Search Results for &quot; M95160-DFDW6TP &quot;

256Kbit EEPROM Serial-SPI 8-Pin WLCSP 1.8-5V 20MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95512-DFMN6TP

512Kbit Serial Bus EEPROM

SOP, SOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+15

M95512-DFCS6TP/K

512Kbit Serial EEPROM, 1.7-5.5V, 5MHz, Industrial, 8-Pin BGA

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M95M01-DFCS6TP/K

1M-bit Serial-SPI EEPROM, 128Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95640-DFCT6TP/K

64-Kbit SPI bus EEPROM with high-speed clock

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M95320-DFMC6TG

32-Kbit SPI bus EEPROM with high-speed clock

SON, SOLCC8,.11,20

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFMN6TP

Serial SPI EEPROM 256Kbit 32Kx8 1.8-5V SOIC-8

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

+26

M95256-DFMC6TG

256Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 20MHz

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95256-DFCS6TP/K

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6P/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TG/A

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95640-DFMN6TP

64-Kbit SPI bus EEPROM with high-speed clock

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95080-DFMN6TP

8-Kbit SPI bus EEPROM with high-speed clock

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95640-DFMC6TG

64-Kbit SPI bus EEPROM with high-speed clock

HVSON,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95M01-DFCT6TP/K

EEPROM Serial-SPI 1M-bit 128K x 8 1.8V/2.5V/3.3V/5V T/R

Unconfirmed

Density: 1Mbit

Interface Type: Serial-SPI

Maximum Operating Frequency: 16MHz

Maximum Access Time: 25ns

+11

M95320-DFMN6TP

32-Kbit SPI bus EEPROM with high-speed clock

SOP, SOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFCS6TP/AB

256Kbit Serial-SPI EEPROM, 32Kx8, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

DFD-104P

EMI Filter LC-Circuit 2A 50VDC PC Pins Thru-Hole

Through Hole

Active

Termination Style: PC Pins

Mounting: Through Hole

Product Length (mm): 11

Product Depth (mm): 11

DFD-104S

EMI Filter LC-Circuit 2A 50VDC PC Pins Thru-Hole

Through Hole

Active

Termination Style: PC Pins

Mounting: Through Hole

Product Length (mm): 16

Product Depth (mm): 11

M95256-DFCS6TG/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

Search Results for "M95160-DFDW6TP"

Filters

M95256-DFCS6G/AB

256Kbit EEPROM Serial-SPI 8-Pin WLCSP 1.8-5V 20MHz

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95512-DFMN6TP

512Kbit Serial Bus EEPROM

SOP, SOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+15

M95512-DFCS6TP/K

512Kbit Serial EEPROM, 1.7-5.5V, 5MHz, Industrial, 8-Pin BGA

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M95M01-DFCS6TP/K

1M-bit Serial-SPI EEPROM, 128Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95640-DFCT6TP/K

64-Kbit SPI bus EEPROM with high-speed clock

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M95320-DFMC6TG

32-Kbit SPI bus EEPROM with high-speed clock

SON, SOLCC8,.11,20

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFMN6TP

Serial SPI EEPROM 256Kbit 32Kx8 1.8-5V SOIC-8

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

+26

M95256-DFMC6TG

256Kbit Serial-SPI EEPROM, 8-Pin UFDFPN, 20MHz

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95256-DFCS6TP/K

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6P/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TG/A

256Kbit Serial-SPI EEPROM, 32Kx8, 1.8-5V, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95640-DFMN6TP

64-Kbit SPI bus EEPROM with high-speed clock

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95080-DFMN6TP

8-Kbit SPI bus EEPROM with high-speed clock

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95640-DFMC6TG

64-Kbit SPI bus EEPROM with high-speed clock

HVSON,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95M01-DFCT6TP/K

EEPROM Serial-SPI 1M-bit 128K x 8 1.8V/2.5V/3.3V/5V T/R

Unconfirmed

Density: 1Mbit

Interface Type: Serial-SPI

Maximum Operating Frequency: 16MHz

Maximum Access Time: 25ns

+11

M95320-DFMN6TP

32-Kbit SPI bus EEPROM with high-speed clock

SOP, SOP8,.25

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95256-DFCS6TP/AB

256Kbit Serial-SPI EEPROM, 32Kx8, 8-Pin WLCSP

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

DFD-104P

EMI Filter LC-Circuit 2A 50VDC PC Pins Thru-Hole

Through Hole

Active

Termination Style: PC Pins

Mounting: Through Hole

Product Length (mm): 11

Product Depth (mm): 11

DFD-104S

EMI Filter LC-Circuit 2A 50VDC PC Pins Thru-Hole

Through Hole

Active

Termination Style: PC Pins

Mounting: Through Hole

Product Length (mm): 16

Product Depth (mm): 11

M95256-DFCS6TG/AB

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package