Search Results for &quot; M24C32-DFMN6TP &quot;

128Kbit EEPROM, Serial-I2C, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-DFCS6G/K

128Kbit EEPROM Serial-I2C 1.8-5V 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-DFCS6P/K

256Kbit Serial-I2C EEPROM, 8-Pin WLCSP, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24512-DFDW6P

512Kb Serial I2C EEPROM, 64Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24256-DFCS6G/K

256Kbit Serial-I2C EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-DFDW6G

128Kbit Serial-I2C EEPROM, 1.8-5V, 8-Pin TSSOP, 1MHz

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24128-DFDW6P

128Kbit Serial-I2C EEPROM, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

DFMC15/11-ST-35

Phoenix Contact

PHOENIX CONTACT DFMC 1,5/11-ST-3,5 Pluggable Terminal Block, 11 Ways, 160 V, 8 A, 3.5 mm, 24 AWG, 16 AWG

Volume Production

Contact Gender: Female

Current Rating: 8A

Mount: Push In

Number of Contacts: 22

M24256-DFCS6TP/K

256Kbit Serial-I2C EEPROM, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-DFDW6TP

128Kbit EEPROM Serial-I2C 16Kx8 1.8-5V TSSOP 8-Pin SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24M01-DFCS6TP/K

1-Mbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PBGA, Industrial

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M24512-DFDW6TG

512Kbit Serial I2C EEPROM, 64Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24128-DFDW6TG

128Kbit Serial-I2C EEPROM, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24128-DFCS6TP/K

128Kb I2C EEPROM, 1.8-5V, 8-Pin WLCSP, 1MHz

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-DFCS6TG/K

256Kbit Serial-I2C EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24512-DFCS6TP/K

512Kbit Serial I2C EEPROM, 1.7-5.5V, 85C, PBGA-B8

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M24256-DFDW6TP

256-Kbit serial I2C bus EEPROM

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+15

M24128-DFCS6TG/K

128Kb Serial I2C EEPROM, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24M01-DFDW6TP

1Mbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PDSO

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24512-DFDW6TP

512Kbit Serial I2C bus EEPROM with three Chip Enable Lines

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

Search Results for "M24C32-DFMN6TP"

Filters

M24128-DFCS6P/K

128Kbit EEPROM, Serial-I2C, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-DFCS6G/K

128Kbit EEPROM Serial-I2C 1.8-5V 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-DFCS6P/K

256Kbit Serial-I2C EEPROM, 8-Pin WLCSP, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24512-DFDW6P

512Kb Serial I2C EEPROM, 64Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24256-DFCS6G/K

256Kbit Serial-I2C EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-DFDW6G

128Kbit Serial-I2C EEPROM, 1.8-5V, 8-Pin TSSOP, 1MHz

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24128-DFDW6P

128Kbit Serial-I2C EEPROM, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

DFMC15/11-ST-35

Phoenix Contact

PHOENIX CONTACT DFMC 1,5/11-ST-3,5 Pluggable Terminal Block, 11 Ways, 160 V, 8 A, 3.5 mm, 24 AWG, 16 AWG

Volume Production

Contact Gender: Female

Current Rating: 8A

Mount: Push In

Number of Contacts: 22

M24256-DFCS6TP/K

256Kbit Serial-I2C EEPROM, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24128-DFDW6TP

128Kbit EEPROM Serial-I2C 16Kx8 1.8-5V TSSOP 8-Pin SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24M01-DFCS6TP/K

1-Mbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PBGA, Industrial

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M24512-DFDW6TG

512Kbit Serial I2C EEPROM, 64Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24128-DFDW6TG

128Kbit Serial-I2C EEPROM, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M24128-DFCS6TP/K

128Kb I2C EEPROM, 1.8-5V, 8-Pin WLCSP, 1MHz

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-DFCS6TG/K

256Kbit Serial-I2C EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24512-DFCS6TP/K

512Kbit Serial I2C EEPROM, 1.7-5.5V, 85C, PBGA-B8

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M24256-DFDW6TP

256-Kbit serial I2C bus EEPROM

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+15

M24128-DFCS6TG/K

128Kb Serial I2C EEPROM, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24M01-DFDW6TP

1Mbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PDSO

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24512-DFDW6TP

512Kbit Serial I2C bus EEPROM with three Chip Enable Lines

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL