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MC9S12XEP100CVL

16-bit RISC MCU, 1MB Flash, 208-Pin MAP-BGA, 50MHz, Automotive

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

MC9S12XEP100CVL

Freescale Semiconductor

16-bit MCU, 1MB Flash, 50MHz, 208-Pin, Industrial

MAPBGA-208

Transferred

Max Operating Temperature: 85

Number of Terminals: 208

Min Operating Temperature: -40

Terminal Position: BOTTOM

MC9S12XEP100CAL

32-Bit RISC MCU, 50MHz, 1048K Flash, 65K RAM, 112-Pin PQFP

LQFP, QFP112,.87SQ

Active

Max Operating Temperature: 85

Number of Terminals: 112

Min Operating Temperature: -40

Terminal Position: QUAD

MC9S12XEP100MVL

Microcontroller 16b SPI CAN SCI I2C IrDA EBI/EMI 1MB FLASH 152 I/O

BGA, BGA208,16X16,40

Active

Package/Case: BGA

Data Bus Width: 16b

Halogen Free: Halogen Free

Interface: SPI, CAN, SCI, I2C, IrDA, EBI/EMI

MC9S12XEP100CAL

Freescale Semiconductor

16-bit MCU, 1MB Flash, 50MHz, 112-Pin QFP, Industrial

LQFP-112

Transferred

Max Operating Temperature: 85

Number of Terminals: 112

Min Operating Temperature: -40

Terminal Position: QUAD