SHIANG SHANG ELECTRONICS MFG. CO. PHILS., INC
Shiang Shang Electronics Mfg. Co. Phils., Inc., also known as SSMC, is a leading semiconductor assembly and test company based in the Philippines. With over 25 years of experience in the industry, SSMC provides a wide range of services such as wafer probing, final testing, and packaging solutions to major semiconductor companies worldwide. The company has approximately 5,000 employees and serves more than 100 customers globally.
SSMC is a privately held company and is not publicly traded on any stock exchange market.
- Shiang Shang Electronics Mfg. Co. Phils., Inc. is headquartered in the Laguna Technopark, Special Export Processing Zone, Laguna, Philippines. The full address is Block 4, Phase 3, SEZ, Laguna Technopark, Binan, Laguna, Philippines 4024.
- Shiang Shang Electronics Mfg. Co. Phils., Inc. has a large office located in San Jose, California, United States. The full address is 570 Alder Drive, Milpitas, CA 95035, USA.
- Another large office is located in Hsinchu, Taiwan. The full address is No. 98, Ln. 235, Baoqiao Rd., Hsinchu City 300, Taiwan (R.O.C.)
- SSMC's main manufacturing facility is located in the Laguna Technopark, Special Export Processing Zone, Laguna, Philippines. The full address is Block 4, Phase 3, SEZ, Laguna Technopark, Binan, Laguna, Philippines 4024.
- SSMC also has a manufacturing facility in Clark Freeport Zone, Pampanga, Philippines. The full address is Lot 2 Block 7 Berthaphil IV Clark Center, Clark Freeport Zone, Pampanga, Philippines.
- SSMC has another manufacturing facility in Wuxi, Jiangsu Province, China. The full address is No. 88, Fengxiang Road, Wuxi National High-tech Industrial Development Zone, Wuxi, Jiangsu Province, China.
Shiang Shang Electronics Mfg. Co. Phils., Inc. (SSMC) offers a wide range of semiconductor assembly and test services to customers worldwide. Their product portfolio includes:
- Wafer Probing: SSMC offers wafer probing services that involve testing the electrical characteristics of individual semiconductor devices on a wafer before they are separated and packaged.
- Final Testing: SSMC provides final testing services that ensure that the semiconductor devices meet the customer's specifications before they are shipped.
- Packaging Solutions: SSMC offers various packaging solutions, including flip-chip, wirebond, and leadframe packages, to meet the customer's specific requirements.
SSMC's product portfolio is related to the following taxonomies in the electronics industry:
- Semiconductor Manufacturing
- Semiconductor Assembly and Test
- Wafer Probing
- Final Testing
- Packaging Solutions
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