Search Results for &quot; PEF22554HTV2.1 &quot;

IC LIU E1/T1/J1 81LBGA

Obsolete

Package/Case: LBGA

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Power Dissipation: 250mW

PEF2256HV2.1

Framer and Line Interface Component for Long- and Short-Haul Applications

Lead-Frame SMT

Unconfirmed

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: MQFP

Package Description: Metric Quad Flat Package

+11

PEF22504EV2.1-G

IC LIU E1/T1/J1 160LBGA

Obsolete

Package/Case: LBGA

Lead Free: Contains Lead

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

PEF22508EV1.1

IC LIU E1/T1/J1 256LBGA

Obsolete

Package/Case: LBGA

Lead Free: Contains Lead

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

PEF22508EV1.1-G

IC LIU E1/T1/J1 256LBGA

Obsolete

Package/Case: LBGA

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Power Dissipation: 140mW

PEF22508EV11G

Framer and Line Interface Component for Long- and Short-Haul Applications

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

+10

PEF2256HV21XP

Framer and Line Interface Component for Long- and Short-Haul Applications

Lead-Frame SMT

Unconfirmed

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: MQFP

Package Description: Metric Quad Flat Package

LINE INTERFACE UNITS

Volume Production

Data Rate: 16.384Mbps

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Supply Voltage: 3.46V

PEF2256EV21NP

Framer and Line Interface Component for Long- and Short-Haul Applications

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

PEF22508EV11NP

Framer and Line Interface Component for Long- and Short-Haul Applications

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

LINE INTERFACE UNITS

Not Recommended for New Design

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Radiation Hardening: No

PEF22508EV11GXT

Framer and Line Interface Component for Long- and Short-Haul Applications

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

+10

PEF22508EV11GXP

Lantiq

Eight-Channel E1/T1/J1 Line Interface Unit

Volume Production

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Radiation Hardening: No

PEF2266HV2.2

Filter, Four Channel Codec Filter with PCM- and u-Controller Interface

Unconfirmed

PEF22624EV1.3-G

IC SHDSL TRANSCEIVER LBGA-324

Obsolete

Package/Case: LBGA

Lead Free: Lead Free

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

PEF22818F-V11

Highly integrated Layer 2 Ethernet over VDSL Switch

Lead-Frame SMT

Unconfirmed

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: TQFP

Package Description: Thin Quad Flat Package

PEF22624EV2.1-G

SHDSL transceivers designed for pure TDM applications

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

PEF22810T-V21

Highly integrated Layer 2 Ethernet over VDSL Switch

Lead-Frame SMT

Unconfirmed

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: DSO

Package Description: Dual Small Outline

PEF22815F-V11

Highly integrated Layer 2 Ethernet over VDSL Switch

Lead-Frame SMT

Unconfirmed

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: TQFP

Package Description: Thin Quad Flat Package

PEF22624EV2.2-G

IC DSL FRONT-END 2.2V 324-LBGA