Conn Board Stacker HDR 4 POS 2mm Solder ST Top Entry SMD Layer
Conn Elevated Shrouded Header HDR 16 POS 2mm Solder ST Thru-Hole Bulk
12-Bit DAC, Parallel, Voltage Out, 286kS/s, 1LSB INL, TSSOP
68-Quad Parallel FIFO Memory IC, 1024 Words, 28.6MHz, Commercial, LCC-68
FIFO, 256X18, 20ns, Synchronous, CMOS, PQCC68, 0.050 INCH PITCH, PLASTIC, LCC-68
FIFO, 1KX18, 20ns, Synchronous, CMOS, PQFP64, 10 X 10 MM, TQFP-64
FIFO, 512X18, 20ns, Synchronous, CMOS, PQFP64, 10 X 10 MM, TQFP-64
FIFO, 512X18, 20ns, Synchronous, CMOS, PQFP64, 14 X 14 MM, PLASTIC, TQFP-64
FIFO, 256X18, 20ns, Synchronous, CMOS, PQCC68, PLASTIC, LCC-68
64-Bit FIFO Memory IC, Industrial Temperature, 5V, TQFP-64
FIFO, 512X18, 20ns, Synchronous, CMOS, PQCC68, PLASTIC, LCC-68
12-Bit 1-CH DAC, 286KS/s, Parallel, SOIC
Microprocessor, 32-Bit, 833MHz, CMOS, PBGA783, 29 X 29 MM, 2.86 MM HEIGHT, 1 MM PITCH, FLIP CHIP, BGA-783
EE PLD, 25ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28
FIFO, 512X18, 20ns, Synchronous, CMOS, PQFP64,
12-Bit 286KS/s Single-Supply DAC, SOIC-8, -40°C to 85°C
12-Bit Digital-to-Analog Converter, 286KS/s, SOIC, 2.7mW, 5.5V
OT PLD, 40ns, 48-Cell, CMOS, PQCC68, PLASTIC, LCC-68
20-Contact Unshrouded Header, HDR, 5.08mm Pitch, Through Hole Mount
Unshrouded 3-Contact 2mm Pitch Header, HDR, Through Hole Mount, -55 to 105°C
