Search Results for &quot; M24264 &quot;

32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+16

M24256-BWMN6G/K

32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-BWMN6P

256Kb I2C EEPROM, 900ns Access, SOIC, 5.5V

SOP, SOP8,.25

Not Recommended

Access Time: 900ns

Access Time-Max: 450ns

Package/Case: SOIC

Density: 256Kb

+26

M24256-BWMC6G

256Kbit Serial-I2C EEPROM, 3.3V/5V, 8-Pin UFDFPN EP

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BWMN6T

32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8

SOP, SOP8,.25

Obsolete

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 256Kb

+17

M24256-BRMC6P

256Kbit EEPROM, Serial-I2C, 8-Pin UFDFPN, 2.5-5V, 1MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DRMC6G

256Kbit I2C EEPROM, 32Kx8, 8-Pin UFDFPN, 1MHz, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BWMN6TP

256Kb I2C EEPROM, SOIC, 400kHz, 5.5V

SOP, SOP8,.25

Not Recommended

Access Time: 900ns

Access Time-Max: 450ns

Package/Case: SOIC

Density: 256Kb

M24256-BRMC6TP

256Kbit Serial-I2C EEPROM, 32Kx8, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BWMC6TP

256Kbit I2C EEPROM, 32Kx8, 3.3V/5V, 8-Pin UFDFPN SMT

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DRCS6TP/K

256Kbit Serial-I2C EEPROM, 32Kx8, 1.8-5.5V, WLCSP, 8-Pin

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

+24

M24256-DFDW6TP

256-Kbit serial I<sup>2</sup>C bus EEPROM

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-BRMC6TG

256Kbit Serial-I2C EEPROM, 32Kx8, 2.5-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BRDW6TP

256Kb I2C EEPROM, 450ns, 1MHz, TSSOP, 5V

TSSOP, TSSOP8,.25

Active

Access Time: 450ns

Access Time-Max: 450ns

Package/Case: TSSOP

Density: 256Kb

M24256-BFMC6TP

256Kbit Serial-I2C EEPROM, 32Kx8, 1MHz, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BWDW6TP

256Kb I2C EEPROM, 450ns, 1MHz, TSSOP, 5.5V

ROHS COMPLIANT, TSSOP-8

Not Recommended

Access Time: 450ns

Access Time-Max: 450ns

Package/Case: TSSOP

Density: 256Kb

+22

M24256-BWMW6TG

256Kb EEPROM IC, I2C, 1MHz, 8SO, 5V, 85C

Obsolete

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 256Kb

+20

M24256-BWMN6TP/K

32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

SOP, SOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-BFMC6TG

256Kbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PDSO

HVSON, SOLCC8,.12,20

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-DFMC6TP

256Kbit Serial-I2C EEPROM, 1MHz, 8-Pin UFDFPN, 1.8-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

Search Results for "M24264"

Filters

M24256-BRMN6G

32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+16

M24256-BWMN6G/K

32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Obsolete

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-BWMN6P

256Kb I2C EEPROM, 900ns Access, SOIC, 5.5V

SOP, SOP8,.25

Not Recommended

Access Time: 900ns

Access Time-Max: 450ns

Package/Case: SOIC

Density: 256Kb

+26

M24256-BWMC6G

256Kbit Serial-I2C EEPROM, 3.3V/5V, 8-Pin UFDFPN EP

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BWMN6T

32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8

SOP, SOP8,.25

Obsolete

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 256Kb

+17

M24256-BRMC6P

256Kbit EEPROM, Serial-I2C, 8-Pin UFDFPN, 2.5-5V, 1MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DRMC6G

256Kbit I2C EEPROM, 32Kx8, 8-Pin UFDFPN, 1MHz, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BWMN6TP

256Kb I2C EEPROM, SOIC, 400kHz, 5.5V

SOP, SOP8,.25

Not Recommended

Access Time: 900ns

Access Time-Max: 450ns

Package/Case: SOIC

Density: 256Kb

M24256-BRMC6TP

256Kbit Serial-I2C EEPROM, 32Kx8, 8-Pin UFDFPN, 2.5-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BWMC6TP

256Kbit I2C EEPROM, 32Kx8, 3.3V/5V, 8-Pin UFDFPN SMT

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-DRCS6TP/K

256Kbit Serial-I2C EEPROM, 32Kx8, 1.8-5.5V, WLCSP, 8-Pin

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

+24

M24256-DFDW6TP

256-Kbit serial I<sup>2</sup>C bus EEPROM

TSSOP, TSSOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-BRMC6TG

256Kbit Serial-I2C EEPROM, 32Kx8, 2.5-5V, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BRDW6TP

256Kb I2C EEPROM, 450ns, 1MHz, TSSOP, 5V

TSSOP, TSSOP8,.25

Active

Access Time: 450ns

Access Time-Max: 450ns

Package/Case: TSSOP

Density: 256Kb

M24256-BFMC6TP

256Kbit Serial-I2C EEPROM, 32Kx8, 1MHz, 8-Pin UFDFPN

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M24256-BWDW6TP

256Kb I2C EEPROM, 450ns, 1MHz, TSSOP, 5.5V

ROHS COMPLIANT, TSSOP-8

Not Recommended

Access Time: 450ns

Access Time-Max: 450ns

Package/Case: TSSOP

Density: 256Kb

+22

M24256-BWMW6TG

256Kb EEPROM IC, I2C, 1MHz, 8SO, 5V, 85C

Obsolete

Access Time: 450ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 256Kb

+20

M24256-BWMN6TP/K

32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

SOP, SOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-BFMC6TG

256Kbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PDSO

HVSON, SOLCC8,.12,20

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24256-DFMC6TP

256Kbit Serial-I2C EEPROM, 1MHz, 8-Pin UFDFPN, 1.8-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad