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HUAWEI MU509 HSDPA M2M Module

Module Type: HSDPA M2M Module

Form Factor: LGA Package

Downlink Data Rate (Max): 3.6Mbps

Uplink Data Rate (Max): 384kbps

Passive Tunable Integrated Circuits (PTIC), 3.3 pF 6 Bump WLCSP, 4000-REEL

WLCSP-6

Active

Max Operating Temperature: 85

Number of Terminals: 6

Min Operating Temperature: -30

Terminal Position: BOTTOM