Search Results for &quot; CY96F348RSBPQC-GS-UJE2 &quot;

IC CAN/LIN FAIL-SAFE HS 32HTSSOP

Volume Production

Data Rate: 20Kbps

Min Supply Voltage: 5.5V

Number of Transceivers: 1

Packaging: Tape and Reel

UJB0L472TPD

Cap Aluminum Lytic 4700uF 5.5V -10% to 50% (10 X 20mm) Radial 5mm 1000h 85°C Bulk

Through Hole

Obsolete

Capacitance: 4.7mF

Package/Case: Radial

Diameter: 10mm

Height: 20mm

+15

U1ZB27(TE12R,UJ)

Zener Diode Single 27V 10% 30Ohm 1000mW 2-Pin I-FLAT T/R

I-FLAT

Obsolete

Package Family Name: I-FLAT

Package/Case: I-FLAT

Pin Count: 2

PCB: 2

U1ZB15(TE12R,UJ)

Zener Diode Single 15V 10% 30Ohm 1000mW 2-Pin I-FLAT T/R

I-FLAT

Obsolete

Package Family Name: I-FLAT

Package/Case: I-FLAT

Pin Count: 2

PCB: 2

U1ZB33(TE12R,UJ,Q)

Zener Diode Single 33V 10% 30Ohm 1000mW 2-Pin I-FLAT T/R

I-FLAT

Obsolete

Package Family Name: I-FLAT

Package/Case: I-FLAT

Pin Count: 2

PCB: 2

UJA1079TW/5V0

HIGH PERFORMANCE SYSTEM BASIS CHIP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

UJA1076TW/3V3

HIGH PERFORMANCE SYSTEM BASIS CHIP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

UJA1079TW/3V3

HIGH PERFORMANCE SYSTEM BASIS CHIP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

UJA1069TW/5V0/C

HIGH PERFORMANCE SYSTEM BASIS CHIP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

UJA1167TK,118

HIGH PERFORMANCE SYSTEM BASIS CHIP

SON

LTB

Contact Plating: Gold

Max Operating Temperature: 150°C

Min Operating Temperature: -40°C

Max Supply Current: 67mA

UJA1069TW/5V0/C/T,

HIGH PERFORMANCE SYSTEM BASIS CHIP

Surface Mount

LTB

Package/Case: HTSSOP EP

Pin Count: 32

PCB: 32

Package Length (mm): 11.1(Max)

GSS-8-3.8-G

Interconnect Devices

INTERCONNECT DEVICES GSS-8-3.8-G TEST CONNECTOR

Volume Production

Package/Case: 100

Current Rating: 3A

Length: 10.79mm

Reach SVHC Compliant: Unknown

U1ZB33(TE12R,UJ)

Zener Diode Single 33V 10% 30Ohm 1000mW 2-Pin I-FLAT T/R

I-FLAT

Obsolete

Package Family Name: I-FLAT

Package/Case: I-FLAT

Pin Count: 2

PCB: 2

UJB0L822THD

Cap Aluminum Lytic 8200uF 5.5V -10% to 50% (12.5 X 20mm) Radial 5mm 1000h 85°C Bulk

Through Hole

Obsolete

Capacitance: 8.2mF

Package/Case: Radial

Impedance: 300mR

Lead Pitch: 5mm

UJB0L222TPD

Cap Aluminum Lytic 2200uF 5.5V -10% to 50% (10 X 12.5mm) Radial 5mm 1000h 85°C Bulk

Through Hole

Obsolete

Capacitance: 2.2mF

Package/Case: Radial

Impedance: 1.5R

Lead Pitch: 5mm

UJA1061TW/3V3/C

HIGH PERFORMANCE SYSTEM BASIS CHIP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

UJA1061TW/5V0/C

HIGH PERFORMANCE SYSTEM BASIS CHIP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

UJA1061TW/5V0/C/T

CAN Sleep/Standby 9V/12V/15V/18V/24V/28V 32-Pin HTSSOP EP T/R

Volume Production

Package/Case: HTSSOP EP

Max Operating Temperature: 125°C

Min Operating Temperature: -40°C

Max Supply Current: 25mA

+10

UJA1061TW/5V0/C/T/

IC CAN/LIN FAIL-SAFE HS 32HTSSOP

Volume Production

Package/Case: HTSSOP EP

Interface: CAN, LIN

Max Operating Temperature: 125°C

Min Operating Temperature: -40°C

UJA1168TK,118

UJA1168 - Mini high-speed CAN system basis chip for partial networking SON 14-Pin

SON

End Of Life

Max Operating Temperature: 150°C

Min Operating Temperature: -40°C

Max Supply Voltage: 28V

Min Supply Voltage: 3V

Search Results for "CY96F348RSBPQC-GS-UJE2"

Filters

UJA1065TW/3V3/C/T,

IC CAN/LIN FAIL-SAFE HS 32HTSSOP

Volume Production

Data Rate: 20Kbps

Min Supply Voltage: 5.5V

Number of Transceivers: 1

Packaging: Tape and Reel

UJB0L472TPD

Cap Aluminum Lytic 4700uF 5.5V -10% to 50% (10 X 20mm) Radial 5mm 1000h 85°C Bulk

Through Hole

Obsolete

Capacitance: 4.7mF

Package/Case: Radial

Diameter: 10mm

Height: 20mm

+15

U1ZB27(TE12R,UJ)

Zener Diode Single 27V 10% 30Ohm 1000mW 2-Pin I-FLAT T/R

I-FLAT

Obsolete

Package Family Name: I-FLAT

Package/Case: I-FLAT

Pin Count: 2

PCB: 2

U1ZB15(TE12R,UJ)

Zener Diode Single 15V 10% 30Ohm 1000mW 2-Pin I-FLAT T/R

I-FLAT

Obsolete

Package Family Name: I-FLAT

Package/Case: I-FLAT

Pin Count: 2

PCB: 2

U1ZB33(TE12R,UJ,Q)

Zener Diode Single 33V 10% 30Ohm 1000mW 2-Pin I-FLAT T/R

I-FLAT

Obsolete

Package Family Name: I-FLAT

Package/Case: I-FLAT

Pin Count: 2

PCB: 2

UJA1079TW/5V0

HIGH PERFORMANCE SYSTEM BASIS CHIP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

UJA1076TW/3V3

HIGH PERFORMANCE SYSTEM BASIS CHIP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

UJA1079TW/3V3

HIGH PERFORMANCE SYSTEM BASIS CHIP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

UJA1069TW/5V0/C

HIGH PERFORMANCE SYSTEM BASIS CHIP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

UJA1167TK,118

HIGH PERFORMANCE SYSTEM BASIS CHIP

SON

LTB

Contact Plating: Gold

Max Operating Temperature: 150°C

Min Operating Temperature: -40°C

Max Supply Current: 67mA

UJA1069TW/5V0/C/T,

HIGH PERFORMANCE SYSTEM BASIS CHIP

Surface Mount

LTB

Package/Case: HTSSOP EP

Pin Count: 32

PCB: 32

Package Length (mm): 11.1(Max)

GSS-8-3.8-G

Interconnect Devices

INTERCONNECT DEVICES GSS-8-3.8-G TEST CONNECTOR

Volume Production

Package/Case: 100

Current Rating: 3A

Length: 10.79mm

Reach SVHC Compliant: Unknown

U1ZB33(TE12R,UJ)

Zener Diode Single 33V 10% 30Ohm 1000mW 2-Pin I-FLAT T/R

I-FLAT

Obsolete

Package Family Name: I-FLAT

Package/Case: I-FLAT

Pin Count: 2

PCB: 2

UJB0L822THD

Cap Aluminum Lytic 8200uF 5.5V -10% to 50% (12.5 X 20mm) Radial 5mm 1000h 85°C Bulk

Through Hole

Obsolete

Capacitance: 8.2mF

Package/Case: Radial

Impedance: 300mR

Lead Pitch: 5mm

UJB0L222TPD

Cap Aluminum Lytic 2200uF 5.5V -10% to 50% (10 X 12.5mm) Radial 5mm 1000h 85°C Bulk

Through Hole

Obsolete

Capacitance: 2.2mF

Package/Case: Radial

Impedance: 1.5R

Lead Pitch: 5mm

UJA1061TW/3V3/C

HIGH PERFORMANCE SYSTEM BASIS CHIP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

UJA1061TW/5V0/C

HIGH PERFORMANCE SYSTEM BASIS CHIP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

UJA1061TW/5V0/C/T

CAN Sleep/Standby 9V/12V/15V/18V/24V/28V 32-Pin HTSSOP EP T/R

Volume Production

Package/Case: HTSSOP EP

Max Operating Temperature: 125°C

Min Operating Temperature: -40°C

Max Supply Current: 25mA

+10

UJA1061TW/5V0/C/T/

IC CAN/LIN FAIL-SAFE HS 32HTSSOP

Volume Production

Package/Case: HTSSOP EP

Interface: CAN, LIN

Max Operating Temperature: 125°C

Min Operating Temperature: -40°C

UJA1168TK,118

UJA1168 - Mini high-speed CAN system basis chip for partial networking SON 14-Pin