Search Results for &quot; PNX1301EH557 &quot;

IC MEDIA PROC 180MHZ 292-HBGA

Obsolete

Package/Case: HBGA

Interface: I2C, Serial, 2-Wire

Max Operating Temperature: 85°C

Min Operating Temperature: 0°C

Video and Media Processor

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: HBGA

Package Description: High Performance Ball Grid Array

Trident Microsystems

IC Media Proc 180MHZ 292-HBGA

Volume Production

Package/Case: HBGA

Packaging: Tray

PNX1701EH,557

PNX1701EH,557

Volume Production

RoHS Compliant: No

PNX1300EH,557

Volume Production

PNX1300EH,557

Obsolete

RoHS Compliant: No

Video and Media Processor

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: HBGA

Package Description: High Performance Ball Grid Array

IC MEDIA PROC 200MHZ 292-HBGA

Obsolete

Package/Case: HBGA

Interface: I2C, Serial, 2-Wire

Max Operating Temperature: 85°C

Min Operating Temperature: 0°C

Search Results for "PNX1301EH557"

Filters

IC MEDIA PROC 180MHZ 292-HBGA

Obsolete

Package/Case: HBGA

Interface: I2C, Serial, 2-Wire

Max Operating Temperature: 85°C

Min Operating Temperature: 0°C

Video and Media Processor

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: HBGA

Package Description: High Performance Ball Grid Array

Trident Microsystems

IC Media Proc 180MHZ 292-HBGA

Volume Production

Package/Case: HBGA

Packaging: Tray

PNX1701EH,557

PNX1701EH,557

Volume Production

RoHS Compliant: No

PNX1300EH,557

Volume Production

PNX1300EH,557

Obsolete

RoHS Compliant: No

Video and Media Processor

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: HBGA

Package Description: High Performance Ball Grid Array

IC MEDIA PROC 200MHZ 292-HBGA