Search Results for &quot; M95256-RMB6TG &quot;

256Kbit SPI EEPROM, 5V, 8-Pin, AEC-Q100, 125°C

SOP, SOP8,.25

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-WMN3TG/AB

32KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Obsolete

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DRMN8TP/K

256-Kbit serial SPI bus EEPROM with high speed clock 105°C operation

SOP, SOP8,.25

Active

Max Operating Temperature: 105

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256WMN6TP

32X8 SPI BUS SERIAL EEPROM, 40ns, PDSO8, 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFDW6TP

Serial SPI EEPROM 256K-bit 32Kx8 1.8-5V 8-Pin TSSOP SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-DFMN6TP

Serial SPI EEPROM 256Kbit 32Kx8 1.8-5V SOIC-8

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95256-DFMC6TG

256Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 20MHz

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

+25

M95256-DFCS6TP/K

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6P/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TG/A

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DRDW3TP/K

Automotive 256 Kbit SPI bus EEPROM with high speed clock

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DRMF3TG/K

Automotive 256 Kbit SPI bus EEPROM with high speed clock

HVSON,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFCS6TG/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24LR64-RMB6T/2

IC RFID TRANSP 13.56MHZ 8UFDFPN

End of Life

Access Time-Max: 900ns

Density: 64Kb

Frequency: 13.56MHz

Interface: I2C, Serial

M24C32-RMB6T

4KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, MLP-8

2 X 3 MM, MLP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24C04-RMB6TP

512X8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, MLP-8

2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, MLP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

RMB6S

Multicomp

MULTICOMP RMB6S Bridge Rectifier Diode, RMBx Series, Single, 600 V, 500 mA, SMD, 1 V, 4 Pins

Micro Commercial Components

Volume Production

Package/Case: SMD/SMT

Forward Current: 500mA

Max Operating Temperature: 150°C

Min Operating Temperature: -55°C

RMB6S-TP

Bridge Rectifier Diode, 1 Phase, 0.5A, 600V V(RRM), Silicon, ROHS COMPLIANT, PLASTIC, MBS-1, 4 PIN

R-PDSO-G4

Active

Max Operating Temperature: 150

Number of Terminals: 4

Terminal Position: DUAL

Pin Count: 4

M24C32-RMB6

4KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, MLP-8

2 X 3 MM, MLP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M9520010BK001

Alpha Wire

Cble; Paired; 1 Pr; 20 AWG; 7x28Str Strndng; Overall Foil Shld; PVC Ins; Blk; PVC Jkt

Volume Production

Approvals: UL, CSA

Package/Case: 300

Color: Black

Conductor Material: Copper

Search Results for "M95256-RMB6TG"

Filters

M95256-DRMN3TP/K

256Kbit SPI EEPROM, 5V, 8-Pin, AEC-Q100, 125°C

SOP, SOP8,.25

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-WMN3TG/AB

32KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Obsolete

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DRMN8TP/K

256-Kbit serial SPI bus EEPROM with high speed clock 105°C operation

SOP, SOP8,.25

Active

Max Operating Temperature: 105

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256WMN6TP

32X8 SPI BUS SERIAL EEPROM, 40ns, PDSO8, 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFDW6TP

Serial SPI EEPROM 256K-bit 32Kx8 1.8-5V 8-Pin TSSOP SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-DFMN6TP

Serial SPI EEPROM 256Kbit 32Kx8 1.8-5V SOIC-8

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95256-DFMC6TG

256Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 20MHz

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

+25

M95256-DFCS6TP/K

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6P/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TG/A

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DRDW3TP/K

Automotive 256 Kbit SPI bus EEPROM with high speed clock

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DRMF3TG/K

Automotive 256 Kbit SPI bus EEPROM with high speed clock

HVSON,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFCS6TG/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24LR64-RMB6T/2

IC RFID TRANSP 13.56MHZ 8UFDFPN

End of Life

Access Time-Max: 900ns

Density: 64Kb

Frequency: 13.56MHz

Interface: I2C, Serial

M24C32-RMB6T

4KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, MLP-8

2 X 3 MM, MLP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24C04-RMB6TP

512X8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, MLP-8

2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, MLP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

RMB6S

Multicomp

MULTICOMP RMB6S Bridge Rectifier Diode, RMBx Series, Single, 600 V, 500 mA, SMD, 1 V, 4 Pins

Micro Commercial Components

Volume Production

Package/Case: SMD/SMT

Forward Current: 500mA

Max Operating Temperature: 150°C

Min Operating Temperature: -55°C

RMB6S-TP

Bridge Rectifier Diode, 1 Phase, 0.5A, 600V V(RRM), Silicon, ROHS COMPLIANT, PLASTIC, MBS-1, 4 PIN

R-PDSO-G4

Active

Max Operating Temperature: 150

Number of Terminals: 4

Terminal Position: DUAL

Pin Count: 4

M24C32-RMB6

4KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, MLP-8

2 X 3 MM, MLP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M9520010BK001

Alpha Wire

Cble; Paired; 1 Pr; 20 AWG; 7x28Str Strndng; Overall Foil Shld; PVC Ins; Blk; PVC Jkt

Volume Production

Approvals: UL, CSA

Package/Case: 300

Color: Black

Conductor Material: Copper