Search Results for &quot; MB90024PMT-GS-272 &quot;

Power Relay 12VDC 17A SPST-NO(29x12.7x15.7)mm THT

Through Hole

Active

Contact Arrangement: SPST-NO

Contact Form: 1 Form A

DC Coil Voltage: 12V

Coil Current: 44mA

888H-1CH-F-S IR12VDC

Power Relay 12VDC 17A SPDT(29x12.7x15.7)mm THT

Through Hole

Active

Contact Arrangement: SPDT

Contact Form: 1 Form C

DC Coil Voltage: 12V

Coil Current: 44mA

110-S-78/272-06747

Carling Technologies

TOGGLE SWITCHES UTILIZE A QUICK-MAKE, QUICK-BREAK CONTACT MECHANISM

Active

MPC5200VR400B

32-Bit Microprocessor, 400 MHz, 1.42-1.58V, 0-70°C, BGA-272

27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272

Not Recommended

Max Operating Temperature: 70

Number of Terminals: 272

Min Operating Temperature: 0

Terminal Position: BOTTOM

SPC5200CVR400

32-bit MCU, Power Architecture core, 64KB Flash, 400MHz, -40/+85degC, Automotive Qualified, PBGA 272

BGA,

Transferred

Max Operating Temperature: 85

Number of Terminals: 272

Min Operating Temperature: -40

Terminal Position: BOTTOM

VE-272-EY-S

DC DC CONVERTER 15V 50W

Volume Production

Package/Case: Full Brick

Efficiency: 88%

Features: OVP, OCP, OTP, SCP

Isolation Voltage: 3kV

VI-272-EW-S

DC DC Converter 15V 100W

Volume Production

Package/Case: Full Brick

Efficiency: 88%

Features: OVP, OCP, OTP, SCP

Isolation Voltage: 3kV

VE-272-IX-S

DC DC Converter 15V 75W

Volume Production

Package/Case: Full Brick

Efficiency: 90%

Features: OVP, OCP, OTP, SCP

Isolation Voltage: 3kV

VI-272-EY-S

DC DC Converter 15V 50W

Volume Production

Package/Case: Full Brick

Efficiency: 88%

Features: OVP, OCP, OTP, SCP

Isolation Voltage: 3kV

VI-272-CY-S

DC DC Converter 15V 50W

Volume Production

Package/Case: Full Brick

Efficiency: 90%

Features: OVP, OCP, OTP, SCP

Isolation Voltage: 3kV

VI-272-CW-S

DC DC Converter 15V 100W

Volume Production

Package/Case: Full Brick

Efficiency: 90%

Features: OVP, OCP, OTP, SCP

Isolation Voltage: 3kV

MPC5200CBV400

Microprocessor 32-Bit 400MHz 1.42-1.58V S-PBGA-B272

27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272

Not Recommended

Max Operating Temperature: 85

Number of Terminals: 272

Min Operating Temperature: -40

Terminal Position: BOTTOM

UPD30550AF2-400-NN1-A

NEC

RISC Microprocessor, 64-Bit, 400MHz, MOS, PBGA272, 29 X 29 MM, LEAD FREE, CAVITY DOWN, PLASTIC, BGA-272

BGA,

Transferred

Number of Terminals: 272

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B272

Width: 29

400MHz, MICROPROCESSOR, PBGA272

27 X 27 MM, 1.27 MM PITCH, PLASTIC, TEBGA-272

Not Recommended

Max Operating Temperature: 85

Number of Terminals: 272

Min Operating Temperature: -40

Terminal Position: BOTTOM

LEAD-FREE INDUSTRIAL-QUAL 5200 400MHZ RS

27 X 27 MM, 1.27 MM PITCH, PLASTIC, TEBGA-272

Transferred

Max Operating Temperature: 85

Number of Terminals: 272

Min Operating Temperature: -40

Terminal Position: BOTTOM

5962-0325002VXC

Microchip

160-Pin Quad Flat Pack Field-Programmable Gate Array, 3.3V, MIL-PRF-38535 Class V

MQFP-160

Obsolete

Max Operating Temperature: 125

Number of Terminals: 160

Min Operating Temperature: -55

Terminal Position: QUAD

MTLW-113-07-L-S-272

13-Contact Unshrouded Header, HDR, 2.54mm Pitch, Through Hole Mount

Through Hole

Active

Type: Unshrouded Header

Gender: HDR

Number of Contacts: 13

Terminal Pitch: 2.54mm

MTLW-109-07-L-S-272

9-Contact Unshrouded Header HDR 2.54mm Pitch Through Hole

Through Hole

Active

Type: Unshrouded Header

Gender: HDR

Number of Contacts: 9

Terminal Pitch: 2.54mm

MTMM-110-07-G-S-272

10-Contact Unshrouded Header, HDR, 2mm Pitch, Through Hole Mount

Through Hole

Active

Type: Unshrouded Header

Gender: HDR

Number of Contacts: 10

Terminal Pitch: 2mm

MTLW-109-07-S-S-272

9-Contact Unshrouded Header, HDR, 2.54mm Pitch, Through Hole Mount

Through Hole

Active

Type: Unshrouded Header

Gender: HDR

Number of Contacts: 9

Terminal Pitch: 2.54mm

Account

Search Results for "MB90024PMT-GS-272"

Filters

888H-1AH-F-S IR12VDC

Power Relay 12VDC 17A SPST-NO(29x12.7x15.7)mm THT

Through Hole

Active

Contact Arrangement: SPST-NO

Contact Form: 1 Form A

DC Coil Voltage: 12V

Coil Current: 44mA

888H-1CH-F-S IR12VDC

Power Relay 12VDC 17A SPDT(29x12.7x15.7)mm THT

Through Hole

Active

Contact Arrangement: SPDT

Contact Form: 1 Form C

DC Coil Voltage: 12V

Coil Current: 44mA

110-S-78/272-06747

Carling Technologies

TOGGLE SWITCHES UTILIZE A QUICK-MAKE, QUICK-BREAK CONTACT MECHANISM

Active

MPC5200VR400B

32-Bit Microprocessor, 400 MHz, 1.42-1.58V, 0-70°C, BGA-272

27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272

Not Recommended

Max Operating Temperature: 70

Number of Terminals: 272

Min Operating Temperature: 0

Terminal Position: BOTTOM

SPC5200CVR400

32-bit MCU, Power Architecture core, 64KB Flash, 400MHz, -40/+85degC, Automotive Qualified, PBGA 272

BGA,

Transferred

Max Operating Temperature: 85

Number of Terminals: 272

Min Operating Temperature: -40

Terminal Position: BOTTOM

VE-272-EY-S

DC DC CONVERTER 15V 50W

Volume Production

Package/Case: Full Brick

Efficiency: 88%

Features: OVP, OCP, OTP, SCP

Isolation Voltage: 3kV

VI-272-EW-S

DC DC Converter 15V 100W

Volume Production

Package/Case: Full Brick

Efficiency: 88%

Features: OVP, OCP, OTP, SCP

Isolation Voltage: 3kV

VE-272-IX-S

DC DC Converter 15V 75W

Volume Production

Package/Case: Full Brick

Efficiency: 90%

Features: OVP, OCP, OTP, SCP

Isolation Voltage: 3kV

VI-272-EY-S

DC DC Converter 15V 50W

Volume Production

Package/Case: Full Brick

Efficiency: 88%

Features: OVP, OCP, OTP, SCP

Isolation Voltage: 3kV

VI-272-CY-S

DC DC Converter 15V 50W

Volume Production

Package/Case: Full Brick

Efficiency: 90%

Features: OVP, OCP, OTP, SCP

Isolation Voltage: 3kV

VI-272-CW-S

DC DC Converter 15V 100W

Volume Production

Package/Case: Full Brick

Efficiency: 90%

Features: OVP, OCP, OTP, SCP

Isolation Voltage: 3kV

MPC5200CBV400

Microprocessor 32-Bit 400MHz 1.42-1.58V S-PBGA-B272

27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272

Not Recommended

Max Operating Temperature: 85

Number of Terminals: 272

Min Operating Temperature: -40

Terminal Position: BOTTOM

UPD30550AF2-400-NN1-A

NEC

RISC Microprocessor, 64-Bit, 400MHz, MOS, PBGA272, 29 X 29 MM, LEAD FREE, CAVITY DOWN, PLASTIC, BGA-272

BGA,

Transferred

Number of Terminals: 272

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B272

Width: 29

400MHz, MICROPROCESSOR, PBGA272

27 X 27 MM, 1.27 MM PITCH, PLASTIC, TEBGA-272

Not Recommended

Max Operating Temperature: 85

Number of Terminals: 272

Min Operating Temperature: -40

Terminal Position: BOTTOM

LEAD-FREE INDUSTRIAL-QUAL 5200 400MHZ RS

27 X 27 MM, 1.27 MM PITCH, PLASTIC, TEBGA-272

Transferred

Max Operating Temperature: 85

Number of Terminals: 272

Min Operating Temperature: -40

Terminal Position: BOTTOM

5962-0325002VXC

Microchip

160-Pin Quad Flat Pack Field-Programmable Gate Array, 3.3V, MIL-PRF-38535 Class V

MQFP-160

Obsolete

Max Operating Temperature: 125

Number of Terminals: 160

Min Operating Temperature: -55

Terminal Position: QUAD

MTLW-113-07-L-S-272

13-Contact Unshrouded Header, HDR, 2.54mm Pitch, Through Hole Mount

Through Hole

Active

Type: Unshrouded Header

Gender: HDR

Number of Contacts: 13

Terminal Pitch: 2.54mm

MTLW-109-07-L-S-272

9-Contact Unshrouded Header HDR 2.54mm Pitch Through Hole

Through Hole

Active

Type: Unshrouded Header

Gender: HDR

Number of Contacts: 9

Terminal Pitch: 2.54mm

MTMM-110-07-G-S-272

10-Contact Unshrouded Header, HDR, 2mm Pitch, Through Hole Mount

Through Hole

Active

Type: Unshrouded Header

Gender: HDR

Number of Contacts: 10

Terminal Pitch: 2mm

MTLW-109-07-S-S-272

9-Contact Unshrouded Header, HDR, 2.54mm Pitch, Through Hole Mount