Conn Unshrouded Header HDR 22 POS 2.54mm Solder ST Top Entry Thru-Hole
Conn Unshrouded Header HDR 20 POS 2.54mm Solder ST Thru-Hole
Conn Unshrouded Header HDR 26 POS 2.54mm Solder ST Top Entry Thru-Hole
Conn Unshrouded Header HDR 50 POS 5.08mm Solder RA Side Entry Thru-Hole Bulk
18-Position 2-Row Shrouded Header, 2.54mm Pitch, 18 Contacts, Through Hole Mount, -55°C to 125°C
28-Position 2-Row Shrouded Header, 2.54mm Pitch, 125°C, UL94 V-0
Conn Unshrouded Header HDR 25 POS 5.08mm Solder ST Top Entry Thru-Hole Bulk
20-Position 2x10 Flexible Stack Header, 2.54mm Pitch, Through Hole Mount
Conn Unshrouded Header HDR 28 POS 2.54mm Solder ST Thru-Hole
8-Bit 1Ch SPI DAC, 225KS/s, 1.8-5.5V, 6-SC70
12-Bit 8CH ADC/DAC SPI 225kS/s 3.3V 36TQFN
12-Bit ADC, 200kS/s, SPI, VSSOP, 5V
12-Bit ADC/DAC AFE, 8-Ch, 225kS/s, SPI, 5V, TQFN
10-Bit ADC/DAC AFE, 4CH, SPI, 4.75-5.25V, 85C
18-Bit 1.33MSPS ADC, SPI, 10.5mW, LFCSP EP
10-Bit 225kS/s ADC/DAC IC, SPI, 16 Ch, 5V, TQFN
32-Bit MCU, 66MHz, 208-Pin BGA, Industrial Temp
Dual Op Amp, 180MHz, 3.1nV/√Hz, RRIO, 225V/µs, Auto
Dual Op Amp, 180MHz, 225V/µs, Rail-to-Rail, Automotive
