Search Results for &quot; MCIMX31LCVMN4DR2 &quot;

SoC i.MX35 ARM1136JF-S 532MHz 32-bit 128KB RAM 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

MCIMX357CVM5B

SPECIALTY CONSUMER CIRCUIT, PBGA400

LFBGA, BGA400,20X20,32

Active

Max Operating Temperature: 85

Number of Terminals: 400

Min Operating Temperature: -40

Terminal Position: BOTTOM

+10

MCIMX356AJQ5C

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

LFBGA,

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX355AVM5B

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX355AVM4B

i.MX35 32-bit MPU, ARM1136JF-S core, 400MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX357CJQ5C

32-bit MPU, ARM1136JF-S, 532MHz, 400-Pin PBGA, Industrial

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX351AJQ4C

SoC i.MX35 ARM1136JF-S 400MHz 32-bit 400-Pin MAP-BGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

MCIMX356AJM4B

SoC i.MX35 ARM1136JF-S 400MHz 32-bit 400-Pin BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

MCIMX353CJQ5C

i.MX35 SoC, ARM1136JF-S, 532MHz, 32-bit, 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

MCIMX355AJQ5C

i.MX35 SoC, ARM1136JF-S, 532MHz, 32-bit, 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

MCIMX355AVM5B

SPECIALTY CONSUMER CIRCUIT, PBGA400

LFBGA,

Active

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

+17

MCIMX353CVM5B

SPECIALTY CONSUMER CIRCUIT, PBGA400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Active

Max Operating Temperature: 85

Number of Terminals: 400

Min Operating Temperature: -40

Terminal Position: BOTTOM

+10

MCIMX356AJM5B

ARM1136JF-S Microprocessor IC i.MX35 1 Core, 32-Bit 532MHz 400-MAPBGA (17x17)

Obsolete

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

MCIMX356AVM4B

SPECIALTY CONSUMER CIRCUIT, PBGA400

LFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 400

Min Operating Temperature: -40

Terminal Position: BOTTOM

MCIMX357DVM5B

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX351AVM5B

SPECIALTY CONSUMER CIRCUIT, PBGA400, 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

LFBGA,

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX355AJQ5C

SPECIALTY CONSUMER CIRCUIT, PBGA400, 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

LFBGA,

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX357CVM5B

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX351AJQ5B

i.MX35 SoC, ARM1136JF-S, 532MHz, 32-bit, 400-Pin MAP-BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

MCIMX356AJQ5C

SoC i.MX35 ARM1136JF-S 532MHz 32-bit 400-Pin MAP-BGA