Search Results for &quot; M95320-DFMN6TP &quot;

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95M01-DFDW6TP

1M-bit Serial-SPI EEPROM, 128Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-DFDW6TG

128Kbit Serial-SPI EEPROM, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-DFCS6G/AB

256Kbit EEPROM Serial-SPI 8-Pin WLCSP 1.8-5V 20MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95512-DFCS6TP/K

512Kbit Serial EEPROM, 1.7-5.5V, 5MHz, Industrial, 8-Pin BGA

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M95256-DFDW6TP

Serial SPI EEPROM 256K-bit 32Kx8 1.8-5V 8-Pin TSSOP SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-DFCS6TP/K

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6P/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TG/A

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95640-DFDW6TP

64-Kbit SPI bus EEPROM with high-speed clock

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95040-DFDW6TP

4-Kbit SPI bus EEPROM with high-speed clock

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95M01-DFCT6TP/K

EEPROM Serial-SPI 1M-bit 128K x 8 1.8V/2.5V/3.3V/5V T/R

Unconfirmed

Density: 1Mbit

Interface Type: Serial-SPI

Maximum Operating Frequency: 16MHz

Maximum Access Time: 25ns

+11

M95512-DFDW6TG

512Kbit Serial-SPI EEPROM, 8-Pin TSSOP, 1.8-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-DFDW6TG

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-DFDW6TP

128Kbit SPI EEPROM, 1.8-5V, 8-Pin TSSOP, 5MHz

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-DFCS6TG/K

128Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95M01-DFCS6TP/K

1M-bit Serial-SPI EEPROM, 128Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95512-DFDW6TP

512Kbit Serial Bus EEPROM

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+15

M95640-DFCT6TP/K

64-Kbit SPI bus EEPROM with high-speed clock

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M95080-DFDW6TP

8-Kbit SPI bus EEPROM with high-speed clock

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

Search Results for "M95320-DFMN6TP"

Filters

M95256-DFCS6TG/K

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95M01-DFDW6TP

1M-bit Serial-SPI EEPROM, 128Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-DFDW6TG

128Kbit Serial-SPI EEPROM, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-DFCS6G/AB

256Kbit EEPROM Serial-SPI 8-Pin WLCSP 1.8-5V 20MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95512-DFCS6TP/K

512Kbit Serial EEPROM, 1.7-5.5V, 5MHz, Industrial, 8-Pin BGA

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M95256-DFDW6TP

Serial SPI EEPROM 256K-bit 32Kx8 1.8-5V 8-Pin TSSOP SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-DFCS6TP/K

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6P/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TG/A

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95640-DFDW6TP

64-Kbit SPI bus EEPROM with high-speed clock

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95040-DFDW6TP

4-Kbit SPI bus EEPROM with high-speed clock

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95M01-DFCT6TP/K

EEPROM Serial-SPI 1M-bit 128K x 8 1.8V/2.5V/3.3V/5V T/R

Unconfirmed

Density: 1Mbit

Interface Type: Serial-SPI

Maximum Operating Frequency: 16MHz

Maximum Access Time: 25ns

+11

M95512-DFDW6TG

512Kbit Serial-SPI EEPROM, 8-Pin TSSOP, 1.8-5V

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95256-DFDW6TG

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-DFDW6TP

128Kbit SPI EEPROM, 1.8-5V, 8-Pin TSSOP, 5MHz

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

M95128-DFCS6TG/K

128Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95M01-DFCS6TP/K

1M-bit Serial-SPI EEPROM, 128Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95512-DFDW6TP

512Kbit Serial Bus EEPROM

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+15

M95640-DFCT6TP/K

64-Kbit SPI bus EEPROM with high-speed clock

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M95080-DFDW6TP

8-Kbit SPI bus EEPROM with high-speed clock

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL