Unshrouded 50-Contact HDR Header, 2mm Pitch, Through Hole Mount, -55°C to 105°C
4-Contact Unshrouded Header, HDR, 2.54mm Pitch, Through Hole Mount
10-Contact Unshrouded Header, HDR, 2mm Pitch, Through Hole Mount
Conn Unshrouded Header HDR 14 POS 2.54mm Solder ST Top Entry Thru-Hole
29-Contact Unshrouded Header, 2mm Pitch, 3A/Contact, -55°C to 125°C
3-Contact Through Hole Header, Gold Plated, 2.54mm Pitch, Solder Termination
14-Pin Male Through Hole Header, Gold Plated, 2.54mm Pitch, RoHS Compliant
14-Contact Through-Hole Header, Gold Plated, 2.54mm Pitch, Solder Termination
Commercial Temperature 1.8V BGA-272 Telecom IC
Telecom Circuit, 1-Func, BICMOS, PBGA256, 27 X 27 MM, 2.33 MM HEIGHT, THERMALLY ENHANCED, PLASTIC, BGA-256
Telecom Circuit, 1-Func, PBGA456, 35 X 35 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, BGA-456
Telecom Circuit, 1-Func, PBGA272, 27 X 27 MM, 2.33 MM HEIGHT, PLASTIC, BGA-272
Conn Board Stacker HDR 3 POS 2.54mm Solder ST Top Entry Thru-Hole Bulk
13-Position Through Hole Shrouded Header, Black, Tin Plated
Framer, CMOS, PBGA324, 23 X 23 MM, 2.33 MM HEIGHT, PLASTIC, BGA-324
LAN Switching Circuit, CMOS, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, MS-034, HSBGA-553
74AUP1G74 - Low-power D-type flip-flop with set and reset; positive-edge trigger QFN 8-Pin
Dual-Port SRAM, 512KX72, 11ns, CMOS, PBGA484, 27 X 27 MM, 2.33 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-484
DUAL-PORT SRAM 1.42V-1.58V 1.5V 1.8mA 200MHz 484-Pin BGA
Dual-Port SRAM, 1MX36, 9ns, CMOS, PBGA484, 27 X 27 MM, 2.33 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-484
