Search Results for &quot; LPC11U24FHI33301, &quot;

32-bit ARM Cortex M0 MCU, 32KB Flash, 16-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

LPC1110FD20

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PDSO20, 7.50 MM HEIGHT, PLASTIC, SOT163-1, MS-013, SOP-20, Microcontroller

SOP, SOP20,.4

Active

Package/Case: SOT-163-1

Core Architecture: ARM

Frequency: 50MHz

Interface: I2C, SPI, UART

+15

LPC1102UK,118

32-bit ARM Cortex-M0 MCU, 50MHz, 32KB Flash, 8KB SRAM, SPI, UART

VFBGA, BGA16,4X4,20

Active

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

Interface: SPI, UART, USART

+24

LPC1101LVUK

IC RISC MICROCONTROLLER, Microcontroller

VFBGA,

Active

Number of Terminals: 25

Terminal Position: BOTTOM

Width: 2.17

Length: 2.32

+13

KSK-LPC11A14-JL

IAR Systems

IAR KICKSTART LPC11A14 EVAL BRD

Volume Production

Core Architecture: ARM

Evaluation Kit: Yes

Series: LPC11A00

LPC11A04UK,118

32-bit ARM Cortex M0 MCU, 32KB Flash, 20-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

+40

LPC1102LVUKZ

32-bit ARM Cortex M0 MCU, 32KB Flash, 25-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

LPC1101LVUKZ

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 25-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

LPC11A02UK,118

32b ARM MCU, 50MHz, 16KB Flash, 4KB SRAM, 18 I/O, WLCSP

VFBGA, BGA20,4X5,20

Active

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

Interface: I2C, SPI, SSP, UART, USART

+24

LPC1114FA44/301

MCU 32-bit ARM Cortex M0 50MHz 32KB Flash 44-Pin PLCC SMT

Lead-Frame SMT

Unconfirmed

Basic Package Type: Lead-Frame SMT

Package Family Name: LCC

Package/Case: PLCC

Package Description: Plastic Leaded Chip Carrier

+38

LPC11E67JBD64

32-bit RISC MCU, 25MHz, 64-Pin PQFP, Industrial

LQFP-64

Active

Max Operating Temperature: 105

Number of Terminals: 64

Min Operating Temperature: -40

Terminal Position: QUAD

+21

LPC1112FD20/102

32-Bit RISC MCU, 50MHz, 16 I/O, FLASH, ADC, PDSO-20

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 20

Min Operating Temperature: -40

Terminal Position: DUAL

+20

LPC1114FN28/102

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PDIP28, PLASTIC, SOT117-1, MO-015, DIP-28, Microcontroller

DIP, DIP28,.6

Active

Package/Case: SOT-117-1

Number of ADC Channels: 6

Number of Bits: 32

Number of GPIO: 22

Volume Production

32-bit ARM Cortex M0 MCU, 4KB Flash, 50MHz, 20-Pin SO

Surface Mount

Active

Package/Case: SO

Pin Count: 20

PCB: 20

Package Length (mm): 13(Max)

+30

LPC11E68JBD64

32-Bit RISC MCU, 25MHz, 64-Pin PQFP, Industrial

LQFP-64

Active

Max Operating Temperature: 105

Number of Terminals: 64

Min Operating Temperature: -40

Terminal Position: QUAD

+21

LPC1112FHN24/202

32-bit ARM Cortex M0 MCU, 16KB Flash, 24-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

+38

LPC1114FDH28/102:5

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 28-Pin TSSOP

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

LPC1114FHI33/303,5

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 8KB RAM, 32-Pin HVQFN

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1111FHN33/103,5

32-bit ARM Cortex M0 MCU, 8KB Flash, 32-Pin HVQFN