Search Results for &quot; M95128-DFMN6TP &quot;

16Kb SPI EEPROM, 10MHz, 40ns Access, SOIC, 5.5V

SOP, SOP8,.25

Active

Access Time: 60ns

Access Time-Max: 40ns

Package/Case: SOIC

Density: 16Kb

M95160-RDW6TP

16 Kbit SPI bus EEPROM with high-speed clock

TSSOP, TSSOP8,.25

Active

Access Time: 80ns

Access Time-Max: 80ns

Package/Case: TSSOP

Density: 16Kb

+19

M95160-WDW6TP

16 Kbit SPI bus EEPROM with high-speed clock

TSSOP, TSSOP8,.25

Active

Access Time: 40ns

Access Time-Max: 40ns

Package/Case: TSSOP

Density: 16Kb

+17

M95160-WMN3TP/S

2KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH,ROHS COMPLIANT, PLASTIC SOP-8

0.150 INCH,ROHS COMPLIANT, PLASTIC SOP-8

Obsolete

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95160-WMN3TP/W

2KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SO-8

0.150 INCH, ROHS COMPLIANT, PLASTIC, SO-8

Obsolete

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95160-FDW6TP

2KX8 SPI BUS SERIAL EEPROM, PDSO8, ROHS COMPLIANT, TSSOP-8

ROHS COMPLIANT, TSSOP-8

Active

Access Time-Max: 120ns

Package/Case: TSSOP

Density: 16Kb

Frequency: 10MHz

+13

M95160-RMC6TG

16 Kbit SPI bus EEPROM with high-speed clock

HVSON,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+12

M95160-DRMN8TP/K

16-Kbit serial SPI bus EEPROM with high speed clock 105°C operation

SOP, SOP8,.25

Active

Max Operating Temperature: 105

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95160-DRDW3TP/K

Automotive 16-Kbit SPI bus EEPROM with high speed clock

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95160-DRMN3TG/K

SPI BUS SERIAL EEPROM

SOP-8

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+14

M95160-DRMN3TP/K

Automotive 16-Kbit SPI bus EEPROM with high speed clock

SOP, SOP8,.25

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFCS6G/K

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95M01-DFDW6P

1M-bit Serial-SPI EEPROM, 128Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95M01-DFCS6P/K

1M-bit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

+25

M95512-DFDW6G

512Kbit SPI EEPROM, 8-Pin TSSOP, 1.8-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-DFCS6P/A

256Kbit EEPROM Serial-SPI 8-Pin WLCSP 1.8-5V 20MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFDW6G

Serial SPI EEPROM 256Kbit 32Kx8 8-Pin TSSOP 1.8-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-DFDW6P

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-DFCS6G/A

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6P/K

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

Search Results for "M95128-DFMN6TP"

Filters

M95160-WMN6TP

16Kb SPI EEPROM, 10MHz, 40ns Access, SOIC, 5.5V

SOP, SOP8,.25

Active

Access Time: 60ns

Access Time-Max: 40ns

Package/Case: SOIC

Density: 16Kb

M95160-RDW6TP

16 Kbit SPI bus EEPROM with high-speed clock

TSSOP, TSSOP8,.25

Active

Access Time: 80ns

Access Time-Max: 80ns

Package/Case: TSSOP

Density: 16Kb

+19

M95160-WDW6TP

16 Kbit SPI bus EEPROM with high-speed clock

TSSOP, TSSOP8,.25

Active

Access Time: 40ns

Access Time-Max: 40ns

Package/Case: TSSOP

Density: 16Kb

+17

M95160-WMN3TP/S

2KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH,ROHS COMPLIANT, PLASTIC SOP-8

0.150 INCH,ROHS COMPLIANT, PLASTIC SOP-8

Obsolete

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95160-WMN3TP/W

2KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SO-8

0.150 INCH, ROHS COMPLIANT, PLASTIC, SO-8

Obsolete

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95160-FDW6TP

2KX8 SPI BUS SERIAL EEPROM, PDSO8, ROHS COMPLIANT, TSSOP-8

ROHS COMPLIANT, TSSOP-8

Active

Access Time-Max: 120ns

Package/Case: TSSOP

Density: 16Kb

Frequency: 10MHz

+13

M95160-RMC6TG

16 Kbit SPI bus EEPROM with high-speed clock

HVSON,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+12

M95160-DRMN8TP/K

16-Kbit serial SPI bus EEPROM with high speed clock 105°C operation

SOP, SOP8,.25

Active

Max Operating Temperature: 105

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95160-DRDW3TP/K

Automotive 16-Kbit SPI bus EEPROM with high speed clock

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95160-DRMN3TG/K

SPI BUS SERIAL EEPROM

SOP-8

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+14

M95160-DRMN3TP/K

Automotive 16-Kbit SPI bus EEPROM with high speed clock

SOP, SOP8,.25

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFCS6G/K

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95M01-DFDW6P

1M-bit Serial-SPI EEPROM, 128Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95M01-DFCS6P/K

1M-bit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

+25

M95512-DFDW6G

512Kbit SPI EEPROM, 8-Pin TSSOP, 1.8-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-DFCS6P/A

256Kbit EEPROM Serial-SPI 8-Pin WLCSP 1.8-5V 20MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFDW6G

Serial SPI EEPROM 256Kbit 32Kx8 8-Pin TSSOP 1.8-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-DFDW6P

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-DFCS6G/A

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6P/K

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package