Search Results for &quot; M24128-DFMN6TP &quot;

128Kb I2C EEPROM, 900ns Access, 400kHz, TSSOP

TSSOP,

Active

Access Time: 900ns

Access Time-Max: 900ns

Package/Case: TSSOP

Density: 128Kb

+22

M24128-BRMN6TP

128Kb I2C EEPROM, 450ns Access, SOIC, 5.5V

SOP,

Active

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 128Kb

+20

M24128X-FCU6T/TF

128Kb I2C EEPROM, Serial Memory IC, CSP

Active

Memory IC Type: EEPROM

M24128-BWMC6TP

128Kbit Serial-I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin UFDFPN SMT

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BRCS6TP/K

128Kbit I2C EEPROM, 16Kx8, 8-Pin WLCSP, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BFMH6TG

128K Serial I2C EEPROM | Industrial | 1.7x1.4mm

VBCC, SOLCC5,.06,16

Active

Max Operating Temperature: 85

Number of Terminals: 5

Min Operating Temperature: -40

Terminal Position: BOTTOM

M24128-BWMN3TP/P

128Kbit I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin SOIC, 0.4MHz

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

+26

M24128-BRCS6TG/K

128Kb I2C EEPROM, 8-Pin WLCSP, 1.8-5.5V, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BWCS6TG/K

128Kbit I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-DRDW8TP/K

128-Kbit serial I2C bus EEPROM 105°C operation

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 105

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-DRMN8TP/K

128-Kbit serial I2C bus EEPROM 105°C operation

SOP, SOP8,.25

Active

Max Operating Temperature: 105

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BWMC6TG

128Kbit Serial-I2C EEPROM, 8-Pin UFDFPN, 3.3V/5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BFCS6TP/K

128Kbit Serial-I2C EEPROM, 16Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-DRMF3TG/K

128Kbit Serial I2C EEPROM, 1.8-5.5V, 125C, AEC-Q100

HVSON,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-DRDW3TP/K

Automotive 128-Kbit serial I2C bus EEPROM

TSSOP,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BRMC6TG

128Kbit I2C EEPROM, 16Kx8, 8-Pin UFDFPN, 1MHz, 1.8-5.5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BFMC6TG

128 Kbit Serial I2C Bus EEPROM

HVSON, SOLCC8,.11,20

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BWMN6TP

128Kb I2C EEPROM, 1MHz, SOIC, 2.5-5.5V

SOP-8

Not Recommended

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 128Kb

M24128-BFMC6TP

128Kbit I2C EEPROM, 1.8-5V, 8-Pin UFDFPN, 1MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BFCS6TG/K

128Kbit I2C EEPROM, 1.8-5V, 8-Pin WLCSP, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

Search Results for "M24128-DFMN6TP"

Filters

M24128-BRDW6TP

128Kb I2C EEPROM, 900ns Access, 400kHz, TSSOP

TSSOP,

Active

Access Time: 900ns

Access Time-Max: 900ns

Package/Case: TSSOP

Density: 128Kb

+22

M24128-BRMN6TP

128Kb I2C EEPROM, 450ns Access, SOIC, 5.5V

SOP,

Active

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 128Kb

+20

M24128X-FCU6T/TF

128Kb I2C EEPROM, Serial Memory IC, CSP

Active

Memory IC Type: EEPROM

M24128-BWMC6TP

128Kbit Serial-I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin UFDFPN SMT

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BRCS6TP/K

128Kbit I2C EEPROM, 16Kx8, 8-Pin WLCSP, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BFMH6TG

128K Serial I2C EEPROM | Industrial | 1.7x1.4mm

VBCC, SOLCC5,.06,16

Active

Max Operating Temperature: 85

Number of Terminals: 5

Min Operating Temperature: -40

Terminal Position: BOTTOM

M24128-BWMN3TP/P

128Kbit I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin SOIC, 0.4MHz

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

+26

M24128-BRCS6TG/K

128Kb I2C EEPROM, 8-Pin WLCSP, 1.8-5.5V, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-BWCS6TG/K

128Kbit I2C EEPROM, 16Kx8, 3.3V/5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-DRDW8TP/K

128-Kbit serial I2C bus EEPROM 105°C operation

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 105

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-DRMN8TP/K

128-Kbit serial I2C bus EEPROM 105°C operation

SOP, SOP8,.25

Active

Max Operating Temperature: 105

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BWMC6TG

128Kbit Serial-I2C EEPROM, 8-Pin UFDFPN, 3.3V/5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BFCS6TP/K

128Kbit Serial-I2C EEPROM, 16Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-DRMF3TG/K

128Kbit Serial I2C EEPROM, 1.8-5.5V, 125C, AEC-Q100

HVSON,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-DRDW3TP/K

Automotive 128-Kbit serial I2C bus EEPROM

TSSOP,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BRMC6TG

128Kbit I2C EEPROM, 16Kx8, 8-Pin UFDFPN, 1MHz, 1.8-5.5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BFMC6TG

128 Kbit Serial I2C Bus EEPROM

HVSON, SOLCC8,.11,20

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24128-BWMN6TP

128Kb I2C EEPROM, 1MHz, SOIC, 2.5-5.5V

SOP-8

Not Recommended

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 128Kb

M24128-BFMC6TP

128Kbit I2C EEPROM, 1.8-5V, 8-Pin UFDFPN, 1MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24128-BFCS6TG/K

128Kbit I2C EEPROM, 1.8-5V, 8-Pin WLCSP, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package