Search Results for &quot; 89HPES16NT2ZBBCG8 &quot;

PCI Express Switch 324-Pin FCBGA Tray

Volume Production

Package/Case: FCBGA

Contact Plating: Copper, Tin, Silver

Interface: PCI Express

Lead Free: Lead Free

89HPES16T4G2ZBBXG8

PCI Interface IC PCI EXPRESS SWITCH

End of Life

Package/Case: LBGA

Contact Plating: Copper, Tin, Silver

Interface: PCI Express

Lead Free: Lead Free

89HPES16T4AG2ALGI8

Renesas

PCIe Gen2 Switch, 16Lanes, 4 Port, 1-CH, 324-Pin FCBGA

Integrated Device Technology

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FCBGA

Package Description: Flip Chip Ball Grid Array

+22

89HPES16T4AG2ZCALG

FCBGA-324, Tray

BGA, BGA324,18X18,40

Transferred

Max Operating Temperature: 70

Number of Terminals: 324

Min Operating Temperature: 0

Terminal Position: BOTTOM

89HPES16T4G2ZABXG8

PCI Interface IC PCI EXPRESS SWITCH

Volume Production

Package/Case: LBGA

Contact Plating: Copper, Tin, Silver

Interface: PCI Express

Lead Free: Lead Free

89HPES12N3YCBC

12-lane, 3-port PCIe I/O Expansion Switch

End of Life

Package/Case: LBGA

Contact Plating: Tin, Lead

Height: 1.4mm

Interface: PCI Express

89HPES12N3YCBCG

12-lane, 3-port PCIe I/O Expansion Switch

End of Life

Package/Case: LBGA

Contact Plating: Copper, Tin, Silver

Interface: PCI Express

Lead Free: Lead Free

89HPES12N3AZCBCG

12-lane, 3-port PCIe I/O Expansion Switch

Volume Production

Package/Case: LBGA

Contact Plating: Copper, Tin, Silver

Interface: PCI Express

Lead Free: Lead Free

89HPES12T3G2ZABC

PCI Interface IC PCI EXPRESS SWITCH

End of Life

Package/Case: LBGA

Contact Plating: Tin, Lead

Height: 1.4mm

Interface: PCI Express

89HPES12N3AZGBCG

PCI Express Switch 324-Pin CABGA Tray

Volume Production

Package/Case: LBGA

Contact Plating: Copper, Tin, Silver

Interface: PCI Express

Lead Free: Lead Free

89HPES12T3G2ZBBC

IC PCIE GEN2 SW 12LANE 324BGA

End of Life

Package/Case: LBGA

Contact Plating: Tin, Lead

Height: 1.4mm

Interface: PCI Express

89HPES10T4G2ZBBC

IC PCIE GEN2 SW 10LANE 324BGA

Volume Production

Package/Case: LBGA

Height: 1.4mm

Interface: PCI Express

Lead Free: Contains Lead

89HPES12N3A2ZCBCG

Renesas

PCI Express Switch I/O Expansion Switch 12Lanes 3 Port 324-Pin CABGA Tray

Ball Grid Array

LTB

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: CABGA

Package Description: Chip Array Ball Grid Array

+15

89HPES12T3G2ZABCG

PCI Interface IC PCI EXPRESS SWITCH

End of Life

Package/Case: LBGA

Contact Plating: Copper, Tin, Silver

Interface: PCI Express

Lead Free: Lead Free

89HPES10T4G2ZBBC8

PCI Interface IC PCI EXPRESS SWITCH

Volume Production

Package/Case: LBGA

Interface: PCI Express

Lead Free: Contains Lead

Length: 19mm

89HPES12T3G2ZBBCG

89HPES12T3G2ZBBCG

Volume Production

Package/Case: LBGA

Contact Plating: Copper, Tin, Silver

Interface: PCI Express

Lead Free: Lead Free

89HPES12N3A1ZCBCG

PCI Interface IC PCIE 12-LANE 3 PORT SWITCH

Volume Production

Package/Case: LBGA

Contact Plating: Copper, Tin, Silver

Interface: PCI Express

Max Operating Temperature: 70°C

89HPES10T4G2ZBBCG

IC PCIE GEN2 SW 10LANE 324BGA

Volume Production

Package/Case: LBGA

Height: 1.4mm

Interface: PCI Express

Lead Free: Lead Free

89HPES12N3A2ZCBCG8

Renesas

PCI Express Switch I/O Expansion Switch 12Lanes 3 Port 324-Pin CABGA T/R

Ball Grid Array

LTB

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: CABGA

Package Description: Chip Array Ball Grid Array

+15

89HPES12T3G2ZBBCG8

PCI Express Switch 324-Pin CABGA T/R

Volume Production

Package/Case: LBGA

Contact Plating: Copper, Tin, Silver

Interface: PCI Express

Lead Free: Lead Free