Search Results for &quot; MPC7410HX450LE &quot;

32-BIT, 450MHz, RISC PROCESSOR, CBGA360

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

Obsolete

Package/Case: BGA

Core Architecture: PowerPC

Data Bus Width: 64b

Frequency: 450MHz

1-Core 32-Bit PowerPC Microprocessor 400MHz 1.7-1.9V Surface Mount

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

Obsolete

Core Architecture: PowerPC

Data Bus Width: 32b

Frequency: 400MHz

Halogen Free: Halogen Free

32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

Transferred

Number of Terminals: 360

Terminal Position: BOTTOM

JEDEC Package Code: S-CBGA-B360

Width: 25

NT HITCE RV1.4

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

Transferred

Number of Terminals: 360

Terminal Position: BOTTOM

JEDEC Package Code: S-CBGA-B360

Width: 25

32-BIT, 450MHz, RISC PROCESSOR, CBGA360

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

Obsolete

Number of Terminals: 360

Terminal Position: BOTTOM

JEDEC Package Code: S-CBGA-B360

Width: 25

MPC7410THX450LE

RISC Microprocessor

BGA

Obsolete

Max Operating Temperature: 105

Min Operating Temperature: -40

Terminal Position: BOTTOM

JEDEC Package Code: R-PBGA-B

Search Results for "MPC7410HX450LE"

Filters

MPC7410HX450LE

32-BIT, 450MHz, RISC PROCESSOR, CBGA360

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

Obsolete

Package/Case: BGA

Core Architecture: PowerPC

Data Bus Width: 64b

Frequency: 450MHz

1-Core 32-Bit PowerPC Microprocessor 400MHz 1.7-1.9V Surface Mount

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

Obsolete

Core Architecture: PowerPC

Data Bus Width: 32b

Frequency: 400MHz

Halogen Free: Halogen Free

32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

Transferred

Number of Terminals: 360

Terminal Position: BOTTOM

JEDEC Package Code: S-CBGA-B360

Width: 25

NT HITCE RV1.4

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

Transferred

Number of Terminals: 360

Terminal Position: BOTTOM

JEDEC Package Code: S-CBGA-B360

Width: 25

32-BIT, 450MHz, RISC PROCESSOR, CBGA360

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

Obsolete

Number of Terminals: 360

Terminal Position: BOTTOM

JEDEC Package Code: S-CBGA-B360

Width: 25

MPC7410THX450LE

RISC Microprocessor