Search Results for &quot; AC82PM45-SLB97 &quot;

Slide Switch, SPDT, Latched, 0.3A, 30VDC, Solder Terminal, Through Hole-right Angle

Active

Actuator Length: 4.5mm

Actuator Material: Thermoplastic

Actuator Type: Standard

Contact Plating: Silver

+16

SLB2340R45

Slide Switch, DP3T, Latched, 0.3A, 30VDC, Solder Terminal, Through Hole-right Angle

Active

Max Operating Temperature: 85

Min Operating Temperature: -20

Termination Type: SOLDER

Manufacturer Series: SLB

SLB2240R45

Slide Switch, DPDT, Latched, 0.3A, 30VDC, Solder Terminal, Through Hole-right Angle

Active

Max Operating Temperature: 85

Min Operating Temperature: -20

Termination Type: SOLDER

Manufacturer Series: SLB

AC8NKWMP

Apex(Crescent)

CRESCENT AC8NKWMP. RAPID SLIDE

Volume Production

Package/Case: 200

Lead Free: Not Applicable

Length: 200mm

Reach SVHC Compliant: No

AC857BSQ-7

Small Signal Bipolar Transistor,

Active

Number of Terminals: 6

Terminal Position: DUAL

Number of Elements: 2

AC857CWQ-7

Small Signal Bipolar Transistor,

Active

Number of Terminals: 3

Terminal Position: DUAL

Number of Elements: 1

SLB1340R45

Slide Switch, SP3T, Latched, 0.3A, 30VDC, Solder Terminal, Through Hole-right Angle

Obsolete

Max Operating Temperature: 85

Min Operating Temperature: -20

Termination Type: SOLDER

AC8300HU-008

Ebm-Papst

Fan; AC; 115V; 80x80x32; Sq; 47CFM; 8.3W; 48dBA; 5000RPM; Leadwires

Volume Production

Airflow: 47CFM

Bearing Type: Ball

Package/Case: Axial

Depth: 32mm

+13

QG82945GC-SLB86

Chipsets 945GC Express Chips et Desktop FCBGA1202

Not Recommended for New Design

Package/Case: FCBGA

Length: 34mm

Max Operating Temperature: 99°C

Memory Size: 2GB

BX80601940 SLBCK

64-bit 45nm 2.93GHz 1366-Pin FCLGA MPU

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LGA

Package/Case: FCLGA

Package Description: Flip-Chip Land Grid Array

BX80601965 SLBCJ

64-bit 45nm 3.2GHz 1366-Pin FCLGA MPU

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LGA

Package/Case: FCLGA

Package Description: Flip-Chip Land Grid Array

AC80566UC005DE

RISC Microprocessor, 32-Bit, 1100MHz, CMOS, PBGA441,

FBGA, BGA441,31X29,16

Obsolete

Data Bus Width: 64b

Height: 1.25mm

Length: 14mm

Max Frequency: 1.1GHz

BX80569X3370 SLB8Z

64-bit 45nm 3GHz 4-Core MPU (FCLGA8)

Surface Mount

Obsolete

Package/Case: FCLGA8

Pin Count: 775

PCB: 775

Package Length (mm): 37.55(Max)

BX80616G6950 SLBTG

64-bit 2.8GHz 2-Core MPU, 1156-Pin FCLGA, 32nm

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LGA

Package/Case: FCLGA

Package Description: Flip-Chip Land Grid Array

+22

BX80580Q9400 SLB6B

MPU Core™2 Quad Processor Q9400 64bit 45nm 2.66GHz 775-Pin FCLGA6

Surface Mount

Obsolete

Package/Case: FCLGA6

Pin Count: 775

PCB: 775

Package Length (mm): 37.55(Max)

+19

AC80566UE025DW

Microprocessor, 32-Bit, 1600MHz, CMOS, PBGA441, 13 X 14 MM, HALOGEN FREE, PLASTIC, FCBGA-441

BGA, BGA441,31X29,16

Obsolete

Data Bus Width: 64b

Height: 1.25mm

Length: 14mm

Max Frequency: 1.6GHz

AC80566UE036DW

RISC Microprocessor, 32-Bit, 1860MHz, CMOS, PBGA441

FBGA, BGA441,31X29,16

Obsolete

Number of Terminals: 441

Terminal Position: BOTTOM

JEDEC Package Code: R-PBGA-B441

Supply Current-Max: 3200

BX80605X3450 SLBLD

64-bit RISC MPU, 2.66GHz, 45nm, 1156-Pin LGA, Surface Mount

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LGA

Package/Case: LGA

Package Description: Land Grid Array Package

BX80580Q8200 SLB5M

Core 2 Quad MPU, 4 Cores, 2.33GHz, 64-bit, 45nm, 775-Pin FCLGA6

Surface Mount

Obsolete

Package/Case: FCLGA6

Pin Count: 775

PCB: 775

Package Length (mm): 37.55(Max)

BX80605I7870 SLBJG

Core i7-870 MPU 64bit RISC 45nm 2.93GHz 1156-Pin FCLGA SMT

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LGA

Package/Case: FCLGA

Package Description: Flip-Chip Land Grid Array

Search Results for "AC82PM45-SLB97"

Filters

SLB1240R45

Slide Switch, SPDT, Latched, 0.3A, 30VDC, Solder Terminal, Through Hole-right Angle

Active

Actuator Length: 4.5mm

Actuator Material: Thermoplastic

Actuator Type: Standard

Contact Plating: Silver

+16

SLB2340R45

Slide Switch, DP3T, Latched, 0.3A, 30VDC, Solder Terminal, Through Hole-right Angle

Active

Max Operating Temperature: 85

Min Operating Temperature: -20

Termination Type: SOLDER

Manufacturer Series: SLB

SLB2240R45

Slide Switch, DPDT, Latched, 0.3A, 30VDC, Solder Terminal, Through Hole-right Angle

Active

Max Operating Temperature: 85

Min Operating Temperature: -20

Termination Type: SOLDER

Manufacturer Series: SLB

AC8NKWMP

Apex(Crescent)

CRESCENT AC8NKWMP. RAPID SLIDE

Volume Production

Package/Case: 200

Lead Free: Not Applicable

Length: 200mm

Reach SVHC Compliant: No

AC857BSQ-7

Small Signal Bipolar Transistor,

Active

Number of Terminals: 6

Terminal Position: DUAL

Number of Elements: 2

AC857CWQ-7

Small Signal Bipolar Transistor,

Active

Number of Terminals: 3

Terminal Position: DUAL

Number of Elements: 1

SLB1340R45

Slide Switch, SP3T, Latched, 0.3A, 30VDC, Solder Terminal, Through Hole-right Angle

Obsolete

Max Operating Temperature: 85

Min Operating Temperature: -20

Termination Type: SOLDER

AC8300HU-008

Ebm-Papst

Fan; AC; 115V; 80x80x32; Sq; 47CFM; 8.3W; 48dBA; 5000RPM; Leadwires

Volume Production

Airflow: 47CFM

Bearing Type: Ball

Package/Case: Axial

Depth: 32mm

+13

QG82945GC-SLB86

Chipsets 945GC Express Chips et Desktop FCBGA1202

Not Recommended for New Design

Package/Case: FCBGA

Length: 34mm

Max Operating Temperature: 99°C

Memory Size: 2GB

BX80601940 SLBCK

64-bit 45nm 2.93GHz 1366-Pin FCLGA MPU

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LGA

Package/Case: FCLGA

Package Description: Flip-Chip Land Grid Array

BX80601965 SLBCJ

64-bit 45nm 3.2GHz 1366-Pin FCLGA MPU

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LGA

Package/Case: FCLGA

Package Description: Flip-Chip Land Grid Array

AC80566UC005DE

RISC Microprocessor, 32-Bit, 1100MHz, CMOS, PBGA441,

FBGA, BGA441,31X29,16

Obsolete

Data Bus Width: 64b

Height: 1.25mm

Length: 14mm

Max Frequency: 1.1GHz

BX80569X3370 SLB8Z

64-bit 45nm 3GHz 4-Core MPU (FCLGA8)

Surface Mount

Obsolete

Package/Case: FCLGA8

Pin Count: 775

PCB: 775

Package Length (mm): 37.55(Max)

BX80616G6950 SLBTG

64-bit 2.8GHz 2-Core MPU, 1156-Pin FCLGA, 32nm

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LGA

Package/Case: FCLGA

Package Description: Flip-Chip Land Grid Array

+22

BX80580Q9400 SLB6B

MPU Core™2 Quad Processor Q9400 64bit 45nm 2.66GHz 775-Pin FCLGA6

Surface Mount

Obsolete

Package/Case: FCLGA6

Pin Count: 775

PCB: 775

Package Length (mm): 37.55(Max)

+19

AC80566UE025DW

Microprocessor, 32-Bit, 1600MHz, CMOS, PBGA441, 13 X 14 MM, HALOGEN FREE, PLASTIC, FCBGA-441

BGA, BGA441,31X29,16

Obsolete

Data Bus Width: 64b

Height: 1.25mm

Length: 14mm

Max Frequency: 1.6GHz

AC80566UE036DW

RISC Microprocessor, 32-Bit, 1860MHz, CMOS, PBGA441

FBGA, BGA441,31X29,16

Obsolete

Number of Terminals: 441

Terminal Position: BOTTOM

JEDEC Package Code: R-PBGA-B441

Supply Current-Max: 3200

BX80605X3450 SLBLD

64-bit RISC MPU, 2.66GHz, 45nm, 1156-Pin LGA, Surface Mount

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LGA

Package/Case: LGA

Package Description: Land Grid Array Package

BX80580Q8200 SLB5M

Core 2 Quad MPU, 4 Cores, 2.33GHz, 64-bit, 45nm, 775-Pin FCLGA6

Surface Mount

Obsolete

Package/Case: FCLGA6

Pin Count: 775

PCB: 775

Package Length (mm): 37.55(Max)

BX80605I7870 SLBJG

Core i7-870 MPU 64bit RISC 45nm 2.93GHz 1156-Pin FCLGA SMT

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LGA

Package/Case: FCLGA

Package Description: Flip-Chip Land Grid Array