Wi-Fi and Bluetooth LE MCU module integrates an ESP32-D0WD dual-core Xtensa LX6 processor running up to 240 MHz. The module includes 4 MB SPI flash, a 40 MHz crystal oscillator, and an on-board PCB antenna. It supports 2.4 GHz 802.11b/g/n Wi-Fi up to 150 Mbps plus Bluetooth v4.2 BR/EDR and Bluetooth LE. Recommended operation is from a 3.0 V to 3.6 V supply across a -40 °C to 85 °C ambient range, and the module is rated MSL 3 with REACH and RoHS green certification.
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| Embedded SoC | ESP32-D0WD |
| CPU core | Xtensa dual-core 32-bit LX6 |
| Maximum CPU frequency | 240MHz |
| ROM | 448KB |
| SRAM | 520KB |
| RTC SRAM | 8KB |
| SPI flash | 4MB |
| Crystal oscillator | 40MHz |
| Antenna | On-board PCB antenna |
| Wi-Fi protocol | 802.11b/g/n |
| Maximum 802.11n bit rate | 150Mbps |
| Operating channel center frequency | 2412 to 2484MHz |
| Bluetooth protocol | Bluetooth v4.2 BR/EDR and Bluetooth LE |
| GPIO | Up to 32 |
| Peripheral interfaces | SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC, TWAI |
| Operating voltage | 3.0 to 3.6V |
| External power supply current capability | 0.5 minimumA |
| Operating ambient temperature | -40 to 85°C |
| Dimensions | 18 × 25.5 × 3.1mm |
| Pins | 38 |
| Moisture sensitivity level | MSL 3 |
| REACH | Compliant |
| RoHS | Compliant |
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