Search Results for &quot; LPC11U37FBD64401, &quot;

32-Bit RISC MCU, FLASH, 50MHz, 48-Pin LQFP, Industrial

LFQFP,

Active

Max Operating Temperature: 85

Number of Terminals: 48

Min Operating Temperature: -40

Terminal Position: QUAD

LPC1114FHN33/301:5

LPC1114FHN33 - 32kB flash, 8kB SRAM, HVQFN32 package QFN 32-Pin

HVQCCN, LCC32,.27SQ,25

Active

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, UART, USART

Lead Free: Lead Free

+16

LPC1112FDH28/102:5

MCU 32BIT ARM 16KB FLASH 28TSSOP

Volume Production

Package/Case: TSSOP

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

+14

LPC1112FDH20/102:5

MCU 32BIT ARM 16KB FLASH 20TSSOP

Volume Production

Package/Case: TSSOP

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

+13

LPC1111FDH20/002

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PDSO20, 4.40 MM HEIGHT, PLASTIC, SOT360-1, MO-153, TSSOP-20, Microcontroller

TSSOP,

Active

Package/Case: SOT-360-1

Number of ADC Channels: 5

Number of GPIO: 16

Number of Timers/Counters: 4

LPC1112FHN24/202

32-bit ARM Cortex M0 MCU, 16KB Flash, 24-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

+38

LPC1114FDH28/102:5

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 28-Pin TSSOP

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

LPC1114FHI33/303,5

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 8KB RAM, 32-Pin HVQFN

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1111FHN33/201,5

32-bit ARM Cortex M0 MCU, 50MHz, 8KB Flash, 32-Pin HVQFN

Surface Mount

Active

Package/Case: HVQFN EP

Pin Count: 32

PCB: 32

Package Length (mm): 7

LPC1111FHN33/103,5

32-bit ARM Cortex M0 MCU, 8KB Flash, 32-Pin HVQFN

Surface Mount

Active

Package/Case: HVQFN EP

Pin Count: 32

PCB: 32

Package Length (mm): 7

LPC1114FBD48/301,1

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 8KB RAM, LQFP-48

Surface Mount

Active

Package/Case: LQFP

Pin Count: 48

PCB: 48

Package Length (mm): 7.1(Max)

LPC1114FBD48/302,1

32-bit ARM MCU, 50MHz, 32KB Flash, 8KB RAM, LQFP48

QFP, QFP48,.35SQ,20

Active

Package/Case: LQFP

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

LPC1113FBD48/301,1

32-bit ARM Cortex M0 MCU, 50MHz, 24KB Flash, 48-Pin LQFP

Surface Mount

Active

Package/Case: LQFP

Pin Count: 48

PCB: 48

Package Length (mm): 7.1(Max)

LPC1112FHN33/201,5

32-bit ARM Cortex M0 MCU, 50MHz, 16KB Flash, 32-Pin HVQFN

Surface Mount

Active

Package/Case: HVQFN EP

Pin Count: 32

PCB: 32

Package Length (mm): 7

LPC1112FD20/102,52

32-bit ARM Cortex M0 MCU, 50MHz, 16KB Flash, 4KB RAM, 20-Pin SO

Surface Mount

Active

Package/Case: SO

Pin Count: 20

PCB: 20

Package Length (mm): 13(Max)

LPC1111FHN33/202,5

32-bit ARM Cortex-M0 MCU, 50MHz, 8KB Flash, 3.3V, 32-Pin HVQFN

Volume Production

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

Height: 1mm

+27

LPC1114FHN33/202,5

32-bit ARM MCU, 50MHz, 32KB Flash, 4KB RAM, HVQFN32

HVQCCN, LCC32,.27SQ,25

Active

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

Height: 1mm

+26

LPC11E68JBD64E

32-bit ARM Cortex-M0+ MCU, 50MHz, 256KB Flash, 36KB RAM, LQFP64

QFP, QFP64,.47SQ,20

Active

Package/Case: LQFP

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

+25

LPC1111FHN33/102'5

32-bit ARM Cortex-M0 MCU, 50MHz, 8KB Flash, 3.3V, HVQFN

Volume Production

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

Interface: I2C, SPI, UART, USART

LPC1112FHN33/203

32-Bit RISC MCU, 50MHz, Flash, 1.8-3.6V, 33-Pin, Industrial

HVQCCN,

Active

Max Operating Temperature: 85

Number of Terminals: 33

Min Operating Temperature: -40

Terminal Position: QUAD

Search Results for "LPC11U37FBD64401,"

Filters

LPC1114FBD48/333

32-Bit RISC MCU, FLASH, 50MHz, 48-Pin LQFP, Industrial

LFQFP,

Active

Max Operating Temperature: 85

Number of Terminals: 48

Min Operating Temperature: -40

Terminal Position: QUAD

LPC1114FHN33/301:5

LPC1114FHN33 - 32kB flash, 8kB SRAM, HVQFN32 package QFN 32-Pin

HVQCCN, LCC32,.27SQ,25

Active

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, UART, USART

Lead Free: Lead Free

+16

LPC1112FDH28/102:5

MCU 32BIT ARM 16KB FLASH 28TSSOP

Volume Production

Package/Case: TSSOP

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

+14

LPC1112FDH20/102:5

MCU 32BIT ARM 16KB FLASH 20TSSOP

Volume Production

Package/Case: TSSOP

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

+13

LPC1111FDH20/002

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PDSO20, 4.40 MM HEIGHT, PLASTIC, SOT360-1, MO-153, TSSOP-20, Microcontroller

TSSOP,

Active

Package/Case: SOT-360-1

Number of ADC Channels: 5

Number of GPIO: 16

Number of Timers/Counters: 4

LPC1112FHN24/202

32-bit ARM Cortex M0 MCU, 16KB Flash, 24-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

+38

LPC1114FDH28/102:5

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 28-Pin TSSOP

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

LPC1114FHI33/303,5

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 8KB RAM, 32-Pin HVQFN

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1111FHN33/201,5

32-bit ARM Cortex M0 MCU, 50MHz, 8KB Flash, 32-Pin HVQFN

Surface Mount

Active

Package/Case: HVQFN EP

Pin Count: 32

PCB: 32

Package Length (mm): 7

LPC1111FHN33/103,5

32-bit ARM Cortex M0 MCU, 8KB Flash, 32-Pin HVQFN

Surface Mount

Active

Package/Case: HVQFN EP

Pin Count: 32

PCB: 32

Package Length (mm): 7

LPC1114FBD48/301,1

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 8KB RAM, LQFP-48

Surface Mount

Active

Package/Case: LQFP

Pin Count: 48

PCB: 48

Package Length (mm): 7.1(Max)

LPC1114FBD48/302,1

32-bit ARM MCU, 50MHz, 32KB Flash, 8KB RAM, LQFP48

QFP, QFP48,.35SQ,20

Active

Package/Case: LQFP

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

LPC1113FBD48/301,1

32-bit ARM Cortex M0 MCU, 50MHz, 24KB Flash, 48-Pin LQFP

Surface Mount

Active

Package/Case: LQFP

Pin Count: 48

PCB: 48

Package Length (mm): 7.1(Max)

LPC1112FHN33/201,5

32-bit ARM Cortex M0 MCU, 50MHz, 16KB Flash, 32-Pin HVQFN

Surface Mount

Active

Package/Case: HVQFN EP

Pin Count: 32

PCB: 32

Package Length (mm): 7

LPC1112FD20/102,52

32-bit ARM Cortex M0 MCU, 50MHz, 16KB Flash, 4KB RAM, 20-Pin SO

Surface Mount

Active

Package/Case: SO

Pin Count: 20

PCB: 20

Package Length (mm): 13(Max)

LPC1111FHN33/202,5

32-bit ARM Cortex-M0 MCU, 50MHz, 8KB Flash, 3.3V, 32-Pin HVQFN

Volume Production

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

Height: 1mm

+27

LPC1114FHN33/202,5

32-bit ARM MCU, 50MHz, 32KB Flash, 4KB RAM, HVQFN32

HVQCCN, LCC32,.27SQ,25

Active

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

Height: 1mm

+26

LPC11E68JBD64E

32-bit ARM Cortex-M0+ MCU, 50MHz, 256KB Flash, 36KB RAM, LQFP64

QFP, QFP64,.47SQ,20

Active

Package/Case: LQFP

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

+25

LPC1111FHN33/102'5

32-bit ARM Cortex-M0 MCU, 50MHz, 8KB Flash, 3.3V, HVQFN

Volume Production

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

Interface: I2C, SPI, UART, USART

LPC1112FHN33/203

32-Bit RISC MCU, 50MHz, Flash, 1.8-3.6V, 33-Pin, Industrial

HVQCCN,

Active

Max Operating Temperature: 85

Number of Terminals: 33

Min Operating Temperature: -40

Terminal Position: QUAD