External Memory Interface

External Memory Speed

Tradename

Data Cache Size

Instruction Cache Size

Display Interface

PCI

Family Name

Type

Core Architecture

Device Core

Maximum Clock Rate

Data Bus Width

Maximum Speed

Program Memory Type

Program Memory Size

Minimum Operating Supply Voltage

RAM Size

Number of ADCs

ADC Channels

ADC Resolution

Number of DACs

DAC Channels

DAC Resolution

Typical Operating Supply Voltage

Maximum Operating Supply Voltage

Number of Programmable I/Os

Application

Processing Unit

Ethernet Interface Type

Ethernet Speed

Interface Type

SPI

I2C

I2S

UART

USB

USART

CAN

Ethernet

Number of Timers

Programmability

Process Technology

Minimum Operating Temperature

Maximum Operating Temperature

GE424CIXJ44JB

Manufacturer:Advanced Micro Devices, Inc.

Tools/Calculators

GE424CIXJ44JB

Description:

SOC GX 28nm BGA

Manufacturer:

Advanced Micro Devices, Inc.

Introduction date:

Overview

Datasheet

Datasheet Preview

Package

Manufacturing

Parametric

GE424CIXJ44JB