Search Results for &quot; MCIMX353DVM5B &quot;

SPECIALTY CONSUMER CIRCUIT, PBGA400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Active

Max Operating Temperature: 70

Number of Terminals: 400

Min Operating Temperature: -20

Terminal Position: BOTTOM

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

SoC i.MX35 ARM1136JF-S 532MHz 32-bit 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

i.MX35 SoC, ARM1136JF-S, 532MHz, 32-bit, MAP-BGA 400-Pin

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

LFBGA,

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX353CVM5B

SPECIALTY CONSUMER CIRCUIT, PBGA400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Active

Max Operating Temperature: 85

Number of Terminals: 400

Min Operating Temperature: -40

Terminal Position: BOTTOM

400-Pin PBGA Industrial Microprocessor IC, 17x17mm

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

i.MX35 SoC, ARM1136JF-S, 532MHz, 32-bit, 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

MCIMX353CJQ4C

SoC i.MX35 ARM1136JF-S 400MHz 32-bit 128KB RAM 400-Pin MAP-BGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

+36

MCIMX353CJQ5CR2

i.MX35 SoC, ARM1136JF-S, 532MHz, 32-bit, 400-Pin MAP-BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX35WPDK

FREESCALE SEMICONDUCTOR MCIMX35WPDK I.MX35, WINCE 6.0, PRODUCT DEV KIT

Obsolete

Core Architecture: ARM

Evaluation Kit: Yes

Lead Free: Lead Free

Mount: Hardware

MCIMX35LPDK

Development Boards & Kits - ARM I.MX35 PRODUCT DEVELOPME

Not Recommended for New Design

Core Architecture: ARM

Evaluation Kit: Yes

Interface: USB, CAN, Ethernet

Number of Bits: 32

SPECIALTY CONSUMER CIRCUIT, PBGA400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Active

Max Operating Temperature: 70

Number of Terminals: 400

Min Operating Temperature: -20

Terminal Position: BOTTOM

SPECIALTY CONSUMER CIRCUIT, PBGA400, 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

LFBGA,

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX351AVM4B

SPECIALTY CONSUMER CIRCUIT, PBGA400, 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX355AJM5B

SoC i.MX35 ARM1136JF-S 532MHz 32-bit 400-Pin BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

SoC i.MX35 ARM1136JF-S 532MHz 32-bit 128KB RAM 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

MCIMX357CVM5B

SPECIALTY CONSUMER CIRCUIT, PBGA400

LFBGA, BGA400,20X20,32

Active

Max Operating Temperature: 85

Number of Terminals: 400

Min Operating Temperature: -40

Terminal Position: BOTTOM

Search Results for "MCIMX353DVM5B"

Filters

SPECIALTY CONSUMER CIRCUIT, PBGA400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Active

Max Operating Temperature: 70

Number of Terminals: 400

Min Operating Temperature: -20

Terminal Position: BOTTOM

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

SoC i.MX35 ARM1136JF-S 532MHz 32-bit 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

i.MX35 SoC, ARM1136JF-S, 532MHz, 32-bit, MAP-BGA 400-Pin

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

LFBGA,

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX353CVM5B

SPECIALTY CONSUMER CIRCUIT, PBGA400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Active

Max Operating Temperature: 85

Number of Terminals: 400

Min Operating Temperature: -40

Terminal Position: BOTTOM

400-Pin PBGA Industrial Microprocessor IC, 17x17mm

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

i.MX35 SoC, ARM1136JF-S, 532MHz, 32-bit, 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

MCIMX353CJQ4C

SoC i.MX35 ARM1136JF-S 400MHz 32-bit 128KB RAM 400-Pin MAP-BGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

+36

MCIMX353CJQ5CR2

i.MX35 SoC, ARM1136JF-S, 532MHz, 32-bit, 400-Pin MAP-BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX35WPDK

FREESCALE SEMICONDUCTOR MCIMX35WPDK I.MX35, WINCE 6.0, PRODUCT DEV KIT

Obsolete

Core Architecture: ARM

Evaluation Kit: Yes

Lead Free: Lead Free

Mount: Hardware

MCIMX35LPDK

Development Boards & Kits - ARM I.MX35 PRODUCT DEVELOPME

Not Recommended for New Design

Core Architecture: ARM

Evaluation Kit: Yes

Interface: USB, CAN, Ethernet

Number of Bits: 32

SPECIALTY CONSUMER CIRCUIT, PBGA400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Active

Max Operating Temperature: 70

Number of Terminals: 400

Min Operating Temperature: -20

Terminal Position: BOTTOM

SPECIALTY CONSUMER CIRCUIT, PBGA400, 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

LFBGA,

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX351AVM4B

SPECIALTY CONSUMER CIRCUIT, PBGA400, 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX355AJM5B

SoC i.MX35 ARM1136JF-S 532MHz 32-bit 400-Pin BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

SoC i.MX35 ARM1136JF-S 532MHz 32-bit 128KB RAM 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

MCIMX357CVM5B

SPECIALTY CONSUMER CIRCUIT, PBGA400

LFBGA, BGA400,20X20,32

Active

Max Operating Temperature: 85

Number of Terminals: 400

Min Operating Temperature: -40

Terminal Position: BOTTOM