Search Results for &quot; 35-3-E &quot;

16-Bit 40MHz Flash MCU, 44-Pin PQCC, Automotive

8 X 8 MM, LEAD FREE, PLASTIC, QFN-44

Active

Max Operating Temperature: 125

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33FJ32MC304-E/PT

16-Bit 40MHz FLASH MCU, 44-Pin PQFP, Automotive

TQFP-44

Active

Max Operating Temperature: 125

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32MC204-E/TL

16-Bit MCU, 60MHz, 44-Pin QCC, Automotive

6 X 6 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VTLA-44

Active

Max Operating Temperature: 125

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP64GP504T-E/ML

16-Bit 60MHz Flash MCU, 44-Pin PQCC, Automotive

8 X 8 MM, 0.90 MM HEIGHT, 0.65 MM PITCH, LEAD FREE, PLASTIC, QFN-44

Active

Max Operating Temperature: 125

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

PIC24HJ64GP504T-E/PT

16-Bit 40MHz FLASH MCU, 44-Pin PQFP, Automotive

10 X 10 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-44

Active

Max Operating Temperature: 125

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33FJ32GP304T-E/PT

16-Bit 40MHz FLASH MCU, 44-Pin PQFP, Automotive

10 X 10 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-44

Active

Max Operating Temperature: 125

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

PIC18F24K20T-E/SS

8-Bit MCU, 48MHz, 28-Pin, FLASH, Automotive, SSOP

DSPIC33EP128MC504-E/PTVAO

5.30 MM, LEAD FREE, PLASTIC, SSOP-28

Active

Max Operating Temperature: 125

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: DUAL

16-Bit Automotive MCU, 60MHz, FLASH, 44-Pin PQFP

TQFP-44

Active

Max Operating Temperature: 125

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33FJ16GS504T-E/TL

16-BIT, FLASH, 40MHz, MICROCONTROLLER, PQCC44

VTLA-44

Active

Core Architecture: dsPIC

Data Bus Width: 16b

Frequency: 40MHz

Interface: I2C, SPI, UART, IrDA, USART

DSPIC33FJ16GS404T-E/TL

16-BIT, FLASH, 40MHz, MICROCONTROLLER, PQCC44

VTLA-44

Active

Core Architecture: dsPIC

Data Bus Width: 16b

Frequency: 40MHz

Interface: I2C, SPI, UART, IrDA, USART

PIC16F19176-E/P

RISC MICROCONTROLLER

DIP-40

Active

Max Operating Temperature: 125

Number of Terminals: 40

Min Operating Temperature: -40

Terminal Position: DUAL

EP4SE530H35C2ES

FPGA Stratix IV E, 531200 Cells, 40nm, 1152-Pin BGA, 11.3Gbps Transceivers

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FC-HFBGA

Package Description: Flip Chip Hybrid Fine Pitch Ball Grid Array

EP4SE530F43C2ES

FPGA Stratix IV E, 531200 Cells, 40nm, 1760-Pin FC-FBGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FC-FBGA

Package Description: Flip Chip Fine Pitch Ball Grid Array

EP4SE530H40C3ES

Intel(Altera)

FPGA Stratix IV E, 531200 Cells, 40nm, 1517-Pin BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FC-HFBGA

Package Description: Flip Chip Hybrid Fine Pitch Ball Grid Array

EP4SE530F43C2NES

FPGA Stratix IV E, 531.2K Cells, 1760 Pins, 40nm, 11.3Gbps Transceivers

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FC-FBGA

Package Description: Flip Chip Fine Pitch Ball Grid Array

EP4SE530F43C4NES

FPGA Stratix IV E, 531200 Cells, 40nm, 1760-Pin FC-FBGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FC-FBGA

Package Description: Flip Chip Fine Pitch Ball Grid Array

HD64F3694FP

Renesas

16-Bit Flash MCU, 20MHz, LFQFP-64, 5V

LFQFP,

Obsolete

Height - Seated (Max): 1.7mm

JESD-30 Code: S-PQFP-G64

JESD-609 Code: e0

Length: 10mm

DSPIC33FJ16MC101-E/P

16-Bit dsPIC MCU, 32MHz, 16KB Flash, PDIP-20

0.300 INCH, LEAD FREE, PLASTIC, DIP-20

Active

Package/Case: PDIP

Core Architecture: dsPIC

Data Bus Width: 16b

Frequency: 32MHz

PD85006-E

RF MOSFET N-CH 40V 2A 1GHz 3-Pin PowerSO-10RF SMT

Lead-Frame SMT

NRND

Basic Package Type: Lead-Frame SMT

Package Family Name: PowerSO-10RF (Formed lead)

Package/Case: PowerSO-10RF (Formed lead)

Lead Shape: Gull-wing

PD84006-E

RF MOSFET N-CH 25V 5A 1GHz 3-Pin PowerSO-10RF SMT

Lead-Frame SMT

NRND

Basic Package Type: Lead-Frame SMT

Package Family Name: PowerSO-10RF (Formed lead)

Package/Case: PowerSO-10RF (Formed lead)

Lead Shape: Gull-wing

Search Results for "35-3-E"

Filters

PIC24HJ128GP504T-E/ML

16-Bit 40MHz Flash MCU, 44-Pin PQCC, Automotive

8 X 8 MM, LEAD FREE, PLASTIC, QFN-44

Active

Max Operating Temperature: 125

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33FJ32MC304-E/PT

16-Bit 40MHz FLASH MCU, 44-Pin PQFP, Automotive

TQFP-44

Active

Max Operating Temperature: 125

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32MC204-E/TL

16-Bit MCU, 60MHz, 44-Pin QCC, Automotive

6 X 6 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VTLA-44

Active

Max Operating Temperature: 125

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP64GP504T-E/ML

16-Bit 60MHz Flash MCU, 44-Pin PQCC, Automotive

8 X 8 MM, 0.90 MM HEIGHT, 0.65 MM PITCH, LEAD FREE, PLASTIC, QFN-44

Active

Max Operating Temperature: 125

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

PIC24HJ64GP504T-E/PT

16-Bit 40MHz FLASH MCU, 44-Pin PQFP, Automotive

10 X 10 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-44

Active

Max Operating Temperature: 125

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33FJ32GP304T-E/PT

16-Bit 40MHz FLASH MCU, 44-Pin PQFP, Automotive

10 X 10 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-44

Active

Max Operating Temperature: 125

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

PIC18F24K20T-E/SS

8-Bit MCU, 48MHz, 28-Pin, FLASH, Automotive, SSOP

DSPIC33EP128MC504-E/PTVAO

5.30 MM, LEAD FREE, PLASTIC, SSOP-28

Active

Max Operating Temperature: 125

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: DUAL

16-Bit Automotive MCU, 60MHz, FLASH, 44-Pin PQFP

TQFP-44

Active

Max Operating Temperature: 125

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33FJ16GS504T-E/TL

16-BIT, FLASH, 40MHz, MICROCONTROLLER, PQCC44

VTLA-44

Active

Core Architecture: dsPIC

Data Bus Width: 16b

Frequency: 40MHz

Interface: I2C, SPI, UART, IrDA, USART

DSPIC33FJ16GS404T-E/TL

16-BIT, FLASH, 40MHz, MICROCONTROLLER, PQCC44

VTLA-44

Active

Core Architecture: dsPIC

Data Bus Width: 16b

Frequency: 40MHz

Interface: I2C, SPI, UART, IrDA, USART

PIC16F19176-E/P

RISC MICROCONTROLLER

DIP-40

Active

Max Operating Temperature: 125

Number of Terminals: 40

Min Operating Temperature: -40

Terminal Position: DUAL

EP4SE530H35C2ES

FPGA Stratix IV E, 531200 Cells, 40nm, 1152-Pin BGA, 11.3Gbps Transceivers

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FC-HFBGA

Package Description: Flip Chip Hybrid Fine Pitch Ball Grid Array

EP4SE530F43C2ES

FPGA Stratix IV E, 531200 Cells, 40nm, 1760-Pin FC-FBGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FC-FBGA

Package Description: Flip Chip Fine Pitch Ball Grid Array

EP4SE530H40C3ES

Intel(Altera)

FPGA Stratix IV E, 531200 Cells, 40nm, 1517-Pin BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FC-HFBGA

Package Description: Flip Chip Hybrid Fine Pitch Ball Grid Array

EP4SE530F43C2NES

FPGA Stratix IV E, 531.2K Cells, 1760 Pins, 40nm, 11.3Gbps Transceivers

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FC-FBGA

Package Description: Flip Chip Fine Pitch Ball Grid Array

EP4SE530F43C4NES

FPGA Stratix IV E, 531200 Cells, 40nm, 1760-Pin FC-FBGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FC-FBGA

Package Description: Flip Chip Fine Pitch Ball Grid Array

HD64F3694FP

Renesas

16-Bit Flash MCU, 20MHz, LFQFP-64, 5V

LFQFP,

Obsolete

Height - Seated (Max): 1.7mm

JESD-30 Code: S-PQFP-G64

JESD-609 Code: e0

Length: 10mm

DSPIC33FJ16MC101-E/P

16-Bit dsPIC MCU, 32MHz, 16KB Flash, PDIP-20

0.300 INCH, LEAD FREE, PLASTIC, DIP-20

Active

Package/Case: PDIP

Core Architecture: dsPIC

Data Bus Width: 16b

Frequency: 32MHz

PD85006-E

RF MOSFET N-CH 40V 2A 1GHz 3-Pin PowerSO-10RF SMT

Lead-Frame SMT

NRND

Basic Package Type: Lead-Frame SMT

Package Family Name: PowerSO-10RF (Formed lead)

Package/Case: PowerSO-10RF (Formed lead)

Lead Shape: Gull-wing

PD84006-E

RF MOSFET N-CH 25V 5A 1GHz 3-Pin PowerSO-10RF SMT