Search Results for &quot; PEF22504EV2.1-G &quot;

IC LIU E1/T1/J1 160LBGA

Obsolete

Package/Case: LBGA

Lead Free: Contains Lead

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Intel

Framer and Line Interface Component for Long- and Short-Haul Applications

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

Telecom Interface ICs T/E

Volume Production

Packaging: Tray

IC LIU E1/T1/J1 160BGA

Obsolete

Package/Case: LBGA

Data Rate: 2.048Mbps

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

PEF22554EV2.1-G

Volume Production

Radiation Hardening: No

Telecom Interface ICs T/E

Obsolete

Package Quantity: 119

Packaging: Tray

Search Results for "PEF22504EV2.1-G"

Filters

PEF22504EV2.1-G

IC LIU E1/T1/J1 160LBGA

Obsolete

Package/Case: LBGA

Lead Free: Contains Lead

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Intel

Framer and Line Interface Component for Long- and Short-Haul Applications

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

Telecom Interface ICs T/E

Volume Production

Packaging: Tray

IC LIU E1/T1/J1 160BGA

Obsolete

Package/Case: LBGA

Data Rate: 2.048Mbps

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

PEF22554EV2.1-G

Volume Production

Radiation Hardening: No

Telecom Interface ICs T/E