Search Results for &quot; MCIMX31LCVMN4DR2 &quot;

32-BIT, 400MHz, MICROPROCESSOR, PBGA473

MAPBGA-473

Active

Max Operating Temperature: 85

Number of Terminals: 473

Min Operating Temperature: -40

Terminal Position: BOTTOM

+15

MCIMX31DVMN5DR2

ARM1136JF-S Microprocessor IC i.MX31 1 Core, 32-Bit 532MHz

Obsolete

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

+13

MCIMX31CJMN4DR2

ARM1136JF-S Microprocessor IC i.MX31 1 Core, 32-Bit 400MHz

Obsolete

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

+10

MCIMX31CVKN5DR2

ARM1136JF-S Microprocessor IC i.MX31 1 Core, 32-Bit 532MHz

Obsolete

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

+12

MCIMX31DVKN5DR2

ARM1136JF-S Microprocessor IC i.MX31 1 Core, 32-Bit 532MHz

End of Life

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

+16

MCIMX31CJMN4CR2

IC MPU 32BIT ROMLESS 473MAPBGA

Volume Production

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

+12

MCIMX35WPDK

FREESCALE SEMICONDUCTOR MCIMX35WPDK I.MX35, WINCE 6.0, PRODUCT DEV KIT

Obsolete

Core Architecture: ARM

Evaluation Kit: Yes

Lead Free: Lead Free

Mount: Hardware

MCIMX35LPDK

Development Boards & Kits - ARM I.MX35 PRODUCT DEVELOPME

Not Recommended for New Design

Core Architecture: ARM

Evaluation Kit: Yes

Interface: USB, CAN, Ethernet

Number of Bits: 32

MCIMX351AJQ5C

SPECIALTY CONSUMER CIRCUIT, PBGA400, 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

LFBGA,

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX351AVM4B

SPECIALTY CONSUMER CIRCUIT, PBGA400, 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX353DJQ5C

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX353CJQ5C

400-Pin PBGA Industrial Microprocessor IC, 17x17mm

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX355AJQ4C

i.MX35 SoC ARM1136JF-S 400MHz 32-bit 400-Pin MAP-BGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

+39

MCIMX357CJM5B

ARM1136JF-S Microprocessor IC i.MX35 1 Core, 32-Bit 532MHz 400-MAPBGA (17x17)

Obsolete

Package/Case: LFBGA

Core Architecture: ARM

Halogen Free: Halogen Free

Max Operating Temperature: 85°C

MCIMX353DVM5B

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX357DJQ5C

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX356AVM4B

i.MX35 32-bit MPU, ARM1136JF-S core, 400MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX356AVM5B

Rochester Electronics

SPECIALTY CONSUMER CIRCUIT, PBGA400, 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Active

Halogen Free: Halogen Free

Packaging: Tray

MCIMX351AJQ4C

SoC i.MX35 ARM1136JF-S 400MHz 32-bit 400-Pin MAP-BGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

+39

MCIMX356AJM4B

SoC i.MX35 ARM1136JF-S 400MHz 32-bit 400-Pin BGA