Search Results for &quot; M95256-RMB6TG &quot;

32KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

SOP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFMN6P

256Kbit SPI EEPROM, 32Kx8, 1.8-5V, 20MHz, SOIC-8

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95256-DFMC6P

256Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 20MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95256-DFCS6G/K

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DRMN6P

32X8 SPI BUS SERIAL EEPROM, 80ns, PDSO8, 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8

0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DRMN3P/K

32KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SON-8

0.150 INCH, PLASTIC, SON-8

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFDW6G

Serial SPI EEPROM 256Kbit 32Kx8 8-Pin TSSOP 1.8-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-WMW6TG

256Kb SPI EEPROM, 60ns Access, SOIC, 5MHz

SOP, SOP8,.3

Obsolete

Access Time: 60ns

Access Time-Max: 60ns

Package/Case: SOIC

Density: 256Kb

+20

M93C66-RMB6TP

256 X 16 MICROWIRE BUS SERIAL EEPROM, DSO8, 2 X 3 MM, ROHS COMPLIANT, MLP-8

2 X 3 MM, ROHS COMPLIANT, MLP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFMN6G

256Kbit SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin SOIC, 20MHz

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95256-WMN6TP

256Kb SPI EEPROM, 5MHz, SOIC, 60ns Access

SOP, SOP8,.25

Active

Access Time: 60ns

Access Time-Max: 60ns

Package/Case: SOIC

Density: 256Kb

M95256-WMN6TG

32KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

SOP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256RMN6TP

32X8 SPI BUS SERIAL EEPROM, 80ns, PDSO8, 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFMC6TP

256Kbit SPI EEPROM, 8-Pin UFDFPN, 20MHz, 1.8-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95256-DFCS6TP/A

256Kbit EEPROM Serial-SPI WLCSP 8-Pin 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TG/K

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DRDW6TP

32X8 SPI BUS SERIAL EEPROM, 80ns, PDSO8, 0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8

0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8

Obsolete

Access Time-Max: 150ns

Package/Case: TSSOP

Density: 256Kb

Frequency: 20MHz

+12

M95256-RCS6TP/A

256Kbit EEPROM Serial-SPI WLCSP 8-Pin 2.5-5V

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6P/A

256Kbit EEPROM Serial-SPI 8-Pin WLCSP 1.8-5V 20MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256RMN6P

32X8 SPI BUS SERIAL EEPROM, 80ns, PDSO8, 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

Search Results for "M95256-RMB6TG"

Filters

M95256-WMN6G

32KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

SOP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFMN6P

256Kbit SPI EEPROM, 32Kx8, 1.8-5V, 20MHz, SOIC-8

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95256-DFMC6P

256Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 20MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95256-DFCS6G/K

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DRMN6P

32X8 SPI BUS SERIAL EEPROM, 80ns, PDSO8, 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8

0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DRMN3P/K

32KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SON-8

0.150 INCH, PLASTIC, SON-8

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFDW6G

Serial SPI EEPROM 256Kbit 32Kx8 8-Pin TSSOP 1.8-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-WMW6TG

256Kb SPI EEPROM, 60ns Access, SOIC, 5MHz

SOP, SOP8,.3

Obsolete

Access Time: 60ns

Access Time-Max: 60ns

Package/Case: SOIC

Density: 256Kb

+20

M93C66-RMB6TP

256 X 16 MICROWIRE BUS SERIAL EEPROM, DSO8, 2 X 3 MM, ROHS COMPLIANT, MLP-8

2 X 3 MM, ROHS COMPLIANT, MLP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFMN6G

256Kbit SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin SOIC, 20MHz

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95256-WMN6TP

256Kb SPI EEPROM, 5MHz, SOIC, 60ns Access

SOP, SOP8,.25

Active

Access Time: 60ns

Access Time-Max: 60ns

Package/Case: SOIC

Density: 256Kb

M95256-WMN6TG

32KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

SOP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256RMN6TP

32X8 SPI BUS SERIAL EEPROM, 80ns, PDSO8, 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFMC6TP

256Kbit SPI EEPROM, 8-Pin UFDFPN, 20MHz, 1.8-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95256-DFCS6TP/A

256Kbit EEPROM Serial-SPI WLCSP 8-Pin 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TG/K

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DRDW6TP

32X8 SPI BUS SERIAL EEPROM, 80ns, PDSO8, 0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8

0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8

Obsolete

Access Time-Max: 150ns

Package/Case: TSSOP

Density: 256Kb

Frequency: 20MHz

+12

M95256-RCS6TP/A

256Kbit EEPROM Serial-SPI WLCSP 8-Pin 2.5-5V

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6P/A

256Kbit EEPROM Serial-SPI 8-Pin WLCSP 1.8-5V 20MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256RMN6P

32X8 SPI BUS SERIAL EEPROM, 80ns, PDSO8, 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL