Search Results for &quot; BD80C0AFP2-CE2 &quot;

Buffer/Inverter Based Peripheral Driver,

LSOP, SOP8,.25

Active

Number of Terminals: 8

Terminal Position: DUAL

JEDEC Package Code: R-PDSO-G8

Width: 3.9

BD82007FVJ-MGE2

Buffer/Inverter Based Peripheral Driver,

TSSOP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

BD82QS67SLJ4K

Intel

Chipsets QS67 Express Chipset Mobile FCBGA-1071

Volume Production

Package/Case: FCBGA

Length: 22mm

Package Quantity: 800

Packaging: Tape and Reel

BD82005FVJ-MGE2

Buffer/Inverter Based Peripheral Driver,

Active

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

BA82902YFV-CE2

Operational Amplifier,

Active

Amplifier Type: OPERATIONAL AMPLIFIER

BV1LB150FJ-CE2

Buffer/Inverter Based Peripheral Driver,

LSOP, SOP8,.25

Active

Number of Terminals: 8

Terminal Position: DUAL

JEDEC Package Code: R-PDSO-G8

Width: 3.9

BM2LB150FJ-CE2

Buffer/Inverter Based Peripheral Driver,

LSOP, SOP8,.25

Active

Number of Terminals: 8

Terminal Position: DUAL

JEDEC Package Code: R-PDSO-G8

Width: 3.9

BA82902YFVJ-CE2

Operational Amplifier,

Active

Amplifier Type: OPERATIONAL AMPLIFIER

CE-ECO-QSK/CE

Adlink

Development Boards & Kits - x86 DEVELOPER'S KIT FOR CoreExpress-ECO WINC

Obsolete

Interface: SPI, Serial, USB, CAN, Ethernet, SATA, PCI

Max Operating Temperature: 50°C

Min Operating Temperature: 0°C

Operating Supply Voltage: 12V

TOOL EXTRACTION

Volume Production

Heat Shrink Cable Entry Seal ST Polyolefin

Active

Body Material: PO, Polyolefin, Nylon

Color: Black

ELV: Compliant

Inside Diameter: 19.05mm

+10

CES-1

Heat Shrink Cable Entry Seal ST Polyolefin Automotive

Active

Body Material: PO, Polyolefin

Color: Black

ELV: Compliant

Inside Diameter: 12.7mm

CE1

MULTICOMP CE1 Contact, 22 AWG, 18 AWG, Nylon (Polyamide), Transparent

Volume Production

Insulation Material: Nylon

Reach SVHC Compliant: Unknown

Termination: Crimp

Wire/Cable Gauge: 22AWG

TOOL EXTRACTION

Volume Production

Solderless Closed-End Splice

Not Recommended for New Design

Insulation: Insulated

Insulation Material: Nylon

Lead Free: Lead Free

Length: 20.8mm

CONNECTOR, CLOSED END, 10AWG

Not Recommended for New Design

Color: Natural

Insulation Material: Polyamide

Jacket Material: Polyamide

Reach SVHC Compliant: No

CES-4

Heat Shrink Cable Entry Seal ST Polyolefin

Active

Body Material: Polyolefin, PO

Color: Black

ELV: Compliant

Inside Diameter: 40.64mm

JST

Tape-on terminal/Splice , Closed-End Splice

Not Recommended for New Design

Insulation: Insulated

Insulation Material: Nylon

Lead Free: Lead Free

Length: 27mm

CE8

CONNECTOR, CLOSED END, 10AWG

Not Recommended for New Design

Color: Natural

Insulation Material: Polyamide

Jacket Material: Polyamide

Reach SVHC Compliant: No

CE-98-U

Adam Equipment

Standard Card Edge Connectors 98P CARD EDGE VERT. MOUNT

Volume Production

Mount: Standard

Search Results for "BD80C0AFP2-CE2"

Filters

BV1LB085FJ-CE2

Buffer/Inverter Based Peripheral Driver,

LSOP, SOP8,.25

Active

Number of Terminals: 8

Terminal Position: DUAL

JEDEC Package Code: R-PDSO-G8

Width: 3.9

BD82007FVJ-MGE2

Buffer/Inverter Based Peripheral Driver,

TSSOP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

BD82QS67SLJ4K

Intel

Chipsets QS67 Express Chipset Mobile FCBGA-1071

Volume Production

Package/Case: FCBGA

Length: 22mm

Package Quantity: 800

Packaging: Tape and Reel

BD82005FVJ-MGE2

Buffer/Inverter Based Peripheral Driver,

Active

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

BA82902YFV-CE2

Operational Amplifier,

Active

Amplifier Type: OPERATIONAL AMPLIFIER

BV1LB150FJ-CE2

Buffer/Inverter Based Peripheral Driver,

LSOP, SOP8,.25

Active

Number of Terminals: 8

Terminal Position: DUAL

JEDEC Package Code: R-PDSO-G8

Width: 3.9

BM2LB150FJ-CE2

Buffer/Inverter Based Peripheral Driver,

LSOP, SOP8,.25

Active

Number of Terminals: 8

Terminal Position: DUAL

JEDEC Package Code: R-PDSO-G8

Width: 3.9

BA82902YFVJ-CE2

Operational Amplifier,

Active

Amplifier Type: OPERATIONAL AMPLIFIER

CE-ECO-QSK/CE

Adlink

Development Boards & Kits - x86 DEVELOPER'S KIT FOR CoreExpress-ECO WINC

Obsolete

Interface: SPI, Serial, USB, CAN, Ethernet, SATA, PCI

Max Operating Temperature: 50°C

Min Operating Temperature: 0°C

Operating Supply Voltage: 12V

TOOL EXTRACTION

Volume Production

Heat Shrink Cable Entry Seal ST Polyolefin

Active

Body Material: PO, Polyolefin, Nylon

Color: Black

ELV: Compliant

Inside Diameter: 19.05mm

+10

CES-1

Heat Shrink Cable Entry Seal ST Polyolefin Automotive

Active

Body Material: PO, Polyolefin

Color: Black

ELV: Compliant

Inside Diameter: 12.7mm

CE1

MULTICOMP CE1 Contact, 22 AWG, 18 AWG, Nylon (Polyamide), Transparent

Volume Production

Insulation Material: Nylon

Reach SVHC Compliant: Unknown

Termination: Crimp

Wire/Cable Gauge: 22AWG

TOOL EXTRACTION

Volume Production

Solderless Closed-End Splice

Not Recommended for New Design

Insulation: Insulated

Insulation Material: Nylon

Lead Free: Lead Free

Length: 20.8mm

CONNECTOR, CLOSED END, 10AWG

Not Recommended for New Design

Color: Natural

Insulation Material: Polyamide

Jacket Material: Polyamide

Reach SVHC Compliant: No

CES-4

Heat Shrink Cable Entry Seal ST Polyolefin

Active

Body Material: Polyolefin, PO

Color: Black

ELV: Compliant

Inside Diameter: 40.64mm

JST

Tape-on terminal/Splice , Closed-End Splice

Not Recommended for New Design

Insulation: Insulated

Insulation Material: Nylon

Lead Free: Lead Free

Length: 27mm

CE8

CONNECTOR, CLOSED END, 10AWG

Not Recommended for New Design

Color: Natural

Insulation Material: Polyamide

Jacket Material: Polyamide

Reach SVHC Compliant: No

CE-98-U

Adam Equipment

Standard Card Edge Connectors 98P CARD EDGE VERT. MOUNT