Search Results for "MN44256-10LL"

Filters

M24256-BWMN6P

Stmicroelectronics

256Kb I2C EEPROM, 900ns Access, SOIC, 5.5V

Datasheet

SOP, SOP8,.25

Not Recommended

Access Time: 900ns

Access Time-Max: 450ns

Package/Case: SOIC

Density: 256Kb

M24256-DFMC6G

Stmicroelectronics

256Kbit EEPROM, Serial-I2C, 8-Pin UFDFPN, 1MHz

Datasheet

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DRMF3TG/K

Stmicroelectronics

256Kbit Serial I2C EEPROM, 1.8-5.5V, 125C, AEC-Q100, SOIC-8

Datasheet

HVSON,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-DRCS6TG/K

Stmicroelectronics

256Kbit I2C EEPROM, 8-Pin WLCSP, 1MHz

Datasheet

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-DFCS6P/K

Stmicroelectronics

256Kbit Serial-I2C EEPROM, 8-Pin WLCSP, 1MHz

Datasheet

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-DFCS6G/K

Stmicroelectronics

256Kbit Serial-I2C EEPROM, 8-Pin WLCSP, 1.8-5V

Datasheet

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-DFCS6TG/K

Stmicroelectronics

256Kbit Serial-I2C EEPROM, 8-Pin WLCSP, 1.8-5V

Datasheet

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-BFMC6TG

Stmicroelectronics

256Kbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PDSO

Datasheet

HVSON, SOLCC8,.12,20

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-BFDW6TP

Stmicroelectronics

256Kb EEPROM, 32KX8, 1MHz, I2C, Serial, 2-Wire, 5.5V, 1.7V, 2.5mA, TSSOP

Datasheet

TSSOP, TSSOP8,.25

Active

Access Time-Max: 450ns

Package/Case: TSSOP

Density: 256Kb

Frequency: 1MHz

M24256-BWMW6G

Stmicroelectronics

32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Datasheet

SOP, SOP8,.3

Obsolete

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 256Kb

M24256-BRMN6G

Stmicroelectronics

32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Datasheet

0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-DRMN3TP/K

Stmicroelectronics

Automotive 256 Kbit serial I2C bus EEPROM

Datasheet

SOP, SOP8,.25

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-BRMC6TP

Stmicroelectronics

256Kbit Serial-I2C EEPROM, 32Kx8, 8-Pin UFDFPN, 2.5-5V

Datasheet

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BWMC6TG

Stmicroelectronics

256Kbit Serial-I2C EEPROM, 3.3V/5V, 8-Pin UFDFPN EP SMT

Datasheet

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BWMC6TP

Stmicroelectronics

256Kbit I2C EEPROM, 32Kx8, 3.3V/5V, 8-Pin UFDFPN SMT

Datasheet

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DRMN8TP/K

Stmicroelectronics

256-Kbit serial I2C bus EEPROM 105°C operation

Datasheet

SOP, SOP8,.25

Active

Max Operating Temperature: 105

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-BWMC6G

Stmicroelectronics

256Kbit Serial-I2C EEPROM, 3.3V/5V, 8-Pin UFDFPN EP

Datasheet

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BWMC6P

Stmicroelectronics

256Kbit Serial-I2C EEPROM, 3.3V/5V, 8-Pin UFDFPN EP

Datasheet

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DRMC6TG

Stmicroelectronics

256Kbit Serial-I2C EEPROM, 32Kx8, 8-Pin UFDFPN, 1MHz

Datasheet

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BWMN6T

Stmicroelectronics

32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8

Datasheet

SOP, SOP8,.25

Obsolete

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 256Kb

Search Results for "MN44256-10LL"

Filters

M24256-BWMN6P

Stmicroelectronics

256Kb I2C EEPROM, 900ns Access, SOIC, 5.5V

Datasheet

SOP, SOP8,.25

Not Recommended

Access Time: 900ns

Access Time-Max: 450ns

Package/Case: SOIC

Density: 256Kb

M24256-DFMC6G

Stmicroelectronics

256Kbit EEPROM, Serial-I2C, 8-Pin UFDFPN, 1MHz

Datasheet

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DRMF3TG/K

Stmicroelectronics

256Kbit Serial I2C EEPROM, 1.8-5.5V, 125C, AEC-Q100, SOIC-8

Datasheet

HVSON,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-DRCS6TG/K

Stmicroelectronics

256Kbit I2C EEPROM, 8-Pin WLCSP, 1MHz

Datasheet

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-DFCS6P/K

Stmicroelectronics

256Kbit Serial-I2C EEPROM, 8-Pin WLCSP, 1MHz

Datasheet

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-DFCS6G/K

Stmicroelectronics

256Kbit Serial-I2C EEPROM, 8-Pin WLCSP, 1.8-5V

Datasheet

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-DFCS6TG/K

Stmicroelectronics

256Kbit Serial-I2C EEPROM, 8-Pin WLCSP, 1.8-5V

Datasheet

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-BFMC6TG

Stmicroelectronics

256Kbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PDSO

Datasheet

HVSON, SOLCC8,.12,20

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-BFDW6TP

Stmicroelectronics

256Kb EEPROM, 32KX8, 1MHz, I2C, Serial, 2-Wire, 5.5V, 1.7V, 2.5mA, TSSOP

Datasheet

TSSOP, TSSOP8,.25

Active

Access Time-Max: 450ns

Package/Case: TSSOP

Density: 256Kb

Frequency: 1MHz

M24256-BWMW6G

Stmicroelectronics

32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Datasheet

SOP, SOP8,.3

Obsolete

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 256Kb

M24256-BRMN6G

Stmicroelectronics

32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Datasheet

0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-DRMN3TP/K

Stmicroelectronics

Automotive 256 Kbit serial I2C bus EEPROM

Datasheet

SOP, SOP8,.25

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-BRMC6TP

Stmicroelectronics

256Kbit Serial-I2C EEPROM, 32Kx8, 8-Pin UFDFPN, 2.5-5V

Datasheet

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BWMC6TG

Stmicroelectronics

256Kbit Serial-I2C EEPROM, 3.3V/5V, 8-Pin UFDFPN EP SMT

Datasheet

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BWMC6TP

Stmicroelectronics

256Kbit I2C EEPROM, 32Kx8, 3.3V/5V, 8-Pin UFDFPN SMT

Datasheet

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DRMN8TP/K

Stmicroelectronics

256-Kbit serial I2C bus EEPROM 105°C operation

Datasheet

SOP, SOP8,.25

Active

Max Operating Temperature: 105

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-BWMC6G

Stmicroelectronics

256Kbit Serial-I2C EEPROM, 3.3V/5V, 8-Pin UFDFPN EP

Datasheet

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BWMC6P

Stmicroelectronics

256Kbit Serial-I2C EEPROM, 3.3V/5V, 8-Pin UFDFPN EP

Datasheet

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DRMC6TG

Stmicroelectronics

256Kbit Serial-I2C EEPROM, 32Kx8, 8-Pin UFDFPN, 1MHz

Datasheet

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BWMN6T

Stmicroelectronics

32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8

Datasheet

SOP, SOP8,.25

Obsolete

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 256Kb