Search Results for &quot; AT-109 &quot;

16-Bit 60MHz Flash MCU, 28-Pin PDIP, Automotive

1.365 X 0.240 INCH, 0.120 INCH HEIGHT, 0.100 INCH PITCH, LEAD FREE, PLASTIC, SDIP-28

Active

Max Operating Temperature: 125

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: DUAL

DSPIC33EP32GP503-E/TL

16-Bit 60MHz Flash MCU, 36-Pin QCC, Automotive

5 X 5 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VTLA-36

Active

Max Operating Temperature: 125

Number of Terminals: 36

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32GP502-E/SO

16-Bit 60MHz Flash MCU, 28-Pin SOIC, Automotive

17.90 X 7.50 MM, 2.05 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOIC-28

Active

Max Operating Temperature: 125

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: DUAL

DSPIC33FJ32MC302T-E/SO

16-Bit 40MHz Flash MCU, 28-Pin SOIC, Automotive

SOIC-28

Active

Max Operating Temperature: 125

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: DUAL

DSPIC33EP32MC504-I/TL

16-Bit 70MHz FLASH MCU, 44-Pin QCC, Industrial

VTLA-44

Active

Max Operating Temperature: 85

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32MC502-I/SO

16-Bit MCU, 70MHz, Flash, 28-Pin SOIC, Industrial

17.90 X 7.50 MM, 2.05 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOIC-28

Active

Max Operating Temperature: 85

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: DUAL

PIC24HJ32GP202T-E/SO

16-Bit 40MHz FLASH MCU, 28-Pin SOIC, Automotive

7.50 MM, LEAD FREE, PLASTIC, SOIC-28

Active

Max Operating Temperature: 125

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: DUAL

DSPIC33EP32GP504-I/PT

16-Bit MCU, 70MHz, 44-Pin PQFP, Industrial Temp

10 X 10 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, TQFP-44

Active

Max Operating Temperature: 85

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32MC204-E/TL

16-Bit MCU, 60MHz, 44-Pin QCC, Automotive

6 X 6 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VTLA-44

Active

Max Operating Temperature: 125

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32GP502-E/SP

16-Bit MCU, 60MHz, 28-Pin PDIP, Flash, 3.3V, Automotive

1.365 X 0.240 INCH, 0.120 INCH HEIGHT, 0.100 INCH PITCH, LEAD FREE, PLASTIC, SDIP-28

Active

Max Operating Temperature: 125

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: DUAL

EP4CGX110BF23C6ES

FPGA Cyclone IV GX 109K Logic Cells 484-Pin FBGA 60nm 3.125Gbps Transceivers

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

EP4CGX110DF31I8N

FPGA Cyclone IV GX, 109K Cells, 896-Pin FBGA, 3.125Gbps Transceivers

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

EP4CGX110BF23I8N

FPGA Cyclone IV GX, 109K Cells, 484-Pin FBGA, 3.125Gbps Transceivers

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

EP4CGX110DF31C6N

FPGA Cyclone IV GX, 109K Cells, 60nm, 896-Pin FBGA, 475 I/Os

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

PIC24HJ32GP204T-H/ML

16-Bit 20MHz FLASH MCU, 44-Pin PQCC, 3.3V, -40°C to 150°C

8 X 8 MM, LEAD FREE, PLASTIC, QFN-44

Active

Max Operating Temperature: 150

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32MC204T-I/ML

16-Bit MCU, 70MHz, 44-Pin, Industrial, FLASH, PQCC44

8 X 8 MM, 0.90 MM HEIGHT, 0.65 MM PITCH, LEAD FREE, PLASTIC, QFN-44

Active

Max Operating Temperature: 85

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

EP4CGX110DF31I8ES

FPGA Cyclone IV GX, 109K Cells, 60nm, 896-Pin FBGA, 3.125Gbps Transceivers

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

DSPIC33EP32MC504-E/TL

16-Bit 60MHz Flash MCU, 44-Pin QCC44, Automotive

6 X 6 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VTLA-44

Active

Max Operating Temperature: 125

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32GP503-I/TL

16-Bit Flash MCU, 70MHz, 36-Pin QCC, Industrial

VTLA-36

Active

Max Operating Temperature: 85

Number of Terminals: 36

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32GP504-E/PT

16-Bit MCU, 60MHz, 44-Pin PQFP, Flash, Automotive

10 X 10 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, TQFP-44

Active

Max Operating Temperature: 125

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

Search Results for "AT-109"

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DSPIC33EP32MC202-E/SP

16-Bit 60MHz Flash MCU, 28-Pin PDIP, Automotive

1.365 X 0.240 INCH, 0.120 INCH HEIGHT, 0.100 INCH PITCH, LEAD FREE, PLASTIC, SDIP-28

Active

Max Operating Temperature: 125

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: DUAL

DSPIC33EP32GP503-E/TL

16-Bit 60MHz Flash MCU, 36-Pin QCC, Automotive

5 X 5 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VTLA-36

Active

Max Operating Temperature: 125

Number of Terminals: 36

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32GP502-E/SO

16-Bit 60MHz Flash MCU, 28-Pin SOIC, Automotive

17.90 X 7.50 MM, 2.05 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOIC-28

Active

Max Operating Temperature: 125

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: DUAL

DSPIC33FJ32MC302T-E/SO

16-Bit 40MHz Flash MCU, 28-Pin SOIC, Automotive

SOIC-28

Active

Max Operating Temperature: 125

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: DUAL

DSPIC33EP32MC504-I/TL

16-Bit 70MHz FLASH MCU, 44-Pin QCC, Industrial

VTLA-44

Active

Max Operating Temperature: 85

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32MC502-I/SO

16-Bit MCU, 70MHz, Flash, 28-Pin SOIC, Industrial

17.90 X 7.50 MM, 2.05 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOIC-28

Active

Max Operating Temperature: 85

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: DUAL

PIC24HJ32GP202T-E/SO

16-Bit 40MHz FLASH MCU, 28-Pin SOIC, Automotive

7.50 MM, LEAD FREE, PLASTIC, SOIC-28

Active

Max Operating Temperature: 125

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: DUAL

DSPIC33EP32GP504-I/PT

16-Bit MCU, 70MHz, 44-Pin PQFP, Industrial Temp

10 X 10 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, TQFP-44

Active

Max Operating Temperature: 85

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32MC204-E/TL

16-Bit MCU, 60MHz, 44-Pin QCC, Automotive

6 X 6 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VTLA-44

Active

Max Operating Temperature: 125

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32GP502-E/SP

16-Bit MCU, 60MHz, 28-Pin PDIP, Flash, 3.3V, Automotive

1.365 X 0.240 INCH, 0.120 INCH HEIGHT, 0.100 INCH PITCH, LEAD FREE, PLASTIC, SDIP-28

Active

Max Operating Temperature: 125

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: DUAL

EP4CGX110BF23C6ES

FPGA Cyclone IV GX 109K Logic Cells 484-Pin FBGA 60nm 3.125Gbps Transceivers

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

EP4CGX110DF31I8N

FPGA Cyclone IV GX, 109K Cells, 896-Pin FBGA, 3.125Gbps Transceivers

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

EP4CGX110BF23I8N

FPGA Cyclone IV GX, 109K Cells, 484-Pin FBGA, 3.125Gbps Transceivers

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

EP4CGX110DF31C6N

FPGA Cyclone IV GX, 109K Cells, 60nm, 896-Pin FBGA, 475 I/Os

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

PIC24HJ32GP204T-H/ML

16-Bit 20MHz FLASH MCU, 44-Pin PQCC, 3.3V, -40°C to 150°C

8 X 8 MM, LEAD FREE, PLASTIC, QFN-44

Active

Max Operating Temperature: 150

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32MC204T-I/ML

16-Bit MCU, 70MHz, 44-Pin, Industrial, FLASH, PQCC44

8 X 8 MM, 0.90 MM HEIGHT, 0.65 MM PITCH, LEAD FREE, PLASTIC, QFN-44

Active

Max Operating Temperature: 85

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

EP4CGX110DF31I8ES

FPGA Cyclone IV GX, 109K Cells, 60nm, 896-Pin FBGA, 3.125Gbps Transceivers

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

DSPIC33EP32MC504-E/TL

16-Bit 60MHz Flash MCU, 44-Pin QCC44, Automotive

6 X 6 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VTLA-44

Active

Max Operating Temperature: 125

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32GP503-I/TL

16-Bit Flash MCU, 70MHz, 36-Pin QCC, Industrial

VTLA-36

Active

Max Operating Temperature: 85

Number of Terminals: 36

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32GP504-E/PT

16-Bit MCU, 60MHz, 44-Pin PQFP, Flash, Automotive