Microprocessor, 32-Bit, 30MHz, 32-Bit External Data Bus, 13-Bit Address Bus, 236-Pin MAPBGA
Field Programmable Gate Array, 2600 CLBs, 1098MHz, 33280-Cell, CMOS, PBGA236, BGA-236
41-Contact Shrouded Surface Mount Header, 2-Row, 1mm Pitch, -55°C to 125°C
Trans GP BJT PNP 50V 0.5A 3-Pin S-Mini T/R
Field Programmable Gate Array, 236-Pin S-PBGA-B236, Industrial Temperature, 1.05V Supply
FPGA 1300 CLB PBGA236 0-85°C 0.95-1.05V
Xilinx XC7A15T-L1CPG236I Field Programmable Gate Array, 100°C, 1098 MHz, 250 I/O
Field Programmable Gate Array, 2600 CLBs, PBGA236, BGA-236
Conn Board Stacker HDR 3 POS 2.54mm Solder ST Thru-Hole
Conn Board Stacker HDR 4 POS 2.54mm Solder ST Top Entry Thru-Hole
Conn Board Stacker HDR 2 POS 2.54mm Solder ST Top Entry Thru-Hole
Conn Board Stacker HDR 2 POS 2.54mm Solder ST Top Entry Thru-Hole Bulk
Conn Board Stacker HDR 8 POS 1.27mm Solder ST Thru-Hole
4-Position 2.54mm Pitch Shrouded Header, Through Hole Mount, Gold Contact Plating
Conn Board Stacker HDR 50 POS 2.54mm Solder ST Thru-Hole
9-Position Through Hole Shrouded Header, 1.27mm Pitch, Gold Contact Plating
50-Position Through Hole Shrouded Header, Black Tin Plated, 2.54mm Pitch
8-Position 2.54mm Pitch Through-Hole Header, Black Tin Plated Contacts
2-Position 2-Contact Shrouded Header, Through Hole Mount, 2.54mm Pitch
12-Position 2-Row Through-Hole Header, 12 Contacts, 2.54mm Pitch, Gold Contact Plating
