Search Results for &quot; M24256-BWMN6TP &quot;

256Kb I2C EEPROM, 900ns Access, SOIC, 5V

SOP, SOP8,.25

Active

Access Time: 900ns

Access Time-Max: 450ns

Package/Case: SOIC

Density: 256Kb

+22

M24256-BRDW6P

32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, ROHS COMPLIANT, TSSOP-8

ROHS COMPLIANT, TSSOP-8

Active

Access Time: 900ns

Access Time-Max: 450ns

Package/Case: TSSOP

Density: 256Kb

M24256-DRCS6TG/K

256Kbit I2C EEPROM, 8-Pin WLCSP, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-DRMN6TP

IC EEPROM 256K I2C 1MHZ 8SO

Not Recommended for New Design

Access Time: 450ns

Package/Case: SOIC

Frequency: 1MHz

Max Operating Temperature: 85°C

M24256-BRMC6TP

256Kbit Serial-I2C EEPROM, 32Kx8, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DRCS6TP/K

256Kbit Serial-I2C EEPROM, 32Kx8, 1.8-5.5V, WLCSP, 8-Pin

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-DFDW6TP

256-Kbit serial I2C bus EEPROM

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-DRMC6TP

256Kbit I2C EEPROM, 32Kx8, 8-Pin UFDFPN, 1MHz, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DRMC6TG

256Kbit Serial-I2C EEPROM, 32Kx8, 8-Pin UFDFPN, 1MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DFCS6TG/K

256Kbit Serial-I2C EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-BFMB6TG

IC EEPROM 256K I2C 1MHZ 8UFDFPN

Obsolete

Access Time: 450ns

Access Time-Max: 900ns

Density: 256Kb

Frequency: 1MHz

M24256-BFDW6TP

256 Kbit serial I2C bus EEPROM

TSSOP, TSSOP8,.25

Active

Access Time-Max: 450ns

Package/Case: TSSOP

Density: 256Kb

Frequency: 1MHz

M24256-DRMF3TG/K

256Kbit Serial I2C EEPROM, 1.8-5.5V, 125C, AEC-Q100, SOIC-8

HVSON,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+14

M24256-BRMC6TG

256Kbit Serial-I2C EEPROM, 32Kx8, 2.5-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BRDW6TP

256Kb I2C EEPROM, 450ns, 1MHz, TSSOP, 5V

TSSOP, TSSOP8,.25

Active

Access Time: 450ns

Access Time-Max: 450ns

Package/Case: TSSOP

Density: 256Kb

M24256-BFMC6TP

256Kbit Serial-I2C EEPROM, 32Kx8, 1MHz, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BFMC6TG

256Kbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PDSO

HVSON, SOLCC8,.12,20

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-DFMC6TP

256Kbit Serial-I2C EEPROM, 1MHz, 8-Pin UFDFPN, 1.8-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DRDW3TP/K

256Kbit Serial I2C EEPROM, 1.8-5.5V, 125C, AEC-Q100, S-PDSO-G8

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-DRMN3TP/K

Automotive 256 Kbit serial I2C bus EEPROM

SOP, SOP8,.25

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

Search Results for "M24256-BWMN6TP"

Filters

M24256-BRMN6P

256Kb I2C EEPROM, 900ns Access, SOIC, 5V

SOP, SOP8,.25

Active

Access Time: 900ns

Access Time-Max: 450ns

Package/Case: SOIC

Density: 256Kb

+22

M24256-BRDW6P

32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, ROHS COMPLIANT, TSSOP-8

ROHS COMPLIANT, TSSOP-8

Active

Access Time: 900ns

Access Time-Max: 450ns

Package/Case: TSSOP

Density: 256Kb

M24256-DRCS6TG/K

256Kbit I2C EEPROM, 8-Pin WLCSP, 1MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-DRMN6TP

IC EEPROM 256K I2C 1MHZ 8SO

Not Recommended for New Design

Access Time: 450ns

Package/Case: SOIC

Frequency: 1MHz

Max Operating Temperature: 85°C

M24256-BRMC6TP

256Kbit Serial-I2C EEPROM, 32Kx8, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DRCS6TP/K

256Kbit Serial-I2C EEPROM, 32Kx8, 1.8-5.5V, WLCSP, 8-Pin

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-DFDW6TP

256-Kbit serial I2C bus EEPROM

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-DRMC6TP

256Kbit I2C EEPROM, 32Kx8, 8-Pin UFDFPN, 1MHz, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DRMC6TG

256Kbit Serial-I2C EEPROM, 32Kx8, 8-Pin UFDFPN, 1MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DFCS6TG/K

256Kbit Serial-I2C EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24256-BFMB6TG

IC EEPROM 256K I2C 1MHZ 8UFDFPN

Obsolete

Access Time: 450ns

Access Time-Max: 900ns

Density: 256Kb

Frequency: 1MHz

M24256-BFDW6TP

256 Kbit serial I2C bus EEPROM

TSSOP, TSSOP8,.25

Active

Access Time-Max: 450ns

Package/Case: TSSOP

Density: 256Kb

Frequency: 1MHz

M24256-DRMF3TG/K

256Kbit Serial I2C EEPROM, 1.8-5.5V, 125C, AEC-Q100, SOIC-8

HVSON,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+14

M24256-BRMC6TG

256Kbit Serial-I2C EEPROM, 32Kx8, 2.5-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BRDW6TP

256Kb I2C EEPROM, 450ns, 1MHz, TSSOP, 5V

TSSOP, TSSOP8,.25

Active

Access Time: 450ns

Access Time-Max: 450ns

Package/Case: TSSOP

Density: 256Kb

M24256-BFMC6TP

256Kbit Serial-I2C EEPROM, 32Kx8, 1MHz, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BFMC6TG

256Kbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PDSO

HVSON, SOLCC8,.12,20

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-DFMC6TP

256Kbit Serial-I2C EEPROM, 1MHz, 8-Pin UFDFPN, 1.8-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DRDW3TP/K

256Kbit Serial I2C EEPROM, 1.8-5.5V, 125C, AEC-Q100, S-PDSO-G8

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-DRMN3TP/K

Automotive 256 Kbit serial I2C bus EEPROM

SOP, SOP8,.25

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL