Search Results for &quot; GX-F12BI-P-R &quot;

Unknown

Airflow: 121CFM

Approvals: UL, CE, TUV

Bearing Type: Ball

Current Rating: 210mA

FDMC7672S_F127

MOSFET 30V N-CHAN 14.8A

Obsolete

Continuous Drain Current (ID): 14.8A

Drain to Source Breakdown Voltage: 30V

Drain to Source Resistance: 6mR

Max Operating Temperature: 150°C

GX-8MU

Panasonic

PANASONIC INDUSTRIAL DEVICES GX-8MU INDUCTIVE PROXIMITY SENSOR

Volume Production

Body Material: Stainless Steel

Max Operating Temperature: 70°C

Min Operating Temperature: -25°C

Max Supply Voltage (DC): 24V

+10

FM1010-F1232-400C-G

Six Interface System 1232-Pin FCBGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FCBGA

Package Description: Flip Chip Ball Grid Array

F12007LWBK199

CBL 7COND 12AWG BK 1000=1000'

Volume Production

Package Quantity: 1000

FDMC0310AS_F127

MOSFET Computing MOSFET

Volume Production

Continuous Drain Current (ID): 21A

Drain to Source Resistance: 4.5mR

Drain to Source Voltage (Vdss): 30V

Fall Time: 4ns

+14

FM1010-F1232-400E-G

Six Interface System 1232-Pin FCBGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FCBGA

Package Description: Flip Chip Ball Grid Array

F12004KWBK199

CBL 4COND 12AWG BK 1000=1000'

Not Recommended for New Design

Package Quantity: 1000

F12004LWBK199

CBL 4COND 12AWG BK 1000=1000'

Not Recommended for New Design

Package Quantity: 1000

F12005RWBK199

CBL 5COND 12AWG BK 1000=1000'

Volume Production

Package Quantity: 1000

F12007RWBK199

CBL 7COND 12AWG BK 1000=1000'

Volume Production

Package Quantity: 1000

RoHS Compliant: Yes

F12007KWBK199

CBL 7COND 12AWG BK 1000=1000'

Volume Production

Package Quantity: 1000

F12004RWBK199

CBL 4COND 12AWG BK 1000=1000'

Not Recommended for New Design

Package Quantity: 1000

RoHS Compliant: Yes

F12005KWBK199

CBL 5COND 12AWG BK 1000=1000'

Volume Production

Package Quantity: 1000

F12005LWBK199

CBL 5COND 12AWG BK 1000=1000'

Volume Production

Package Quantity: 1000

F1206B0R50FSTR

Kyocera

Fuse Chip 0.5A 63V Fast 2-Pin Solder Pad Surface Mount T/R

Volume Production

Current Rating: 500mA

Height: 1.2mm

Lead Free: Lead Free

Length: 3.1mm

+11

F1206B2R00FWTR

Fuse Chip Fast Acting 2A SMD Solder Pad 1206 T/R

1206

Active

F1206A2R00FWTR

Fuse Chip Fast Acting 2A 32V SMD Solder Pad 1206 T/R UL/cUL

1206

NRND

Max Operating Temperature: 125

Min Operating Temperature: -55

Resistance: 0.065

F1206A2R00FSTR

Fuse Chip Fast Acting 2A 32V SMD Solder Pad 1206 T/R UL/cUL

1206

Active

Max Operating Temperature: 125

Min Operating Temperature: -55

F1206A0R25FSTR

Fuse Chip Fast Acting 0.25A 32V SMD Solder Pad 1206 T/R UL/cUL

1206

Active

Max Operating Temperature: 125

Min Operating Temperature: -55

Search Results for "GX-F12BI-P-R"

Filters

F1238E48B1-FHR

Mechatronics

FAN AXIAL 120X38MM TACH 48VDC

Unknown

Airflow: 121CFM

Approvals: UL, CE, TUV

Bearing Type: Ball

Current Rating: 210mA

FDMC7672S_F127

MOSFET 30V N-CHAN 14.8A

Obsolete

Continuous Drain Current (ID): 14.8A

Drain to Source Breakdown Voltage: 30V

Drain to Source Resistance: 6mR

Max Operating Temperature: 150°C

GX-8MU

Panasonic

PANASONIC INDUSTRIAL DEVICES GX-8MU INDUCTIVE PROXIMITY SENSOR

Volume Production

Body Material: Stainless Steel

Max Operating Temperature: 70°C

Min Operating Temperature: -25°C

Max Supply Voltage (DC): 24V

+10

FM1010-F1232-400C-G

Six Interface System 1232-Pin FCBGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FCBGA

Package Description: Flip Chip Ball Grid Array

F12007LWBK199

CBL 7COND 12AWG BK 1000=1000'

Volume Production

Package Quantity: 1000

FDMC0310AS_F127

MOSFET Computing MOSFET

Volume Production

Continuous Drain Current (ID): 21A

Drain to Source Resistance: 4.5mR

Drain to Source Voltage (Vdss): 30V

Fall Time: 4ns

+14

FM1010-F1232-400E-G

Six Interface System 1232-Pin FCBGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FCBGA

Package Description: Flip Chip Ball Grid Array

F12004KWBK199

CBL 4COND 12AWG BK 1000=1000'

Not Recommended for New Design

Package Quantity: 1000

F12004LWBK199

CBL 4COND 12AWG BK 1000=1000'

Not Recommended for New Design

Package Quantity: 1000

F12005RWBK199

CBL 5COND 12AWG BK 1000=1000'

Volume Production

Package Quantity: 1000

F12007RWBK199

CBL 7COND 12AWG BK 1000=1000'

Volume Production

Package Quantity: 1000

RoHS Compliant: Yes

F12007KWBK199

CBL 7COND 12AWG BK 1000=1000'

Volume Production

Package Quantity: 1000

F12004RWBK199

CBL 4COND 12AWG BK 1000=1000'

Not Recommended for New Design

Package Quantity: 1000

RoHS Compliant: Yes

F12005KWBK199

CBL 5COND 12AWG BK 1000=1000'

Volume Production

Package Quantity: 1000

F12005LWBK199

CBL 5COND 12AWG BK 1000=1000'

Volume Production

Package Quantity: 1000

F1206B0R50FSTR

Kyocera

Fuse Chip 0.5A 63V Fast 2-Pin Solder Pad Surface Mount T/R

Volume Production

Current Rating: 500mA

Height: 1.2mm

Lead Free: Lead Free

Length: 3.1mm

+11

F1206B2R00FWTR

Fuse Chip Fast Acting 2A SMD Solder Pad 1206 T/R

1206

Active

F1206A2R00FWTR

Fuse Chip Fast Acting 2A 32V SMD Solder Pad 1206 T/R UL/cUL

1206

NRND

Max Operating Temperature: 125

Min Operating Temperature: -55

Resistance: 0.065

F1206A2R00FSTR

Fuse Chip Fast Acting 2A 32V SMD Solder Pad 1206 T/R UL/cUL

1206

Active

Max Operating Temperature: 125

Min Operating Temperature: -55

F1206A0R25FSTR

Fuse Chip Fast Acting 0.25A 32V SMD Solder Pad 1206 T/R UL/cUL