Search Results for &quot; ADSP-BF504KCPZ-4 &quot;

Low Power Blackfin Processor with Advanced Peripherals and Low Standby Power

LFBGA, BGA289,23X23,20

Active

Package/Case: BGA

Contact Plating: Copper, Tin, Silver

Core Architecture: Blackfin

Data Bus Width: 16b

+17

ADSP-BF516BSWZ-4

DSP 16/32-bit Fixed-Point 400MHz LQFP 176-Pin SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP EP

Package Description: Low Profile Quad Flat Package, Exposed Pad

ADSP-BF512BSWZ-4

DSP 16/32-bit Fixed-Point 400MHz 176-Pin LQFP EP SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP EP

Package Description: Low Profile Quad Flat Package, Exposed Pad

ADSP-BF514BSWZ-3

DSP 16/32-bit Fixed-Point 300MHz 176-Pin LQFP EP SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP EP

Package Description: Low Profile Quad Flat Package, Exposed Pad

ADSP-BF527KBCZ-6

32-bit 600MHz DSP, Blackfin, 132KB, BGA, SM

LFBGA, BGA289,23X23,20

Active

Package/Case: BGA

Core Architecture: Blackfin

Data Bus Width: 32b

Density: 132KB

+28

ADSP-BF525KBCZ-5

Low Power Blackfin Processor with Advanced Peripherals

LFBGA, BGA289,23X23,20

Active

Package/Case: BGA

Contact Plating: Copper, Tin, Silver

Core Architecture: Blackfin

Data Bus Width: 16b

+19

ADSP-BF525ABCZ-6

Low Power Blackfin Processor with Advanced Peripherals

LFBGA, BGA289,23X23,20

Active

Package/Case: BGA

Core Architecture: Blackfin

Data Bus Width: 16b

Frequency: 600MHz

ADSP-BF523KBCZ-6

IC DSP 16BIT 600MHZ 289-CSBGA

Volume Production

Package/Case: BGA

Contact Plating: Copper, Tin, Silver

Core Architecture: Blackfin

Data Bus Width: 16b

ADSP-BF536BBC-4A

Blackfin Processor with Embedded Network Connectivity

MO-205AE, CSPBGA-182

Obsolete

Package/Case: BGA

Core Architecture: Blackfin

Data Bus Width: 16b

Frequency: 400MHz

ADSP-BF534BBC-5A

Blackfin Processor with CAN Connectivity for Automotive & Industrial Applications

MO-205AE, CSPBGA-182

Obsolete

Package/Case: BGA

Contact Plating: Tin, Silver, Lead

Core Architecture: Blackfin

Data Bus Width: 16b

ADSP-BF534BBC-4A

Blackfin Processor with CAN Connectivity for Automotive & Industrial Applications

MO-205AE, CSPBGA-182

Obsolete

Package/Case: BGA

Contact Plating: Tin, Silver, Lead

Core Architecture: Blackfin

Data Bus Width: 16b

ADSP-BF592BCPZ-2

Low Cost Blackfin with Optimized Peripheral Set for Industrial and General Purpose Applications

HVQCCN, LCC64,.35SQ,20

Active

Max Operating Temperature: 85

Number of Terminals: 64

Min Operating Temperature: -40

Terminal Position: QUAD

+12

ADSP-BF516BSWZ-3

DSP 16/32-bit Fixed-Point 300MHz 176-Pin LQFP EP SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP EP

Package Description: Low Profile Quad Flat Package, Exposed Pad

ADSP-BF512KSWZ-3

DSP 16/32-bit Fixed-Point 300MHz 176-Pin LQFP EP SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP EP

Package Description: Low Profile Quad Flat Package, Exposed Pad

ADSP-BF518BBCZ-4

DSP 16/32-bit 400MHz 168-Pin CSP-BGA Fixed-Point

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: CSP-BGA

Package Description: Chip Scale Ball Grid Array Package

ADSP-BF512BBCZ-4

DSP 16/32-bit Fixed-Point 400MHz 168-Pin CSP-BGA SM

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: CSP-BGA

Package Description: Chip Scale Ball Grid Array Package

ADSP-BF514KSWZ-3

DSP 16/32-bit Fixed-Point 300MHz 176-Pin LQFP EP SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP EP

Package Description: Low Profile Quad Flat Package, Exposed Pad

ADSP-BF512KBCZ-4

DSP Fixed-Point 16/32-bit 400MHz 168-Pin CSP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: CSP-BGA

Package Description: Chip Scale Ball Grid Array Package

ADSP-BF592KCPZ-2

400MHz 32b DSP, Blackfin, 68KB ROM, LFCSP EP, SM

HVQCCN, LCC64,.35SQ,20

Active

Package/Case: LFCSP EP

Contact Plating: Tin, Matte

Core Architecture: Blackfin

Data Bus Width: 32b

+27

ADSP-BF525ABCZ-5

Low Power Blackfin Processor with Advanced Peripherals