Search Results for &quot; M95640-DFCT6TPK &quot;

128Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95M01-DFCS6TP/K

1M-bit Serial-SPI EEPROM, 128Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6G/AB

256Kbit EEPROM Serial-SPI 8-Pin WLCSP 1.8-5V 20MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95512-DFCS6TP/K

512Kbit Serial EEPROM, 1.7-5.5V, 5MHz, Industrial, 8-Pin BGA

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

+13

M95256-DFCS6TP/K

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6P/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TG/A

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TP/AB

256Kbit Serial-SPI EEPROM, 32Kx8, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TG/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95512-DFMN6P

512K-bit Serial-SPI EEPROM, 64Kx8, 1.8-5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95256-DFMN6P

256Kbit SPI EEPROM, 32Kx8, 1.8-5V, 20MHz, SOIC-8

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-DFDW6G

128Kbit SPI EEPROM, 1.8-5V, 8-Pin TSSOP, 5MHz

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-DFMC6P

256Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 20MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95M01-DFDW6P

1M-bit Serial-SPI EEPROM, 128Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-DFMC6P

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 1.8-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95512-DFMN6G

512K-bit Serial-SPI EEPROM, 8-Pin SOIC, 1.8-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-DFDW6P

128Kbit SPI EEPROM, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95512-DFDW6G

512Kbit SPI EEPROM, 8-Pin TSSOP, 1.8-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-DFMC6G

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 1.8-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-DFMN6G

128Kbit Serial-SPI EEPROM, 1.8-5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

Search Results for "M95640-DFCT6TPK"

Filters

M95128-DFCS6TG/K

128Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95M01-DFCS6TP/K

1M-bit Serial-SPI EEPROM, 128Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6G/AB

256Kbit EEPROM Serial-SPI 8-Pin WLCSP 1.8-5V 20MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95512-DFCS6TP/K

512Kbit Serial EEPROM, 1.7-5.5V, 5MHz, Industrial, 8-Pin BGA

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

+13

M95256-DFCS6TP/K

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6P/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TG/A

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TP/AB

256Kbit Serial-SPI EEPROM, 32Kx8, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TG/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95512-DFMN6P

512K-bit Serial-SPI EEPROM, 64Kx8, 1.8-5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95256-DFMN6P

256Kbit SPI EEPROM, 32Kx8, 1.8-5V, 20MHz, SOIC-8

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-DFDW6G

128Kbit SPI EEPROM, 1.8-5V, 8-Pin TSSOP, 5MHz

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-DFMC6P

256Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 20MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95M01-DFDW6P

1M-bit Serial-SPI EEPROM, 128Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-DFMC6P

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 1.8-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95512-DFMN6G

512K-bit Serial-SPI EEPROM, 8-Pin SOIC, 1.8-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-DFDW6P

128Kbit SPI EEPROM, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95512-DFDW6G

512Kbit SPI EEPROM, 8-Pin TSSOP, 1.8-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-DFMC6G

128Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 1.8-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-DFMN6G

128Kbit Serial-SPI EEPROM, 1.8-5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body