Search Results for &quot; M95040-DFMC6TG &quot;

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-DFDW6TP

128Kbit SPI EEPROM, 1.8-5V, 8-Pin TSSOP, 5MHz

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-DFCS6TG/K

128Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95M01-DFCS6TP/K

1M-bit Serial-SPI EEPROM, 128Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95512-DFDW6TP

512Kbit Serial Bus EEPROM

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+15

M95640-DFCT6TP/K

64-Kbit SPI bus EEPROM with high-speed clock

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M95160-DFDW6TP

16-Kbit SPI bus EEPROM with high-speed clock

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+13

M95320-DFDW6TP

32-Kbit SPI bus EEPROM with high-speed clock

R-PDSO-G8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFDW6TP

Serial SPI EEPROM 256K-bit 32Kx8 1.8-5V 8-Pin TSSOP SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-DFCS6TP/K

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6P/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TG/A

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95640-DFDW6TP

64-Kbit SPI bus EEPROM with high-speed clock

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95M01-DFCT6TP/K

EEPROM Serial-SPI 1M-bit 128K x 8 1.8V/2.5V/3.3V/5V T/R

Unconfirmed

Density: 1Mbit

Interface Type: Serial-SPI

Maximum Operating Frequency: 16MHz

Maximum Access Time: 25ns

+11

M95256-DFCS6TP/AB

256Kbit Serial-SPI EEPROM, 32Kx8, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

DFM1E1

Rectifier Diode, 1 Element, 1A, 100V V(RRM), Silicon

O-PALF-W2

Transferred

RoHS Compliant: No

M95256-DFCS6TG/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

DFM1D1

Rectifier Diode, 1 Element, 1A, 100V V(RRM), Silicon

O-PALF-W2

Transferred

Max Operating Temperature: 150

Number of Terminals: 2

Terminal Position: AXIAL

Number of Elements: 1

TZE-M951

Brother

Label tape 24 mm black on silver, TZE-M951, Brother

Volume Production

Color: Black, Silver

DFM3MF2

Rectifier Diode, 1 Phase, 1 Element, 3A, 200V V(RRM), Silicon

R-PDSO-C2

Transferred

RoHS Compliant: Yes

Search Results for "M95040-DFMC6TG"

Filters

M95256-DFDW6TG

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-DFDW6TP

128Kbit SPI EEPROM, 1.8-5V, 8-Pin TSSOP, 5MHz

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-DFCS6TG/K

128Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95M01-DFCS6TP/K

1M-bit Serial-SPI EEPROM, 128Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95512-DFDW6TP

512Kbit Serial Bus EEPROM

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+15

M95640-DFCT6TP/K

64-Kbit SPI bus EEPROM with high-speed clock

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M95160-DFDW6TP

16-Kbit SPI bus EEPROM with high-speed clock

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+13

M95320-DFDW6TP

32-Kbit SPI bus EEPROM with high-speed clock

R-PDSO-G8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFDW6TP

Serial SPI EEPROM 256K-bit 32Kx8 1.8-5V 8-Pin TSSOP SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-DFCS6TP/K

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6P/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TG/A

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95640-DFDW6TP

64-Kbit SPI bus EEPROM with high-speed clock

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95M01-DFCT6TP/K

EEPROM Serial-SPI 1M-bit 128K x 8 1.8V/2.5V/3.3V/5V T/R

Unconfirmed

Density: 1Mbit

Interface Type: Serial-SPI

Maximum Operating Frequency: 16MHz

Maximum Access Time: 25ns

+11

M95256-DFCS6TP/AB

256Kbit Serial-SPI EEPROM, 32Kx8, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

DFM1E1

Rectifier Diode, 1 Element, 1A, 100V V(RRM), Silicon

O-PALF-W2

Transferred

RoHS Compliant: No

M95256-DFCS6TG/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

DFM1D1

Rectifier Diode, 1 Element, 1A, 100V V(RRM), Silicon

O-PALF-W2

Transferred

Max Operating Temperature: 150

Number of Terminals: 2

Terminal Position: AXIAL

Number of Elements: 1

TZE-M951

Brother

Label tape 24 mm black on silver, TZE-M951, Brother

Volume Production

Color: Black, Silver

DFM3MF2

Rectifier Diode, 1 Phase, 1 Element, 3A, 200V V(RRM), Silicon