Search Results for &quot; ATSAMA5D22B-CU &quot;

IC MCU 32BIT 160KB ROM 324LFBGA

15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, MO-275KAAE-1, LFBGA-324

Active

Max Operating Temperature: 85

Number of Terminals: 324

Min Operating Temperature: -40

Terminal Position: BOTTOM

RISC Microprocessor

LFBGA-289

Active

Max Operating Temperature: 85

Number of Terminals: 289

Min Operating Temperature: -40

Terminal Position: BOTTOM

+13

ATSAMA5D34A-CUR

IC MCU 32BIT 160KB ROM 324LFBGA

15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, MO-275KAAE-1, LFBGA-324

Active

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 536MHz

+11

ATSAMA5D43A-CUR

IC MCU 32BIT 128KB ROM 289LFBGA

14 X 14 MM, 1.40 MM HIEGHT, 0.80 MM PITCH, GREEN, MO-275JJAC-1, LFBGA-289

Obsolete

ATSAMA5D31-EK

Development Boards & Kits - ARM EVAL KIT SAMA5D31 CRYPTO

Volume Production

Package/Case: Module

Core Architecture: ARM

Data Bus Width: 32b

Evaluation Kit: Yes

ATSAMA5D35-EK

Development Boards & Kits - ARM EVAL KIT SAMA5D35

Volume Production

Core Architecture: ARM

Data Bus Width: 32b

Evaluation Kit: Yes

Interface: Serial, USB

ATSAMA5D33-EK

Development Boards & Kits - ARM EVAL KIT SAMA5D33 CRYPTO

Not Recommended for New Design

Package/Case: Module

Core Architecture: ARM

Data Bus Width: 32b

Evaluation Kit: Yes

ATSAMA5D34-EK

Development Boards & Kits - ARM EVAL KIT SAMA5D34 CRYPTO

End of Life

Package/Case: Module

Core Architecture: ARM

Data Bus Width: 32b

Evaluation Kit: Yes

+10

ATSAMA5D35A-CN

IC MCU 32BIT 160KB ROM 324LFBGA

15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, MO-275KAAE-1, LFBGA-324

Active

Max Operating Temperature: 85

Number of Terminals: 324

Min Operating Temperature: -40

Terminal Position: BOTTOM

ATSAMA5D36A-CN

IC MCU 32BIT 160KB ROM 324LFBGA

15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, MO-275KAAE-1, LFBGA-324

Active

Max Operating Temperature: 85

Number of Terminals: 324

Min Operating Temperature: -40

Terminal Position: BOTTOM

ATSAMA5D36A-CNR

32-Bit RISC MPU, 50MHz, 324-Pin LFBGA, Industrial

15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, MO-275KAAE-1, LFBGA-324

Active

Max Operating Temperature: 85

Number of Terminals: 324

Min Operating Temperature: -40

Terminal Position: BOTTOM

ATSAMA5D35A-CNR

IC MCU 32BIT 160KB ROM 324LFBGA

15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, MO-275KAAE-1, LFBGA-324

Active

Max Operating Temperature: 85

Number of Terminals: 324

Min Operating Temperature: -40

Terminal Position: BOTTOM

ATSAMA5D31A-CFU

IC MCU 32BIT 160KB ROM 324TFBGA

12 X 12 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, GREEN, TFBGA-324

Active

Max Operating Temperature: 85

Number of Terminals: 324

Min Operating Temperature: -40

Terminal Position: BOTTOM

ATSAMA5D31A-CFUR

IC MCU 32BIT 160KB ROM 324TFBGA

12 X 12 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, GREEN, TFBGA-324

Active

Max Operating Temperature: 85

Number of Terminals: 324

Min Operating Temperature: -40

Terminal Position: BOTTOM

ATSAM4S8CA-CU

32-bit ARM Cortex M4 MCU, 120MHz, 512KB Flash, 100-Pin TFBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: TFBGA

Package Description: Thin Fine Pitch Ball Grid Array

ATSAM3X8CA-CU

32-bit ARM Cortex M3 MCU, 84MHz, 512KB Flash, 100-Pin LFBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LFBGA

Package Description: Low Profile Fine Pitch Ball Grid Array

ATSAM3X4EA-CU

32-bit ARM Cortex M3 MCU, 84MHz, 256KB Flash, 144-Pin LFBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LFBGA

Package Description: Low Profile Fine Pitch Ball Grid Array

ATSAM3N4CA-CU

ARM Microcontrollers - MCU IND TEMP MRLA

End of Life

Package/Case: TFBGA

Contact Plating: Copper, Tin, Silver

Core Architecture: ARM

Data Bus Width: 32b

+22

ATSAM3U2CA-CU

32-bit ARM MCU, 96MHz, 128KB Flash, 36KB RAM, TFBGA

9 X 9 MM, 0.80 MM PITCH, GREEN, LFBGA-100

Active

Package/Case: TFBGA

Core Architecture: ARM

Frequency: 96MHz

Interface: I2C, SPI, USB, UART, USART, EBI/EMI

+18

ATSAM3S2CA-CU

IC MCU 32BIT 128KB FLASH 100BGA

9 X 9 MM, 1.10 MM HEIGHT, 0.80 MM PITCH, GREEN, LFBGA-100

Active

Package/Case: TFBGA

Core Architecture: ARM

Frequency: 64MHz

Interface: I2C, SPI, USB, UART, USART, EBI/EMI

+16

Search Results for "ATSAMA5D22B-CU"

Filters

ATSAMA5D36A-CUR

IC MCU 32BIT 160KB ROM 324LFBGA

15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, MO-275KAAE-1, LFBGA-324

Active

Max Operating Temperature: 85

Number of Terminals: 324

Min Operating Temperature: -40

Terminal Position: BOTTOM

RISC Microprocessor

LFBGA-289

Active

Max Operating Temperature: 85

Number of Terminals: 289

Min Operating Temperature: -40

Terminal Position: BOTTOM

+13

ATSAMA5D34A-CUR

IC MCU 32BIT 160KB ROM 324LFBGA

15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, MO-275KAAE-1, LFBGA-324

Active

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 536MHz

+11

ATSAMA5D43A-CUR

IC MCU 32BIT 128KB ROM 289LFBGA

14 X 14 MM, 1.40 MM HIEGHT, 0.80 MM PITCH, GREEN, MO-275JJAC-1, LFBGA-289

Obsolete

ATSAMA5D31-EK

Development Boards & Kits - ARM EVAL KIT SAMA5D31 CRYPTO

Volume Production

Package/Case: Module

Core Architecture: ARM

Data Bus Width: 32b

Evaluation Kit: Yes

ATSAMA5D35-EK

Development Boards & Kits - ARM EVAL KIT SAMA5D35

Volume Production

Core Architecture: ARM

Data Bus Width: 32b

Evaluation Kit: Yes

Interface: Serial, USB

ATSAMA5D33-EK

Development Boards & Kits - ARM EVAL KIT SAMA5D33 CRYPTO

Not Recommended for New Design

Package/Case: Module

Core Architecture: ARM

Data Bus Width: 32b

Evaluation Kit: Yes

ATSAMA5D34-EK

Development Boards & Kits - ARM EVAL KIT SAMA5D34 CRYPTO

End of Life

Package/Case: Module

Core Architecture: ARM

Data Bus Width: 32b

Evaluation Kit: Yes

+10

ATSAMA5D35A-CN

IC MCU 32BIT 160KB ROM 324LFBGA

15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, MO-275KAAE-1, LFBGA-324

Active

Max Operating Temperature: 85

Number of Terminals: 324

Min Operating Temperature: -40

Terminal Position: BOTTOM

ATSAMA5D36A-CN

IC MCU 32BIT 160KB ROM 324LFBGA

15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, MO-275KAAE-1, LFBGA-324

Active

Max Operating Temperature: 85

Number of Terminals: 324

Min Operating Temperature: -40

Terminal Position: BOTTOM

ATSAMA5D36A-CNR

32-Bit RISC MPU, 50MHz, 324-Pin LFBGA, Industrial

15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, MO-275KAAE-1, LFBGA-324

Active

Max Operating Temperature: 85

Number of Terminals: 324

Min Operating Temperature: -40

Terminal Position: BOTTOM

ATSAMA5D35A-CNR

IC MCU 32BIT 160KB ROM 324LFBGA

15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, MO-275KAAE-1, LFBGA-324

Active

Max Operating Temperature: 85

Number of Terminals: 324

Min Operating Temperature: -40

Terminal Position: BOTTOM

ATSAMA5D31A-CFU

IC MCU 32BIT 160KB ROM 324TFBGA

12 X 12 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, GREEN, TFBGA-324

Active

Max Operating Temperature: 85

Number of Terminals: 324

Min Operating Temperature: -40

Terminal Position: BOTTOM

ATSAMA5D31A-CFUR

IC MCU 32BIT 160KB ROM 324TFBGA

12 X 12 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, GREEN, TFBGA-324

Active

Max Operating Temperature: 85

Number of Terminals: 324

Min Operating Temperature: -40

Terminal Position: BOTTOM

ATSAM4S8CA-CU

32-bit ARM Cortex M4 MCU, 120MHz, 512KB Flash, 100-Pin TFBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: TFBGA

Package Description: Thin Fine Pitch Ball Grid Array

ATSAM3X8CA-CU

32-bit ARM Cortex M3 MCU, 84MHz, 512KB Flash, 100-Pin LFBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LFBGA

Package Description: Low Profile Fine Pitch Ball Grid Array

ATSAM3X4EA-CU

32-bit ARM Cortex M3 MCU, 84MHz, 256KB Flash, 144-Pin LFBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LFBGA

Package Description: Low Profile Fine Pitch Ball Grid Array

ATSAM3N4CA-CU

ARM Microcontrollers - MCU IND TEMP MRLA

End of Life

Package/Case: TFBGA

Contact Plating: Copper, Tin, Silver

Core Architecture: ARM

Data Bus Width: 32b

+22

ATSAM3U2CA-CU

32-bit ARM MCU, 96MHz, 128KB Flash, 36KB RAM, TFBGA

9 X 9 MM, 0.80 MM PITCH, GREEN, LFBGA-100

Active

Package/Case: TFBGA

Core Architecture: ARM

Frequency: 96MHz

Interface: I2C, SPI, USB, UART, USART, EBI/EMI

+18

ATSAM3S2CA-CU

IC MCU 32BIT 128KB FLASH 100BGA