Search Results for &quot; M24128-BWDW6TP &quot;

128Kb I2C EEPROM, 400kHz, 450ns Access, TSSOP

TSSOP-8

Not Recommended

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: TSSOP

Density: 128Kb

M24128-BWDW6T

16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.169 INCH, TSSOP-8

0.169 INCH, TSSOP-8

Obsolete

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: TSSOP

Density: 128Kb

+18

M24256-BWDW6TP

256Kb I2C EEPROM, 450ns, 1MHz, TSSOP, 5.5V

ROHS COMPLIANT, TSSOP-8

Not Recommended

Access Time: 450ns

Access Time-Max: 450ns

Package/Case: TSSOP

Density: 256Kb

M24128-BWMN6

16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8

0.150 INCH, PLASTIC, SOP-8

Obsolete

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 128Kb

M24128-BWMC6G

128Kbit Serial-I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BWCS6P/K

128Kbit Serial-I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BN6

16KX8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, PLASTIC, DIP-8

0.25 MM LEAD FRAME, PLASTIC, DIP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BWMN6P

128Kb I2C EEPROM, 400kHz, SOIC, 2.5-5.5V

SOP, SOP8,.25

Not Recommended

Access Time: 900ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 128Kb

M24128-BWMC6P

128Kbit I2C EEPROM, 8-Pin UFDFPN, 3.3V/5V, 1MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BWMN6T

16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8

0.150 INCH, PLASTIC, SOP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BWCS6G/K

128Kb Serial I2C EEPROM, 8-Pin WLCSP, 3.3V/5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BWCS6TP/K

128Kb Serial-I2C EEPROM, 8-Pin WLCSP, 3.3V/5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BWMC6TP

128Kbit Serial-I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin UFDFPN SMT

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BWMN3TP/P

128Kbit I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin SOIC, 0.4MHz

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

+26

M24128-BWCS6TG/K

128Kbit I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BWMC6TG

128Kbit Serial-I2C EEPROM, 8-Pin UFDFPN, 3.3V/5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-WMN6

16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8

0.150 INCH, PLASTIC, SO-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BWMN6TP

128Kb I2C EEPROM, 1MHz, SOIC, 2.5-5.5V

SOP-8

Not Recommended

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 128Kb

M24128-MN6T

16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8

0.150 INCH, PLASTIC, SO-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BRDW6TP

128Kb I2C EEPROM, 900ns Access, 400kHz, TSSOP

TSSOP,

Active

Access Time: 900ns

Access Time-Max: 900ns

Package/Case: TSSOP

Density: 128Kb

Search Results for "M24128-BWDW6TP"

Filters

M24128-BWDW6TP

128Kb I2C EEPROM, 400kHz, 450ns Access, TSSOP

TSSOP-8

Not Recommended

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: TSSOP

Density: 128Kb

M24128-BWDW6T

16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.169 INCH, TSSOP-8

0.169 INCH, TSSOP-8

Obsolete

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: TSSOP

Density: 128Kb

+18

M24256-BWDW6TP

256Kb I2C EEPROM, 450ns, 1MHz, TSSOP, 5.5V

ROHS COMPLIANT, TSSOP-8

Not Recommended

Access Time: 450ns

Access Time-Max: 450ns

Package/Case: TSSOP

Density: 256Kb

M24128-BWMN6

16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8

0.150 INCH, PLASTIC, SOP-8

Obsolete

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 128Kb

M24128-BWMC6G

128Kbit Serial-I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BWCS6P/K

128Kbit Serial-I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BN6

16KX8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, PLASTIC, DIP-8

0.25 MM LEAD FRAME, PLASTIC, DIP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BWMN6P

128Kb I2C EEPROM, 400kHz, SOIC, 2.5-5.5V

SOP, SOP8,.25

Not Recommended

Access Time: 900ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 128Kb

M24128-BWMC6P

128Kbit I2C EEPROM, 8-Pin UFDFPN, 3.3V/5V, 1MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BWMN6T

16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8

0.150 INCH, PLASTIC, SOP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BWCS6G/K

128Kb Serial I2C EEPROM, 8-Pin WLCSP, 3.3V/5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BWCS6TP/K

128Kb Serial-I2C EEPROM, 8-Pin WLCSP, 3.3V/5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BWMC6TP

128Kbit Serial-I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin UFDFPN SMT

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BWMN3TP/P

128Kbit I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin SOIC, 0.4MHz

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

+26

M24128-BWCS6TG/K

128Kbit I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BWMC6TG

128Kbit Serial-I2C EEPROM, 8-Pin UFDFPN, 3.3V/5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-WMN6

16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8

0.150 INCH, PLASTIC, SO-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BWMN6TP

128Kb I2C EEPROM, 1MHz, SOIC, 2.5-5.5V

SOP-8

Not Recommended

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 128Kb

M24128-MN6T

16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8

0.150 INCH, PLASTIC, SO-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BRDW6TP

128Kb I2C EEPROM, 900ns Access, 400kHz, TSSOP

TSSOP,

Active

Access Time: 900ns

Access Time-Max: 900ns

Package/Case: TSSOP

Density: 128Kb