Search Results for &quot; MCIMX357CJQ5C &quot;

32-bit MPU, ARM1136JF-S, 532MHz, 400-Pin PBGA, Industrial

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX357CJQ5C

Multifunction Peripheral IC, 24MHz, 1.33-1.47V, PBGA400

LFBGA, BGA400,20X20,32

Active

Max Operating Temperature: 85

Number of Terminals: 400

Min Operating Temperature: -40

Terminal Position: BOTTOM

+12

MCIMX357CJQ5CR2

SPECIALTY CONSUMER CIRCUIT

LFBGA,

Active

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

+16

MCIMX357CJQ4C

i.MX35 SoC, ARM1136JF-S, 400MHz, 128KB RAM, 0.09um, 400-Pin BGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

+27

MCIMX357CJM5B

ARM1136JF-S Microprocessor IC i.MX35 1 Core, 32-Bit 532MHz 400-MAPBGA (17x17)

Obsolete

Package/Case: LFBGA

Core Architecture: ARM

Halogen Free: Halogen Free

Max Operating Temperature: 85°C

MCIMX357CVM5B

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX357CVM5B

SPECIALTY CONSUMER CIRCUIT, PBGA400

LFBGA, BGA400,20X20,32

Active

Max Operating Temperature: 85

Number of Terminals: 400

Min Operating Temperature: -40

Terminal Position: BOTTOM

+10

MCIMX357CVM5BR2

Processors - Application Specialized i.MX35 Auto Apps Processor

Obsolete

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

+13

MCIMX357DJQ5C

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX357DJQ5C

SoC i.MX35 ARM1136JF-S 532MHz 32-bit 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

+39

MCIMX357DVM5B

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX357DVM5B

SPECIALTY CONSUMER CIRCUIT, PBGA400

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Active

Max Operating Temperature: 70

Number of Terminals: 400

Min Operating Temperature: -20

Terminal Position: BOTTOM

+10

MCIMX357DVM5BR2

SPECIALTY CONSUMER CIRCUIT

LFBGA,

Active

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

+13

MCIMX357DJQ5CR2

SoC i.MX35 ARM1136JF-S 532MHz 32-bit 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

+38

MCIMX353CJQ5C

400-Pin PBGA Industrial Microprocessor IC, 17x17mm

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX35WPDK

FREESCALE SEMICONDUCTOR MCIMX35WPDK I.MX35, WINCE 6.0, PRODUCT DEV KIT

Obsolete

Core Architecture: ARM

Evaluation Kit: Yes

Lead Free: Lead Free

Mount: Hardware

MCIMX35LPDK

Development Boards & Kits - ARM I.MX35 PRODUCT DEVELOPME

Not Recommended for New Design

Core Architecture: ARM

Evaluation Kit: Yes

Interface: USB, CAN, Ethernet

Number of Bits: 32

MCIMX353CJQ5C

i.MX35 SoC, ARM1136JF-S, 532MHz, 32-bit, 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

+39

MCIMX351AJQ5C

SPECIALTY CONSUMER CIRCUIT, PBGA400, 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

LFBGA,

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX351AVM4B

SPECIALTY CONSUMER CIRCUIT, PBGA400, 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400