EVAL-PS-E1BF12-SiC: Evaluation Board for CoolSiC™ Easy1B Half-Bridge Modules
Evaluation board for Infineon CoolSiC MOSFET modules FF11MR12W1M1_B11 and FF23MR12W1M1_B11 in a bidirectional buck-boost topology for up to 900V DC-link applications.
Overview
The EVAL-PS-E1BF12-SiC is an evaluation board designed for testing Infineon CoolSiC™ MOSFET EasyPACK™ modules, specifically the FF11MR12W1M1_B11 and FF23MR12W1M1_B11. It features a bidirectional buck-boost converter topology and is intended for double-pulse characterization and functional testing. The board includes 1EDI60IH12AH EiceDRIVER™ ICs, providing a gate drive voltage of -3V to 18V. Key features include support for switching frequencies exceeding 100 kHz, a maximum DC-link voltage of 900V, and a maximum output current of 25A. The design includes an integrated isolated power supply for gate drivers using the AUIR2085S controller and offers options for both electrical and optical PWM signal input.
Use Cases
- Transformer-less battery chargers
- Photovoltaic MPP trackers
- Double-pulse characterization
- Bidirectional DC-DC conversion
- High-frequency power electronics
Topics
Referenced Parts
Infineon
controlled on the primary side by AUIR2085S based self-oscillating, half-bridge driver.
Infineon
evaluation of the FF11MR12W1M1_B11 and the FF23MR12W1M1_B11 in combination with the EiceDRIVER™
Texas Instruments
Semiconductor TPS72301DBVTG4 G200, G201 2 SOT23-5 (DBV) Texas Instruments
Vacuumschmelze
Magnetics T60403-F5046-X100 TR200 1 Transformer, SMD; 2.54mm Pitch, 17mm L x 16mm W x 12mm H body Vacuumschmelze
Infineon
The evaluation board is electrically and mechanically suitable for the FF11MR12W1M1_B11 and the FF23MR12W1M1_B11 CoolSiC™ MOSFET modules.
Microchip
driver stage TC4426EOA transforms the electrical signals to an input voltage for EiceDRIVER™
P4SMA440A
Diotec Semiconductor
Semiconductor P4SMA440A D204, D207 2 DO-214AC Diotec Semiconductor
BAT165
Infineon Technologies
Semiconductor BAT165 D200, D201, D202, D203, D205, D206, D208 7 SOD323 Infineon Technologies
BSL302SN
Infineon Technologies
Semiconductor BSL302SN Q200, Q201 2 PG-TSOP-6 Infineon Technologies
IFX7805ABTF
Infineon Technologies
Semiconductor IFX7805ABTF G500,G400 1 PG-TO252-3-11 Infineon Technologies
41.0051B1
Stäubli
source-current measurement of S1 and S2 is done with the help of copper rivet adapters (Part no. Stäubli 41.0051B1)
ACM4520-142-2P-T000
TDK Corporation
Magnetics ACM4520-142-2P-T000 L200, L202 2 SMD TDK Corporation
ACM7060-301-2PL-TL01
TDK Corporation
Magnetics ACM7060-301-2PL-TL01 L201 1 7X6X3.5mm TDK Corporation
B82792C2475N365
TDK Corporation
Magnetics B82792C2475N365 L400, L500 2 SMD TDK Corporation
1EDI60IH12AH
Infineon
evaluation of the FF11MR12W1M1_B11 and the FF23MR12W1M1_B11 in combination with the EiceDRIVER™ 1EDI60IH12AH driver.
AG-EASY1B-2
Infineon
Infineon | Technologies | Semiconductor FF11MR12W1M1_B11 U300 1 AG-EASY1B-2 | Infineon | Technologies
PG-DSO-8-51
Infineon
Semiconductor | 1EDI60I12AF | U401, U500 2 PG-DSO-8-51 | Infineon | Technologies
PG-TO252-3-11
Infineon
Infineon | Technologies | Semiconductor IFX7805ABTF G500,G400 1 PG-TO252-3-11 | Infineon | Technologies
PG-TSOP-6
Infineon
Infineon | Technologies | Semiconductor BSL302SN Q200, Q201 2 PG-TSOP-6 | Infineon | Technologies
SOD323
Infineon
Semiconductor BAT165 | D200, D201, D202, D203, | D205, D206, D208 7 SOD323 | Infineon | Technologies
SOIC8-N
Infineon
Infineon | Technologies | Semiconductor AUIR2085S U202 1 SOIC8-N | Infineon | Technologies
U501
Microchip
Recommended | manufacturer | Semiconductor TC4426EOA U400, U501 2 SOIC | Microchip | Technology
X200
Molex
Technology | Semiconductor HFBR-2521Z U402, U502 2 THT Broadcom | Connector 22-23-2031 X200 1 | MOLEX | Incorporated
X500
Molex
X304, X305 6 Phoenix Contact | Connector HTSW-102-07-G-S X400, X501 2 Samtec | Connector 47053-1000 X401, X500 2 | MOLEX | Incorporated
7X6X3.5mm
TDK
TL01 L201 1 7X6X3.5mm TDK Corporation
| 1EDI60I12AF | Infineon | U401, U500 1EDI60I12AF |
| AUIR2085S | Infineon | controlled on the primary side by AUIR2085S based self-oscillating, half-bridge driver. |
| FF11MR12W1M1_B11 | Infineon | evaluation of the FF11MR12W1M1_B11 and the FF23MR12W1M1_B11 in combination with the EiceDRIVER™ |
| BLM41PG600SN1 | Murata | Magnetics BLM41PG600SN1 L401, L501 2 4516 (1806) muRata |
| TPS72301DBVTG4 | Texas Instruments | Semiconductor TPS72301DBVTG4 G200, G201 2 SOT23-5 (DBV) Texas Instruments |
| T60403-F5046-X100 | Vacuumschmelze | Magnetics T60403-F5046-X100 TR200 1 Transformer, SMD; 2.54mm Pitch, 17mm L x 16mm W x 12mm H body Vacuumschmelze |
| HFBR-2521Z | Broadcom | ensure a proper supply voltage to U502 connector (HFBR-2521Z) |
| FF23MR12W1M1_B11 | Infineon | The evaluation board is electrically and mechanically suitable for the FF11MR12W1M1_B11 and the FF23MR12W1M1_B11 CoolSiC™ MOSFET modules. |
| TC4426EOA | Microchip | driver stage TC4426EOA transforms the electrical signals to an input voltage for EiceDRIVER™ |
| ES2D | Onsemi | Semiconductor ES2D D400, D500 2 DO-214AA ON Semiconductor |
| P4SMA440A | Diotec Semiconductor | Semiconductor P4SMA440A D204, D207 2 DO-214AC Diotec Semiconductor |
| BAT165 | Infineon Technologies | Semiconductor BAT165 D200, D201, D202, D203, D205, D206, D208 7 SOD323 Infineon Technologies |
| BSL302SN | Infineon Technologies | Semiconductor BSL302SN Q200, Q201 2 PG-TSOP-6 Infineon Technologies |
| IFX7805ABTF | Infineon Technologies | Semiconductor IFX7805ABTF G500,G400 1 PG-TO252-3-11 Infineon Technologies |
| 41.0051B1 | Stäubli | source-current measurement of S1 and S2 is done with the help of copper rivet adapters (Part no. Stäubli 41.0051B1) |
| ACM4520-142-2P-T000 | TDK Corporation | Magnetics ACM4520-142-2P-T000 L200, L202 2 SMD TDK Corporation |
| ACM7060-301-2PL-TL01 | TDK Corporation | Magnetics ACM7060-301-2PL-TL01 L201 1 7X6X3.5mm TDK Corporation |
| B82792C2475N365 | TDK Corporation | Magnetics B82792C2475N365 L400, L500 2 SMD TDK Corporation |
| 1EDI60IH12AH | Infineon | evaluation of the FF11MR12W1M1_B11 and the FF23MR12W1M1_B11 in combination with the EiceDRIVER™ 1EDI60IH12AH driver. |
| AG-EASY1B-2 | Infineon | Infineon | Technologies | Semiconductor FF11MR12W1M1_B11 U300 1 AG-EASY1B-2 | Infineon | Technologies |
| PG-DSO-8-51 | Infineon | Semiconductor | 1EDI60I12AF | U401, U500 2 PG-DSO-8-51 | Infineon | Technologies |
| PG-TO252-3-11 | Infineon | Infineon | Technologies | Semiconductor IFX7805ABTF G500,G400 1 PG-TO252-3-11 | Infineon | Technologies |
| PG-TSOP-6 | Infineon | Infineon | Technologies | Semiconductor BSL302SN Q200, Q201 2 PG-TSOP-6 | Infineon | Technologies |
| SOD323 | Infineon | Semiconductor BAT165 | D200, D201, D202, D203, | D205, D206, D208 7 SOD323 | Infineon | Technologies |
| SOIC8-N | Infineon | Infineon | Technologies | Semiconductor AUIR2085S U202 1 SOIC8-N | Infineon | Technologies |
| U501 | Microchip | Recommended | manufacturer | Semiconductor TC4426EOA U400, U501 2 SOIC | Microchip | Technology |
| X200 | Molex | Technology | Semiconductor HFBR-2521Z U402, U502 2 THT Broadcom | Connector 22-23-2031 X200 1 | MOLEX | Incorporated |
| X500 | Molex | X304, X305 6 Phoenix Contact | Connector HTSW-102-07-G-S X400, X501 2 Samtec | Connector 47053-1000 X401, X500 2 | MOLEX | Incorporated |
| 7X6X3.5mm | TDK | TL01 L201 1 7X6X3.5mm TDK Corporation |