Search Results for &quot; ADAU1301-02C-WF &quot;

ANALOG DEVICES EVAL-ADAU1361Z EVAL BOARD FOR ADAU1361

Volume Production

Evaluation Kit: Yes

Interface: I2C, USB

Lead Free: Contains Lead

Mount: Cable

EVAL-ADAU1381Z

ANALOG DEVICES EVAL-ADAU1381Z EVAL BOARD FOR ADAU1381

Volume Production

Evaluation Kit: Yes

Interface: I2C, USB

Lead Free: Contains Lead

Operating Supply Voltage: 3.3V

ADAU1361BCPZ

Audio CODEC 2ADC/2DAC, 32-Pin LFCSP, Industrial

CSP

Active

Max Operating Temperature: 85

Number of Terminals: 32

Min Operating Temperature: -40

Terminal Position: QUAD

ADAU1381BCPZ

2ADC/2DAC Audio CODEC, 24-bit, 96ksps, LFCSP EP, 32-Pin

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: CSP

Package/Case: LFCSP EP

Package Description: Lead Frame Chip Scale Package, Exposed Pad

ADAU1372BCPZ

Quad ADC, Dual DAC, Low Latency, Low Power Codec

HVQCCN,

Active

Max Operating Temperature: 85

Number of Terminals: 40

Min Operating Temperature: -40

Terminal Position: QUAD

ADAU1382BCPZ

24-bit 2ADC/2DAC Voiceband Codec, 32-Pin LFCSP EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: CSP

Package/Case: LFCSP EP

Package Description: Lead Frame Chip Scale Package, Exposed Pad

ADAU1328BSTZ

24b 192kHz Audio CODEC, 2ADC/8DAC, SPI/I2S, LQFP

QFP

Active

Package/Case: LQFP

Contact Plating: Tin, Matte

Frequency: 192kHz

Height: 1.45mm

ADAU1382BCPZ-R7

24-bit 2ADC/2DAC Voiceband Audio CODEC, 32-Pin LFCSP EP, 96ksps

Non-Lead-Frame SMT

Unconfirmed

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: CSP

Package/Case: LFCSP EP

Package Description: Lead Frame Chip Scale Package, Exposed Pad

ADAU1328BSTZ-RL

2 ADC/8 DAC with PLL, 192 kHz, 24-Bit Codec

LFQFP,

Obsolete

Package/Case: LQFP

Interface: SPI, Serial, I2S, 4-WIRE

Lead Free: Contains Lead

Max Operating Temperature: 85°C

+16

ADAU1381BCBZ-RL

24-Bit 2ADC/2DAC Audio CODEC, 96ksps, 105dB SNR, WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

ADAU1361BCPZ-RL

Stereo, Low Power, 96 kHz, 24-Bit Audio Codec with Integrated PLL

HVQCCN, LCC32,.2SQ,20

Active

Package/Case: LFCSP EP

Contact Plating: Tin, Matte

Interface: I2C, SPI, Serial

Lead Free: Contains Lead

+14

ADAU1373BCBZ-R7

Low Power Codec with Speaker and Headphone Amplifier

4.05 X 3.82 MM, 0.40 MM PITCH, ROHS COMPLIANT, WLCSP-81

Obsolete

Interface: I2C, Serial

Lead Free: Contains Lead

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

+13

ADAU1381BCPZ-RL

24-bit 2ch Audio CODEC, 2ADC/2DAC, 96ksps, LFCSP EP

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: CSP

Package/Case: LFCSP EP

Package Description: Lead Frame Chip Scale Package, Exposed Pad

ADAU1361BCPZ-R7

24-Bit 96kHz Audio Codec IC, Stereo, 2 ADCs/2 DACs, I2C/SPI

HVQCCN, LCC32,.2SQ,20

Active

Package/Case: LFCSP EP

Contact Plating: Tin, Matte

Interface: I2C, SPI, Serial

Lead Free: Contains Lead

+15

ADAU1373BCBZ-RL

Low Power Codec with Speaker and Headphone Amplifier

4.05 X 3.82 MM, 0.40 MM PITCH, ROHS COMPLIANT, WLCSP-81

Obsolete

Interface: I2C, Serial

Lead Free: Contains Lead

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

+10

ADAU1381BCPZ-RL7

24-bit 2ADC/2DAC Audio CODEC, 96ksps, 105dB SNR, LFCSP EP

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: CSP

Package/Case: LFCSP EP

Package Description: Lead Frame Chip Scale Package, Exposed Pad

ADAU1381BCBZ-RL7

2ADC/2DAC Audio Codec, 24-bit, 96ksps, 30-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

ADAU1372BCPZRL

Quad ADC, Dual DAC, Low Latency, Low Power Codec

HVQCCN,

Active

Max Operating Temperature: 85

Number of Terminals: 40

Min Operating Temperature: -40

Terminal Position: QUAD

ADAU1592ACPZ

Class-D Audio Amp, 18W, 101dB SNR, 37dB Gain, LFCSP EP

HVQCCN, LCC48,.27SQ,20

Not Recommended

Package/Case: LFCSP EP

Contact Plating: Tin, Matte

Dual Supply Voltage: 15V

Efficiency: 87%

+21

ADAU1702JSTZ

SigmaDSP® 28-/56-Bit Audio Processor with Two ADCs and Four DACs

LFQFP, QFP48,.35SQ,20

Active

Package/Case: LQFP

Contact Plating: Tin, Matte

Frequency: 25MHz

Height: 1.4mm

+19

Search Results for "ADAU1301-02C-WF"

Filters

EVAL-ADAU1361Z

ANALOG DEVICES EVAL-ADAU1361Z EVAL BOARD FOR ADAU1361

Volume Production

Evaluation Kit: Yes

Interface: I2C, USB

Lead Free: Contains Lead

Mount: Cable

EVAL-ADAU1381Z

ANALOG DEVICES EVAL-ADAU1381Z EVAL BOARD FOR ADAU1381

Volume Production

Evaluation Kit: Yes

Interface: I2C, USB

Lead Free: Contains Lead

Operating Supply Voltage: 3.3V

ADAU1361BCPZ

Audio CODEC 2ADC/2DAC, 32-Pin LFCSP, Industrial

CSP

Active

Max Operating Temperature: 85

Number of Terminals: 32

Min Operating Temperature: -40

Terminal Position: QUAD

ADAU1381BCPZ

2ADC/2DAC Audio CODEC, 24-bit, 96ksps, LFCSP EP, 32-Pin

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: CSP

Package/Case: LFCSP EP

Package Description: Lead Frame Chip Scale Package, Exposed Pad

ADAU1372BCPZ

Quad ADC, Dual DAC, Low Latency, Low Power Codec

HVQCCN,

Active

Max Operating Temperature: 85

Number of Terminals: 40

Min Operating Temperature: -40

Terminal Position: QUAD

ADAU1382BCPZ

24-bit 2ADC/2DAC Voiceband Codec, 32-Pin LFCSP EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: CSP

Package/Case: LFCSP EP

Package Description: Lead Frame Chip Scale Package, Exposed Pad

ADAU1328BSTZ

24b 192kHz Audio CODEC, 2ADC/8DAC, SPI/I2S, LQFP

QFP

Active

Package/Case: LQFP

Contact Plating: Tin, Matte

Frequency: 192kHz

Height: 1.45mm

ADAU1382BCPZ-R7

24-bit 2ADC/2DAC Voiceband Audio CODEC, 32-Pin LFCSP EP, 96ksps

Non-Lead-Frame SMT

Unconfirmed

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: CSP

Package/Case: LFCSP EP

Package Description: Lead Frame Chip Scale Package, Exposed Pad

ADAU1328BSTZ-RL

2 ADC/8 DAC with PLL, 192 kHz, 24-Bit Codec

LFQFP,

Obsolete

Package/Case: LQFP

Interface: SPI, Serial, I2S, 4-WIRE

Lead Free: Contains Lead

Max Operating Temperature: 85°C

+16

ADAU1381BCBZ-RL

24-Bit 2ADC/2DAC Audio CODEC, 96ksps, 105dB SNR, WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

ADAU1361BCPZ-RL

Stereo, Low Power, 96 kHz, 24-Bit Audio Codec with Integrated PLL

HVQCCN, LCC32,.2SQ,20

Active

Package/Case: LFCSP EP

Contact Plating: Tin, Matte

Interface: I2C, SPI, Serial

Lead Free: Contains Lead

+14

ADAU1373BCBZ-R7

Low Power Codec with Speaker and Headphone Amplifier

4.05 X 3.82 MM, 0.40 MM PITCH, ROHS COMPLIANT, WLCSP-81

Obsolete

Interface: I2C, Serial

Lead Free: Contains Lead

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

+13

ADAU1381BCPZ-RL

24-bit 2ch Audio CODEC, 2ADC/2DAC, 96ksps, LFCSP EP

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: CSP

Package/Case: LFCSP EP

Package Description: Lead Frame Chip Scale Package, Exposed Pad

ADAU1361BCPZ-R7

24-Bit 96kHz Audio Codec IC, Stereo, 2 ADCs/2 DACs, I2C/SPI

HVQCCN, LCC32,.2SQ,20

Active

Package/Case: LFCSP EP

Contact Plating: Tin, Matte

Interface: I2C, SPI, Serial

Lead Free: Contains Lead

+15

ADAU1373BCBZ-RL

Low Power Codec with Speaker and Headphone Amplifier

4.05 X 3.82 MM, 0.40 MM PITCH, ROHS COMPLIANT, WLCSP-81

Obsolete

Interface: I2C, Serial

Lead Free: Contains Lead

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

+10

ADAU1381BCPZ-RL7

24-bit 2ADC/2DAC Audio CODEC, 96ksps, 105dB SNR, LFCSP EP

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: CSP

Package/Case: LFCSP EP

Package Description: Lead Frame Chip Scale Package, Exposed Pad

ADAU1381BCBZ-RL7

2ADC/2DAC Audio Codec, 24-bit, 96ksps, 30-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

ADAU1372BCPZRL

Quad ADC, Dual DAC, Low Latency, Low Power Codec

HVQCCN,

Active

Max Operating Temperature: 85

Number of Terminals: 40

Min Operating Temperature: -40

Terminal Position: QUAD

ADAU1592ACPZ

Class-D Audio Amp, 18W, 101dB SNR, 37dB Gain, LFCSP EP

HVQCCN, LCC48,.27SQ,20

Not Recommended

Package/Case: LFCSP EP

Contact Plating: Tin, Matte

Dual Supply Voltage: 15V

Efficiency: 87%

+21

ADAU1702JSTZ

SigmaDSP® 28-/56-Bit Audio Processor with Two ADCs and Four DACs