Search Results for &quot; M24M01-DFMN6TP &quot;

256-Kbit serial I2C bus EEPROM

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24C64-DFDW6TP

64-Kbit Serial I2C bus EEPROM

TSSOP, TSSOP8,.25

Active

Access Time-Max: 450ns

Package/Case: TSSOP

Density: 64Kb

Interface: I2C, Serial, 2-Wire

+11

M24128-DFDW6TG

128Kbit Serial-I2C EEPROM, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24512-DFDW6TG

512Kbit Serial I2C EEPROM, 64Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24128-DFCS6TP/K

128Kb I2C EEPROM, 1.8-5V, 8-Pin WLCSP, 1MHz

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-DFCS6TG/K

256Kbit Serial-I2C EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24512-DFCS6TP/K

512Kbit Serial I2C EEPROM, 1.7-5.5V, 85C, PBGA-B8

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M24256-DFCS6TP/K

256Kbit Serial-I2C EEPROM, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-DFDW6TP

128Kbit EEPROM Serial-I2C 16Kx8 1.8-5V TSSOP 8-Pin SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24C32-DFDW6TP

32 Kbit serial I2C bus EEPROM

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24C16-DFCU6TP/K

16-Kbit serial I2C bus EEPROM

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 4

Min Operating Temperature: -40

Terminal Position: BOTTOM

+13

M24128-DFCS6TG/K

128Kb Serial I2C EEPROM, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24512-DFDW6TP

512Kbit Serial I2C bus EEPROM with three Chip Enable Lines

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24512-DFCS6TG/K

I2C/2-WIRE SERIAL EEPROM

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M24C64-DFCT6TP/K

64-Kbit Serial I2C EEPROM, Industrial, 1.7-5.5V, 8-Pin PBGA

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

DFMC15/12-ST-35-LR

Phoenix Contact

PHOENIX CONTACT DFMC 1,5/12-ST-3,5-LR Pluggable Terminal Block, 12 Ways, 160 V, 8 A, 3.5 mm, 24 AWG, 16 AWG

Volume Production

Contact Gender: Female

Current Rating: 8A

Reach SVHC Compliant: Unknown

Series: DFMC

M240

Universal housing light grey 250 x 160 x 90 mm Polycarbonate IP 65 EUROMAS, M 240, Bopla

Volume Production

Color: Grey

Material: Polycarbonate

Ratings: IP65

Series: EUROMAS

M249

Osram

OSRAM M249 SPOT LIGHT, DECOSTAR 51S, 50W

Volume Production

Length: 45mm

Mount: Base

Operating Supply Voltage: 12V

Reach SVHC Compliant: No

M242

Universal housing light grey 240 x 120 x 100 mm Polycarbonate IP 65 EUROMAS, M 242, Bopla

Volume Production

Package/Case: 100

Color: Grey

Material: Polycarbonate

Ratings: IP65

M95128-DFMC6G

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 1.8-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

Search Results for "M24M01-DFMN6TP"

Filters

M24256-DFDW6TP

256-Kbit serial I2C bus EEPROM

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24C64-DFDW6TP

64-Kbit Serial I2C bus EEPROM

TSSOP, TSSOP8,.25

Active

Access Time-Max: 450ns

Package/Case: TSSOP

Density: 64Kb

Interface: I2C, Serial, 2-Wire

+11

M24128-DFDW6TG

128Kbit Serial-I2C EEPROM, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24512-DFDW6TG

512Kbit Serial I2C EEPROM, 64Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24128-DFCS6TP/K

128Kb I2C EEPROM, 1.8-5V, 8-Pin WLCSP, 1MHz

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-DFCS6TG/K

256Kbit Serial-I2C EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24512-DFCS6TP/K

512Kbit Serial I2C EEPROM, 1.7-5.5V, 85C, PBGA-B8

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M24256-DFCS6TP/K

256Kbit Serial-I2C EEPROM, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-DFDW6TP

128Kbit EEPROM Serial-I2C 16Kx8 1.8-5V TSSOP 8-Pin SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24C32-DFDW6TP

32 Kbit serial I2C bus EEPROM

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24C16-DFCU6TP/K

16-Kbit serial I2C bus EEPROM

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 4

Min Operating Temperature: -40

Terminal Position: BOTTOM

+13

M24128-DFCS6TG/K

128Kb Serial I2C EEPROM, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24512-DFDW6TP

512Kbit Serial I2C bus EEPROM with three Chip Enable Lines

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24512-DFCS6TG/K

I2C/2-WIRE SERIAL EEPROM

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M24C64-DFCT6TP/K

64-Kbit Serial I2C EEPROM, Industrial, 1.7-5.5V, 8-Pin PBGA

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

DFMC15/12-ST-35-LR

Phoenix Contact

PHOENIX CONTACT DFMC 1,5/12-ST-3,5-LR Pluggable Terminal Block, 12 Ways, 160 V, 8 A, 3.5 mm, 24 AWG, 16 AWG

Volume Production

Contact Gender: Female

Current Rating: 8A

Reach SVHC Compliant: Unknown

Series: DFMC

M240

Universal housing light grey 250 x 160 x 90 mm Polycarbonate IP 65 EUROMAS, M 240, Bopla

Volume Production

Color: Grey

Material: Polycarbonate

Ratings: IP65

Series: EUROMAS

M249

Osram

OSRAM M249 SPOT LIGHT, DECOSTAR 51S, 50W

Volume Production

Length: 45mm

Mount: Base

Operating Supply Voltage: 12V

Reach SVHC Compliant: No

M242

Universal housing light grey 240 x 120 x 100 mm Polycarbonate IP 65 EUROMAS, M 242, Bopla

Volume Production

Package/Case: 100

Color: Grey

Material: Polycarbonate

Ratings: IP65

M95128-DFMC6G

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 1.8-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad