Inductor High Frequency Chip Multi-Layer 0.12uH 5% 50MHz 8Q-Factor Ceramic 0.3A 1.2Ohm DCR 0603 T/R
Inductor High Frequency Chip Multi-Layer 0.018uH 5% 100MHz 12Q-Factor Ceramic 0.3A 0.35Ohm DCR 0603 T/R
Inductor High Frequency Chip Multi-Layer 0.15uH 10% 50MHz 8Q-Factor Ceramic 0.3A 1.2Ohm DCR 0603 T/R
Inductor High Frequency Chip Multi-Layer 0.15uH 10% 50MHz 13Q-Factor Ceramic 0.3A 1Ohm DCR 0805 T/R
Inductor High Frequency Chip Multi-Layer 0.0082uH 5% 100MHz 10Q-Factor Ceramic 0.3A 0.24Ohm DCR 0603 T/R

Labels and Industrial Warning Signs CIRCLE 1/2" CAL Sold by Pack of 200
Inductor High Frequency Chip Multi-Layer 0.39uH 5% 50MHz 10Q-Factor Ceramic 0.3A 1.4Ohm DCR 0805 T/R
Inductor High Frequency Chip Multi-Layer 0.01uH 5% 100MHz 8Q-Factor Ceramic 0.3A 0.31Ohm DCR 0402 T/R
Inductor High Frequency Chip Multi-Layer 0.0068uH 5% 100MHz 10Q-Factor Ceramic 0.3A 0.22Ohm DCR 0603 T/R

GAP PAD VO, .080, 4X4 SHEET; Insulator Body Material:Gap Pad VO; Thermal Conductivity:0.8W/m.K; Breakdown Voltage Vbr:6kV; SVHC:No SVHC (17-Dec-2015); Thickness:2mm; Volume Resistivity:100000Mohm-m; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; Dielectric Constant:5.5; Electrical Property Ins / Con:Insulative; External Depth:2mm; External Length / Height:100mm; External Width:100mm; Length:100mm; Material:Gap Pad VO; Operating Temperature Max:200°C; Operating Temperature Min:-60°C; Operating Temperature Range:-60°C to +200°C; Overall Width:100mm; Thermal Conductivity (Cal/cm³/K):0.8Cal/cm³/K; Type:Thermal Pad