Search Results for &quot; LPC47M107S-MS &quot;

RISC MICROCONTROLLER

LQFP-80

Active

Max Operating Temperature: 85

Number of Terminals: 80

Min Operating Temperature: -40

Terminal Position: QUAD

LPC4357-K43WQA

NXP LPC4357-K43WQA Evaluation Board, LPC4357, Dual Cortex - M4 & M0 Cores, 4.3" 480X272 Touch Screen LCD Module

Volume Production

Package/Case: Module

Core Architecture: ARM

Number of Bits: 32

Reach SVHC Compliant: No

LPC4337FET256

32-bit ARM Cortex M4/M0 MCU, 204MHz, 1MB Flash, 256-pin LBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

LPC4310FET100

32-Bit RISC MCU, 204MHz, FLASH, 100-Pin TFBGA, Industrial

9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100

Active

Max Operating Temperature: 85

Number of Terminals: 100

Min Operating Temperature: -40

Terminal Position: BOTTOM

LPC4337JET100

32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA100, 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100

9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100

Active

Max Operating Temperature: 105

Number of Terminals: 100

Min Operating Temperature: -40

Terminal Position: BOTTOM

LPC4078FBD100

IC RISC MICROCONTROLLER, Microcontroller

LQFP-100

Active

Max Operating Temperature: 85

Number of Terminals: 100

Min Operating Temperature: -40

Terminal Position: QUAD

RISC MICROCONTROLLER

Active

Package/Case: SOT-740-2

Frequency: 204MHz

Lead Free: Lead Free

Max Supply Voltage: 3.6V

LPC4330FET100

32-Bit RISC MCU, 204MHz, FLASH, 100-Pin TFBGA, Industrial

9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100

Active

Max Operating Temperature: 85

Number of Terminals: 100

Min Operating Temperature: -40

Terminal Position: BOTTOM

LPC4323JET100

32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA100, 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100

9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100

Active

Max Operating Temperature: 105

Number of Terminals: 100

Min Operating Temperature: -40

Terminal Position: BOTTOM

LPC4353JET256

32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA256, 17 X 17 MM, 1 MM HEIGHT, PLASTIC, SOT740-2, MO-192, LBGA-256

17 X 17 MM, 1 MM HEIGHT, PLASTIC, SOT740-2, MO-192, LBGA-256

Active

Max Operating Temperature: 105

Number of Terminals: 256

Min Operating Temperature: -40

Terminal Position: BOTTOM

LPC4333FBD144

32-bit ARM Cortex M4/M0 MCU, 204MHz, 512KB Flash, 144-Pin LQFP

Lead-Frame SMT

Unconfirmed

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP

Package Description: Low Profile Quad Flat Package

+40

LPC4333FET180

32-bit ARM Cortex M4/M0 MCU, 204MHz, 512KB Flash, 180-Pin TFBGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: TFBGA

Package Description: Thin Fine Pitch Ball Grid Array

LPC4337FET180

32-bit ARM Cortex M4/M0 MCU, 204MHz, 1MB Flash, 180-TFBGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: TFBGA

Package Description: Thin Fine Pitch Ball Grid Array

RISC MICROCONTROLLER

TFBGA-180

Active

Max Operating Temperature: 85

Number of Terminals: 180

Min Operating Temperature: -40

Terminal Position: BOTTOM

RISC MICROCONTROLLER

TFBGA-180

Active

Max Operating Temperature: 85

Number of Terminals: 180

Min Operating Temperature: -40

Terminal Position: BOTTOM

RISC MICROCONTROLLER

LQFP-144

Active

Max Operating Temperature: 85

Number of Terminals: 144

Min Operating Temperature: -40

Terminal Position: QUAD

LPC4072FET80K

LPC4072/74x - 32-bit ARM Cortex-M4 MCU; up to 512 kB flash, 96 kB SRAM; USB Device/Host/OTG; Ethernet; EMC; SPIFI BGA 80-Pin

TFBGA,

Active

Package/Case: TFBGA

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, USB, CAN, UART, IrDA, SSP, USART

+16

LPC4353FET256

32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA256, 17 X 17 MM, 1 MM HEIGHT, PLASTIC, SOT740-2, MO-192, LBGA-256

LBGA-256

Active

Lead Free: Lead Free

Number of Bits: 32

RoHS Compliant: Yes

LPC4333FET256

32-bit ARM Cortex M4/M0 MCU, 204MHz, 512KB Flash, 256-Pin LBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

LPC4333FET100

32-bit ARM Cortex M4/M0 MCU, 204MHz, 512KB Flash, 100-Pin TFBGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: TFBGA

Package Description: Thin Fine Pitch Ball Grid Array

Search Results for "LPC47M107S-MS"

Filters

LPC4074FBD80

RISC MICROCONTROLLER

LQFP-80

Active

Max Operating Temperature: 85

Number of Terminals: 80

Min Operating Temperature: -40

Terminal Position: QUAD

LPC4357-K43WQA

NXP LPC4357-K43WQA Evaluation Board, LPC4357, Dual Cortex - M4 & M0 Cores, 4.3" 480X272 Touch Screen LCD Module

Volume Production

Package/Case: Module

Core Architecture: ARM

Number of Bits: 32

Reach SVHC Compliant: No

LPC4337FET256

32-bit ARM Cortex M4/M0 MCU, 204MHz, 1MB Flash, 256-pin LBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

LPC4310FET100

32-Bit RISC MCU, 204MHz, FLASH, 100-Pin TFBGA, Industrial

9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100

Active

Max Operating Temperature: 85

Number of Terminals: 100

Min Operating Temperature: -40

Terminal Position: BOTTOM

LPC4337JET100

32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA100, 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100

9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100

Active

Max Operating Temperature: 105

Number of Terminals: 100

Min Operating Temperature: -40

Terminal Position: BOTTOM

LPC4078FBD100

IC RISC MICROCONTROLLER, Microcontroller

LQFP-100

Active

Max Operating Temperature: 85

Number of Terminals: 100

Min Operating Temperature: -40

Terminal Position: QUAD

RISC MICROCONTROLLER

Active

Package/Case: SOT-740-2

Frequency: 204MHz

Lead Free: Lead Free

Max Supply Voltage: 3.6V

LPC4330FET100

32-Bit RISC MCU, 204MHz, FLASH, 100-Pin TFBGA, Industrial

9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100

Active

Max Operating Temperature: 85

Number of Terminals: 100

Min Operating Temperature: -40

Terminal Position: BOTTOM

LPC4323JET100

32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA100, 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100

9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100

Active

Max Operating Temperature: 105

Number of Terminals: 100

Min Operating Temperature: -40

Terminal Position: BOTTOM

LPC4353JET256

32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA256, 17 X 17 MM, 1 MM HEIGHT, PLASTIC, SOT740-2, MO-192, LBGA-256

17 X 17 MM, 1 MM HEIGHT, PLASTIC, SOT740-2, MO-192, LBGA-256

Active

Max Operating Temperature: 105

Number of Terminals: 256

Min Operating Temperature: -40

Terminal Position: BOTTOM

LPC4333FBD144

32-bit ARM Cortex M4/M0 MCU, 204MHz, 512KB Flash, 144-Pin LQFP

Lead-Frame SMT

Unconfirmed

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP

Package Description: Low Profile Quad Flat Package

+40

LPC4333FET180

32-bit ARM Cortex M4/M0 MCU, 204MHz, 512KB Flash, 180-Pin TFBGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: TFBGA

Package Description: Thin Fine Pitch Ball Grid Array

LPC4337FET180

32-bit ARM Cortex M4/M0 MCU, 204MHz, 1MB Flash, 180-TFBGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: TFBGA

Package Description: Thin Fine Pitch Ball Grid Array

RISC MICROCONTROLLER

TFBGA-180

Active

Max Operating Temperature: 85

Number of Terminals: 180

Min Operating Temperature: -40

Terminal Position: BOTTOM

RISC MICROCONTROLLER

TFBGA-180

Active

Max Operating Temperature: 85

Number of Terminals: 180

Min Operating Temperature: -40

Terminal Position: BOTTOM

RISC MICROCONTROLLER

LQFP-144

Active

Max Operating Temperature: 85

Number of Terminals: 144

Min Operating Temperature: -40

Terminal Position: QUAD

LPC4072FET80K

LPC4072/74x - 32-bit ARM Cortex-M4 MCU; up to 512 kB flash, 96 kB SRAM; USB Device/Host/OTG; Ethernet; EMC; SPIFI BGA 80-Pin

TFBGA,

Active

Package/Case: TFBGA

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, USB, CAN, UART, IrDA, SSP, USART

+16

LPC4353FET256

32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA256, 17 X 17 MM, 1 MM HEIGHT, PLASTIC, SOT740-2, MO-192, LBGA-256

LBGA-256

Active

Lead Free: Lead Free

Number of Bits: 32

RoHS Compliant: Yes

LPC4333FET256

32-bit ARM Cortex M4/M0 MCU, 204MHz, 512KB Flash, 256-Pin LBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

LPC4333FET100

32-bit ARM Cortex M4/M0 MCU, 204MHz, 512KB Flash, 100-Pin TFBGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: TFBGA

Package Description: Thin Fine Pitch Ball Grid Array