Search Results for &quot; ADSP-BF512KBCZ-3 &quot;

DSP 16/32-bit Fixed-Point 400MHz 168-Pin CSP-BGA SM

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: CSP-BGA

Package Description: Chip Scale Ball Grid Array Package

+33

ADSP-BF514KSWZ-4F4

DSP 16/32-bit Fixed-Point 400MHz 176-Pin LQFP EP SMT

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP EP

Package Description: Low Profile Quad Flat Package, Exposed Pad

+33

ADSP-BF514BBCZ-4F4

DSP 16/32-bit Fixed-Point 400MHz 168-Pin CSP-BGA SM

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: CSP-BGA

Package Description: Chip Scale Ball Grid Array Package

+33

ADSP-BF514BBCZ4F16

Blackfin Embedded Processor with 16 Mbits Flash memory and RSI

Lifetime Buy

Pin Count: 168

uPs/uCs/Peripheral ICs Type: DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-BF518BBCZ4F16

Blackfin Embedded Processor w/ 16 Mbit Flash memory and IEEE-1588 support

Lifetime Buy

Pin Count: 168

uPs/uCs/Peripheral ICs Type: DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-BF514BSWZ4F16

Blackfin Embedded Processor with 16 Mbits Flash memory and RSI

Lifetime Buy

Pin Count: 176

uPs/uCs/Peripheral ICs Type: DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-BF518BSWZ4F16

Blackfin Embedded Processor w/ 16 Mbit Flash memory and IEEE-1588 support

Lifetime Buy

Pin Count: 176

uPs/uCs/Peripheral ICs Type: DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-BF522KBCZ-3

Low Power Blackfin Processor with Advanced Peripherals and Low Standby Power

LFBGA, BGA289,23X23,20

Active

Package/Case: BGA

Contact Plating: Copper, Tin, Silver

Core Architecture: Blackfin

Data Bus Width: 16b

+19

ADSP-BF524KBCZ-3

Blackfin DSP 400MHz 16b 132KB BGA 48 I/O 3.3V

LFBGA, BGA289,23X23,20

Active

Package/Case: BGA

Contact Plating: Copper, Tin, Silver

Core Architecture: Blackfin

Data Bus Width: 16b

+20

ADSP-BF537BBC-5A

Blackfin Processor with Embedded Network Connectivity

MO-205AE, CSPBGA-182

Obsolete

Package/Case: BGA

Contact Plating: Tin, Silver, Lead

Core Architecture: Blackfin

Data Bus Width: 32b

ADSP-BF536BBC-3A

Blackfin Processor with Embedded Network Connectivity

MO-205AE, CSPBGA-182

Obsolete

Package/Case: BGA

Core Architecture: Blackfin

Data Bus Width: 16b

Frequency: 400MHz

ADSP-BF526KBCZ-4

Low Power Blackfin Processor with Advanced Peripherals and Low Standby Power

LFBGA, BGA289,23X23,20

Active

Package/Case: BGA

Contact Plating: Copper, Tin, Silver

Core Architecture: Blackfin

Data Bus Width: 16b

ADSP-BF522KBCZ-4

Low Power Blackfin Processor with Advanced Peripherals and Low Standby Power

LFBGA, BGA289,23X23,20

Active

Package/Case: BGA

Contact Plating: Copper, Tin, Silver

Core Architecture: Blackfin

Data Bus Width: 16b

ADSP-BF527KBCZ-6

32-bit 600MHz DSP, Blackfin, 132KB, BGA, SM

LFBGA, BGA289,23X23,20

Active

Package/Case: BGA

Core Architecture: Blackfin

Data Bus Width: 32b

Density: 132KB

+28

ADSP-BF525KBCZ-5

Low Power Blackfin Processor with Advanced Peripherals

LFBGA, BGA289,23X23,20

Active

Package/Case: BGA

Contact Plating: Copper, Tin, Silver

Core Architecture: Blackfin

Data Bus Width: 16b

+19

ADSP-BF525ABCZ-6

Low Power Blackfin Processor with Advanced Peripherals

LFBGA, BGA289,23X23,20

Active

Package/Case: BGA

Core Architecture: Blackfin

Data Bus Width: 16b

Frequency: 600MHz

ADSP-BF523KBCZ-6

IC DSP 16BIT 600MHZ 289-CSBGA

Volume Production

Package/Case: BGA

Contact Plating: Copper, Tin, Silver

Core Architecture: Blackfin

Data Bus Width: 16b

ADSP-BF536BBC-4A

Blackfin Processor with Embedded Network Connectivity

MO-205AE, CSPBGA-182

Obsolete

Package/Case: BGA

Core Architecture: Blackfin

Data Bus Width: 16b

Frequency: 400MHz

ADSP-BF534BBC-5A

Blackfin Processor with CAN Connectivity for Automotive & Industrial Applications

MO-205AE, CSPBGA-182

Obsolete

Package/Case: BGA

Contact Plating: Tin, Silver, Lead

Core Architecture: Blackfin

Data Bus Width: 16b

ADSP-BF534BBC-4A

Blackfin Processor with CAN Connectivity for Automotive & Industrial Applications

MO-205AE, CSPBGA-182

Obsolete

Package/Case: BGA

Contact Plating: Tin, Silver, Lead

Core Architecture: Blackfin

Data Bus Width: 16b