Wireless MCU module supports 2.4 GHz Wi-Fi 6, Bluetooth LE, Zigbee 3.0, and Thread over IEEE 802.15.4. The module uses a 32-bit RISC-V single-core processor running up to 160 MHz and includes 4 MB of quad SPI flash in the chip package. It provides 22 GPIOs, a PCB antenna, and a 13.2 mm by 16.6 mm by 2.4 mm module footprint. Operation is specified from 3.0 V to 3.6 V and from -40 °C to 85 °C for the N4 ordering code. The module is RoHS and REACH green-certified.
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| Processor Core | 32-bit RISC-V single-core |
| Maximum CPU Frequency | 160MHz |
| Flash Memory | 4 quad SPIMB |
| ROM | 320KB |
| HP SRAM | 512KB |
| LP SRAM | 16KB |
| GPIO Count | 22 |
| Supply Voltage | 3.0 to 3.6V |
| Operating Ambient Temperature | -40 to 85°C |
| Dimensions | 13.2 x 16.6 x 2.4mm |
| Antenna | On-board PCB antenna |
| Wi-Fi Frequency Range | 2412 to 2484MHz |
| Wi-Fi Standards | IEEE 802.11b/g/n/ax |
| Wi-Fi Data Rate | up to 150Mbps |
| Bluetooth Version | Bluetooth 5.3 LE |
| Bluetooth LE Data Rates | 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps |
| Bluetooth LE Transmit Power Range | -16 to 19dBm |
| IEEE 802.15.4 Frequency Range | 2405 to 2480MHz |
| IEEE 802.15.4 Data Rate | 250Kbps |
| IEEE 802.15.4 Transmit Power Range | -16 to 19dBm |
| Thread Support | Thread 1.3 |
| Zigbee Support | Zigbee 3.0 |
| Deep Sleep Current | 7 typicalµA |
| Moisture Sensitivity Level | MSL 3 |
| RoHS | Compliant |
| REACH | Compliant |
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