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Buffers & Line Drivers AMB

End of Life

Package/Case: FCBGA

Contact Plating: Copper, Tin, Silver

Data Rate: 4.8Gbps

Lead Free: Contains Lead

655-Ball Grid Array Flip Chip BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FCBGA

Package Description: Flip Chip Ball Grid Array

Advanced Memory Buffer for FB-DIMM Modules

Obsolete

Package/Case: FCBGA

Contact Plating: Copper, Tin, Silver

Data Rate: 4.8Gbps

Lead Free: Contains Lead

Buffers & Line Drivers AMB

End of Life

Package/Case: FCBGA

Data Rate: 4.8Gbps

Lead Free: Contains Lead

Length: 24.5mm